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    Structural Midframe for an Electronic Device, and Associated Devices and Methods
    1.
    发明申请
    Structural Midframe for an Electronic Device, and Associated Devices and Methods 有权

    公开(公告)号：US20220095472A1

    公开(公告)日：2022-03-24

    申请号：US17026883

    申请日：2020-09-21

    Applicant: Google LLC

    Inventor： Laurie Man Sum Kwan ,  Cindy Ngoc-Tran Au ,  Timothy Michael Vanderet ,  Cheng-jung Lee

    IPC: H05K7/14 ,  H05K7/20 ,  H04N5/225 ,  H01Q9/04 ,  H01Q1/24

    Abstract: The present document describes an electronic device with a structural midframe and associated methods. The architectural design of the electronic device (e.g., a security camera) is such that its components are assembled onto the midframe to form a subassembly and the housing is assembled after the subassembly. The midframe includes various features that enable multiple printed circuit boards, a camera subassembly, a front housing member, a heatsink, and a heat spreader to be assembled onto the midframe outside of the housing. The midframe can also include a hinge-bearing surface forming a portion of a ball joint for supporting rotational movement of the electronic device. Accordingly, the electronic device uses the midframe, rather than the housing, as a structural member.

    Speaker-Integration System for an Electronic Device, and Associated Devices and Systems
    2.
    发明申请
    Speaker-Integration System for an Electronic Device, and Associated Devices and Systems 有权

    公开(公告)号：US20220232304A1

    公开(公告)日：2022-07-21

    申请号：US17580530

    申请日：2022-01-20

    Applicant: Google LLC

    Inventor： Cindy Ngoc-Tran Au ,  Gordon Robert Dix ,  Luis Chau ,  William Raeming Dong ,  Laurie Man Sum Kwan

    IPC: H04R1/02

    Abstract: This document describes a speaker-integration system and associated devices and systems. The speaker-integration system includes a speaker that is re-workably mounted, via an elastomeric gasket, to an intermediate structure that is mountable to an outer enclosure of an electronic device. The intermediate structure forms a cavity in which the speaker is sealed, effective to use the cavity as the speaker's back volume to contain acoustic waves without impacting other structures in the electronic device. The front of the speaker is sealed against the outer enclosure by a gasket that controls, based on its placement and geometry, axial and radial directions of the speaker relative to the intermediate structure to prevent the speaker from buzzing against surrounding rigid parts. The speaker has wires that exit the back volume via a detachable grommet, which controls positioning of the wires to prevent rub and buzz against surrounding parts.

    Speaker-integration system for an electronic device, and associated devices and systems
    4.
    发明授权
    Speaker-integration system for an electronic device, and associated devices and systems 有权

    公开(公告)号：US11622178B2

    公开(公告)日：2023-04-04

    申请号：US17580530

    申请日：2022-01-20

    Applicant: Google LLC

    Inventor： Cindy Ngoc-Tran Au ,  Gordon Robert Dix ,  Luis Chau ,  William Raeming Dong ,  Laurie Man Sum Kwan

    IPC: H04R1/02

    Abstract: This document describes a speaker-integration system and associated devices and systems. The speaker-integration system includes a speaker that is re-workably mounted, via an elastomeric gasket, to an intermediate structure that is mountable to an outer enclosure of an electronic device. The intermediate structure forms a cavity in which the speaker is sealed, effective to use the cavity as the speaker's back volume to contain acoustic waves without impacting other structures in the electronic device. The front of the speaker is sealed against the outer enclosure by a gasket that controls, based on its placement and geometry, axial and radial directions of the speaker relative to the intermediate structure to prevent the speaker from buzzing against surrounding rigid parts. The speaker has wires that exit the back volume via a detachable grommet, which controls positioning of the wires to prevent rub and buzz against surrounding parts.

    Speaker-integration system for an electronic device, and associated devices and systems
    7.
    发明授权
    Speaker-integration system for an electronic device, and associated devices and systems 有权

    公开(公告)号：US11265632B1

    公开(公告)日：2022-03-01

    申请号：US17154323

    申请日：2021-01-21

    Applicant: Google LLC

    Inventor： Cindy Ngoc-Tran Au ,  Gordon Robert Dix ,  Luis Chau ,  William Raeming Dong ,  Laurie Man Sum Kwan

    IPC: H04R1/02

    Abstract: This document describes a speaker-integration system and associated devices and systems. The speaker-integration system includes a speaker that is re-workably mounted, via an elastomeric gasket, to an intermediate structure that is mountable to an outer enclosure of an electronic device. The intermediate structure forms a cavity in which the speaker is sealed, effective to use the cavity as the speaker's back volume to contain acoustic waves without impacting other structures in the electronic device. The front of the speaker is sealed against the outer enclosure by a gasket that controls, based on its placement and geometry, axial and radial directions of the speaker relative to the intermediate structure to prevent the speaker from buzzing against surrounding rigid parts. The speaker has wires that exit the back volume via a detachable grommet, which controls positioning of the wires to prevent rub and buzz against surrounding parts.

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