公开(公告)号：US11494026B2

公开(公告)日：2022-11-08

申请号：US17362469

申请日：2021-06-29

Applicant: Google LLC

Inventor： Justin Richard Wodrich ,  Timothy Michael Vanderet ,  Daniel David Sachs ,  Jung Geun Tak ,  Laurie Kwan

IPC: G06F3/041 ,  G06F3/16

Abstract: Techniques and apparatuses are described that implement touch sensors and electronic devices including touch sensors. In some implementations, the touch sensor includes a sensing portion and a contact portion extending from the sensing portion. While the sensing portion is configured to be placed in proximity to an interior surface of a housing of an electronic device to detect a touch on the housing, the contact portion is bent to electrically couple the sensing portion to a circuit board via two distinct electrical paths.

公开(公告)号：US20210325994A1

公开(公告)日：2021-10-21

申请号：US17362469

申请日：2021-06-29

Applicant: Google LLC

Inventor： Justin Richard Wodrich ,  Timothy Michael Vanderet ,  Daniel David Sachs ,  Jung Geun Tak ,  Laurie Kwan

IPC: G06F3/041

Abstract: Techniques and apparatuses are described that implement touch sensors and electronic devices including touch sensors. In some implementations, the touch sensor includes a sensing portion and a contact portion extending from the sensing portion. While the sensing portion is configured to be placed in proximity to an interior surface of a housing of an electronic device to detect a touch on the housing, the contact portion is bent to electrically couple the sensing portion to a circuit board via two distinct electrical paths.

公开(公告)号：US20230262918A1

公开(公告)日：2023-08-17

申请号：US18299597

申请日：2023-04-12

Applicant: Google LLC

Inventor： Laurie Man Sum Kwan ,  Cindy Ngoc-Tran Au ,  Timothy Michael Vanderet ,  Cheng-jung Lee

IPC: H05K7/14 ,  H01Q1/24 ,  H01Q9/04 ,  H05K7/20 ,  F16M11/14 ,  F16M13/02 ,  G03B17/56 ,  F16M11/04 ,  H04N23/51 ,  H04N23/52 ,  H04N23/54 ,  H04N23/57 ,  G08B13/196

CPC classification number: H05K7/1417 ,  H01Q1/24 ,  H01Q9/0407 ,  H05K7/2039 ,  F16M11/14 ,  F16M13/02 ,  F16M13/022 ,  F16M13/027 ,  G03B17/561 ,  F16M11/041 ,  H04N23/51 ,  H04N23/52 ,  H04N23/54 ,  H04N23/57 ,  G08B13/19617 ,  G08B13/19654

Abstract: The present document describes an electronic device with a structural midframe and associated methods. The architectural design of the electronic device (e.g., a security camera) is such that its components are assembled onto the midframe to form a subassembly and the housing is assembled after the subassembly. The midframe includes various features that enable multiple printed circuit boards, a camera subassembly, a front housing member, a heatsink, and a heat spreader to be assembled onto the midframe outside of the housing. The midframe can also include a hinge-bearing surface forming a portion of a ball joint for supporting rotational movement of the electronic device. Accordingly, the electronic device uses the midframe, rather than the housing, as a structural member.

公开(公告)号：US11659677B2

公开(公告)日：2023-05-23

申请号：US17026883

申请日：2020-09-21

Applicant: Google LLC

Inventor： Laurie Man Sum Kwan ,  Cindy Ngoc-Tran Au ,  Timothy Michael Vanderet ,  Cheng-jung Lee

IPC: H05K7/14 ,  H05K7/20 ,  H04N23/51 ,  H04N23/52 ,  H04N23/54 ,  H04N23/57 ,  F16M11/04 ,  F16M11/14 ,  F16M13/02 ,  G03B17/56 ,  G08B13/196 ,  H01Q1/24 ,  H01Q9/04

