公开(公告)号：US11968795B2

公开(公告)日：2024-04-23

申请号：US18299597

申请日：2023-04-12

Applicant: Google LLC

Inventor： Laurie Man Sum Kwan ,  Cindy Ngoc-Tran Au ,  Timothy Michael Vanderet ,  Cheng-jung Lee

IPC: H05K7/14 ,  F16M11/04 ,  F16M11/14 ,  F16M13/02 ,  G03B17/56 ,  G08B13/196 ,  H01Q1/24 ,  H01Q9/04 ,  H04N23/51 ,  H04N23/52 ,  H04N23/54 ,  H04N23/57 ,  H05K7/20

CPC classification number: H05K7/1417 ,  F16M11/041 ,  F16M11/14 ,  F16M13/02 ,  F16M13/022 ,  F16M13/027 ,  G03B17/561 ,  G08B13/19617 ,  H01Q1/24 ,  H01Q9/0407 ,  H04N23/51 ,  H04N23/52 ,  H04N23/54 ,  H04N23/57 ,  H05K7/2039 ,  G08B13/19654

Abstract: The present document describes an electronic device with a structural midframe and associated methods. The architectural design of the electronic device (e.g., a security camera) is such that its components are assembled onto the midframe to form a subassembly and the housing is assembled after the subassembly. The midframe includes various features that enable multiple printed circuit boards, a camera subassembly, a front housing member, a heatsink, and a heat spreader to be assembled onto the midframe outside of the housing. The midframe can also include a hinge-bearing surface forming a portion of a ball joint for supporting rotational movement of the electronic device. Accordingly, the electronic device uses the midframe, rather than the housing, as a structural member.

公开(公告)号：US20230262918A1

公开(公告)日：2023-08-17

申请号：US18299597

申请日：2023-04-12

Applicant: Google LLC

Inventor： Laurie Man Sum Kwan ,  Cindy Ngoc-Tran Au ,  Timothy Michael Vanderet ,  Cheng-jung Lee

IPC: H05K7/14 ,  H01Q1/24 ,  H01Q9/04 ,  H05K7/20 ,  F16M11/14 ,  F16M13/02 ,  G03B17/56 ,  F16M11/04 ,  H04N23/51 ,  H04N23/52 ,  H04N23/54 ,  H04N23/57 ,  G08B13/196

CPC classification number: H05K7/1417 ,  H01Q1/24 ,  H01Q9/0407 ,  H05K7/2039 ,  F16M11/14 ,  F16M13/02 ,  F16M13/022 ,  F16M13/027 ,  G03B17/561 ,  F16M11/041 ,  H04N23/51 ,  H04N23/52 ,  H04N23/54 ,  H04N23/57 ,  G08B13/19617 ,  G08B13/19654

Abstract: The present document describes an electronic device with a structural midframe and associated methods. The architectural design of the electronic device (e.g., a security camera) is such that its components are assembled onto the midframe to form a subassembly and the housing is assembled after the subassembly. The midframe includes various features that enable multiple printed circuit boards, a camera subassembly, a front housing member, a heatsink, and a heat spreader to be assembled onto the midframe outside of the housing. The midframe can also include a hinge-bearing surface forming a portion of a ball joint for supporting rotational movement of the electronic device. Accordingly, the electronic device uses the midframe, rather than the housing, as a structural member.

公开(公告)号：US11659677B2

公开(公告)日：2023-05-23

申请号：US17026883

申请日：2020-09-21

Applicant: Google LLC

Inventor： Laurie Man Sum Kwan ,  Cindy Ngoc-Tran Au ,  Timothy Michael Vanderet ,  Cheng-jung Lee

IPC: H05K7/14 ,  H05K7/20 ,  H04N23/51 ,  H04N23/52 ,  H04N23/54 ,  H04N23/57 ,  F16M11/04 ,  F16M11/14 ,  F16M13/02 ,  G03B17/56 ,  G08B13/196 ,  H01Q1/24 ,  H01Q9/04

CPC classification number: H05K7/1417 ,  F16M11/041 ,  F16M11/14 ,  F16M13/02 ,  F16M13/022 ,  F16M13/027 ,  G03B17/561 ,  G08B13/19617 ,  H01Q1/24 ,  H01Q9/0407 ,  H04N23/51 ,  H04N23/52 ,  H04N23/54 ,  H04N23/57 ,  H05K7/2039 ,  G08B13/19654

Abstract: The present document describes an electronic device with a structural midframe and associated methods. The architectural design of the electronic device (e.g., a security camera) is such that its components are assembled onto the midframe to form a subassembly and the housing is assembled after the subassembly. The midframe includes various features that enable multiple printed circuit boards, a camera subassembly, a front housing member, a heatsink, and a heat spreader to be assembled onto the midframe outside of the housing. The midframe can also include a hinge-bearing surface forming a portion of a ball joint for supporting rotational movement of the electronic device. Accordingly, the electronic device uses the midframe, rather than the housing, as a structural member.

公开(公告)号：US20220095472A1

公开(公告)日：2022-03-24

申请号：US17026883

申请日：2020-09-21

Applicant: Google LLC

Inventor： Laurie Man Sum Kwan ,  Cindy Ngoc-Tran Au ,  Timothy Michael Vanderet ,  Cheng-jung Lee

IPC: H05K7/14 ,  H05K7/20 ,  H04N5/225 ,  H01Q9/04 ,  H01Q1/24

Abstract: The present document describes an electronic device with a structural midframe and associated methods. The architectural design of the electronic device (e.g., a security camera) is such that its components are assembled onto the midframe to form a subassembly and the housing is assembled after the subassembly. The midframe includes various features that enable multiple printed circuit boards, a camera subassembly, a front housing member, a heatsink, and a heat spreader to be assembled onto the midframe outside of the housing. The midframe can also include a hinge-bearing surface forming a portion of a ball joint for supporting rotational movement of the electronic device. Accordingly, the electronic device uses the midframe, rather than the housing, as a structural member.