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    Multipurpose speaker enclosure in a display assistant device
    1.
    发明授权
    Multipurpose speaker enclosure in a display assistant device 有权

    公开(公告)号：US11513565B2

    公开(公告)日：2022-11-29

    申请号：US16651545

    申请日：2019-04-24

    申请人： GOOGLE LLC

    发明人： Xiaoping Qin ,  Christen Cameron Bilger ,  Frederic Heckmann ,  Frances Kwee ,  Justin Leong ,  James Castro

    IPC分类号： G06F1/16 ,  G06F3/16 ,  G10L15/28 ,  H04R1/02 ,  H04R1/34 ,  G02F1/1333 ,  G02F1/1337 ,  G06F21/83 ,  H04L12/28

    摘要： This application is directed to a speaker assembly in which a speaker is mounted in an enclosure structure. The enclosure structure exposes a speaker opening of the speaker and provides a sealed enclosure for a rear portion of the speaker, and further includes an electrically conductive portion. One or more electronic components are coupled to the electrically conductive portion of the enclosure structure (which is grounded in some implementations). The electrically conductive portion of the enclosure structure is configured to provide electromagnetic shielding for the electronic components and forms part of the sealed enclosure of the speaker. In some implementations, the electrically conductive portion of the enclosure structure is thermally coupled to the electronic components and acts as a heat sink that is configured to absorb heat generated by the electronic components and dissipate the generated heat away from the electronic components.

    Speaker assembly in a display assistant device
    2.
    发明授权
    Speaker assembly in a display assistant device 有权

    公开(公告)号：US10996717B2

    公开(公告)日：2021-05-04

    申请号：US16597745

    申请日：2019-10-09

    申请人： GOOGLE LLC

    发明人： James Castro ,  Carl Cepress ,  Liang Ching Tseng ,  Darren Torrie ,  Frances Kwee ,  Rex Price

    IPC分类号： G06F1/16 ,  G10L15/28 ,  H04R1/02 ,  H04R1/34 ,  H04L12/28 ,  G02F1/1333 ,  G02F1/1337 ,  G06F3/16 ,  G06F21/83

    摘要： In a display assistant device, a speaker is mounted in a waveguide structure which is at least partially disposed beneath a display screen. The waveguide structure is mounted in an exterior housing which includes speaker grills distributed on a plurality of surfaces of the exterior housing, permitting sound waves from the speaker to be projected outside the exterior housing. A cover structure is disposed on top of the waveguide structure to conceal the waveguide structure and speaker within the exterior housing. The cover structure has a tilted bottom surface configured to be suspended above the waveguide structure and to be separated by a first space. Sound waves projected from an upper portion of the speaker are reflected by the tilted bottom surface and are guided through the first space to exit the device from a speaker grill portion located on a rear side of the exterior housing.

    MULTIPURPOSE SPEAKER ENCLOSURE IN A DISPLAY ASSISTANT DEVICE
    7.
    发明申请
    MULTIPURPOSE SPEAKER ENCLOSURE IN A DISPLAY ASSISTANT DEVICE 有权

    公开(公告)号：US20220404864A1

    公开(公告)日：2022-12-22

    申请号：US17889683

    申请日：2022-08-17

    申请人： Google LLC

    发明人： Xiaoping Qin ,  Christen Cameron Bilger ,  Frederic Heckmann ,  Frances Kwee ,  Justin Leong ,  James Castro

    IPC分类号： G06F1/16 ,  G02F1/1333 ,  G02F1/1337 ,  G06F3/16 ,  G10L15/28 ,  G06F21/83 ,  H04R1/02 ,  H04R1/34

    摘要： This application is directed to a speaker assembly in which a speaker is mounted in an enclosure structure. The enclosure structure exposes a speaker opening of the speaker and provides a sealed enclosure for a rear portion of the speaker, and further includes an electrically conductive portion. One or more electronic components are coupled to the electrically conductive portion of the enclosure structure (which is grounded in some implementations). The electrically conductive portion of the enclosure structure is configured to provide electromagnetic shielding for the electronic components and forms part of the sealed enclosure of the speaker. In some implementations, the electrically conductive portion of the enclosure structure is thermally coupled to the electronic components and acts as a heat sink that is configured to absorb heat generated by the electronic components and dissipate the generated heat away from the electronic components.