CPC classification number: H05K7/1417 ,  F16M11/041 ,  F16M11/14 ,  F16M13/02 ,  F16M13/022 ,  F16M13/027 ,  G03B17/561 ,  G08B13/19617 ,  H01Q1/24 ,  H01Q9/0407 ,  H04N23/51 ,  H04N23/52 ,  H04N23/54 ,  H04N23/57 ,  H05K7/2039 ,  G08B13/19654

Abstract: The present document describes an electronic device with a structural midframe and associated methods. The architectural design of the electronic device (e.g., a security camera) is such that its components are assembled onto the midframe to form a subassembly and the housing is assembled after the subassembly. The midframe includes various features that enable multiple printed circuit boards, a camera subassembly, a front housing member, a heatsink, and a heat spreader to be assembled onto the midframe outside of the housing. The midframe can also include a hinge-bearing surface forming a portion of a ball joint for supporting rotational movement of the electronic device. Accordingly, the electronic device uses the midframe, rather than the housing, as a structural member.

公开(公告)号：US20210026487A1

公开(公告)日：2021-01-28

申请号：US16898252

申请日：2020-06-10

Applicant: GOOGLE LLC

Inventor： Justin Richard Wodrich ,  Timothy Michael Vanderet ,  Daniel David Sachs ,  Jung Geun Tak ,  Laurie Kwan

IPC: G06F3/041

Abstract: A compact electronic device has a touch sensor and/or a microphone that are concealed within a housing at least partially wrapped by an acoustically porous cover. In some implementations, the touch sensor includes a sensing portion and a contact portion extending from the sensing portion. While the sensing portion is placed in proximity to an interior surface of the housing to detect a touch on the housing, the contact portion is bent to electrically couple the sensing portion to a circuit board via two distinct electrical paths. In some implementations, an exterior surface of the housing includes a sealing area surrounding an aperture on the housing, and the acoustically porous cover is affixed to the sealing area via an adhesive. The adhesive covers the sealing area and permeates a thickness of the acoustically porous cover, thereby enabling formation of a controlled sound path to access the microphone via the aperture.

公开(公告)号：US11886654B2

公开(公告)日：2024-01-30

申请号：US17964319

申请日：2022-10-12

Applicant: Google LLC

Inventor： Justin Richard Wodrich ,  Timothy Michael Vanderet ,  Daniel David Sachs ,  Jung Geun Tak ,  Laurie Kwan

IPC: G06F3/041 ,  G06F3/16

CPC classification number: G06F3/0416 ,  G06F3/167

Abstract: Various arrangements of electronic devices, such as assistant devices, are detailed herein. Such a device can include a housing and a microphone. A microphone aperture can be defined by the housing that directs sound from outside the housing to the microphone. A cover, which can be fabric, can be attached with the outside of the housing. An adhesive ring on the housing around the microphone aperture can be used to attach the cover to the housing.

公开(公告)号：US11553265B2

公开(公告)日：2023-01-10

申请号：US16898262

申请日：2020-06-10

Applicant: GOOGLE LLC

Inventor： Justin Richard Wodrich ,  Timothy Michael Vanderet ,  Daniel David Sachs ,  Jung Geun Tak ,  Laurie Kwan

IPC: H04R1/04 ,  G10L15/08 ,  G10L15/22

Abstract: A compact electronic device has a touch sensor and/or a microphone that are concealed within a housing at least partially wrapped by an acoustically porous cover. In some implementations, the touch sensor includes a sensing portion and a contact portion extending from the sensing portion. While the sensing portion is placed in proximity to an interior surface of the housing to detect a touch on the housing, the contact portion is bent to electrically couple the sensing portion to a circuit board via two distinct electrical paths. In some implementations, an exterior surface of the housing includes a sealing area surrounding an aperture on the housing, and the acoustically porous cover is affixed to the sealing area via an adhesive. The adhesive covers the sealing area and permeates a thickness of the acoustically porous cover, thereby enabling formation of a controlled sound path to access the microphone via the aperture.

公开(公告)号：US20210027776A1

公开(公告)日：2021-01-28

申请号：US16898262

申请日：2020-06-10

Applicant: GOOGLE LLC

Inventor： Justin Richard Wodrich ,  Timothy Michael Vanderet ,  Daniel David Sachs ,  Jung Geun Tak ,  Laurie Kwan

IPC: G10L15/22 ,  G10L15/08 ,  H04R1/04

Abstract: A compact electronic device has a touch sensor and/or a microphone that are concealed within a housing at least partially wrapped by an acoustically porous cover. In some implementations, the touch sensor includes a sensing portion and a contact portion extending from the sensing portion. While the sensing portion is placed in proximity to an interior surface of the housing to detect a touch on the housing, the contact portion is bent to electrically couple the sensing portion to a circuit board via two distinct electrical paths. In some implementations, an exterior surface of the housing includes a sealing area surrounding an aperture on the housing, and the acoustically porous cover is affixed to the sealing area via an adhesive. The adhesive covers the sealing area and permeates a thickness of the acoustically porous cover, thereby enabling formation of a controlled sound path to access the microphone via the aperture.

公开(公告)号：US11968795B2

公开(公告)日：2024-04-23

申请号：US18299597

申请日：2023-04-12

Applicant: Google LLC

Inventor： Laurie Man Sum Kwan ,  Cindy Ngoc-Tran Au ,  Timothy Michael Vanderet ,  Cheng-jung Lee

IPC: H05K7/14 ,  F16M11/04 ,  F16M11/14 ,  F16M13/02 ,  G03B17/56 ,  G08B13/196 ,  H01Q1/24 ,  H01Q9/04 ,  H04N23/51 ,  H04N23/52 ,  H04N23/54 ,  H04N23/57 ,  H05K7/20

CPC classification number: H05K7/1417 ,  F16M11/041 ,  F16M11/14 ,  F16M13/02 ,  F16M13/022 ,  F16M13/027 ,  G03B17/561 ,  G08B13/19617 ,  H01Q1/24 ,  H01Q9/0407 ,  H04N23/51 ,  H04N23/52 ,  H04N23/54 ,  H04N23/57 ,  H05K7/2039 ,  G08B13/19654

Abstract: The present document describes an electronic device with a structural midframe and associated methods. The architectural design of the electronic device (e.g., a security camera) is such that its components are assembled onto the midframe to form a subassembly and the housing is assembled after the subassembly. The midframe includes various features that enable multiple printed circuit boards, a camera subassembly, a front housing member, a heatsink, and a heat spreader to be assembled onto the midframe outside of the housing. The midframe can also include a hinge-bearing surface forming a portion of a ball joint for supporting rotational movement of the electronic device. Accordingly, the electronic device uses the midframe, rather than the housing, as a structural member.

公开(公告)号：US20230141824A1

公开(公告)日：2023-05-11

申请号：US18092708

申请日：2023-01-03

Applicant: Google LLC

Inventor： Justin Richard Wodrich ,  Timothy Michael Vanderet ,  Daniel David Sachs ,  Jung Geun Tak ,  Laurie Kwan

IPC: H04R1/04

CPC classification number: H04R1/04 ,  G10L2015/088

Abstract: A compact electronic device has a touch sensor and/or a microphone that are concealed within a housing at least partially wrapped by an acoustically porous cover. In some implementations, the touch sensor includes a sensing portion and a contact portion extending from the sensing portion. While the sensing portion is placed in proximity to an interior surface of the housing to detect a touch on the housing, the contact portion is bent to electrically couple the sensing portion to a circuit board via two distinct electrical paths. In some implementations, an exterior surface of the housing includes a sealing area surrounding an aperture on the housing, and the acoustically porous cover is affixed to the sealing area via an adhesive. The adhesive covers the sealing area and permeates a thickness of the acoustically porous cover, thereby enabling formation of a controlled sound path to access the microphone via the aperture.