公开(公告)号：US11513565B2

公开(公告)日：2022-11-29

申请号：US16651545

申请日：2019-04-24

Applicant: GOOGLE LLC

Inventor： Xiaoping Qin ,  Christen Cameron Bilger ,  Frederic Heckmann ,  Frances Kwee ,  Justin Leong ,  James Castro

IPC: G06F1/16 ,  G06F3/16 ,  G10L15/28 ,  H04R1/02 ,  H04R1/34 ,  G02F1/1333 ,  G02F1/1337 ,  G06F21/83 ,  H04L12/28

Abstract: This application is directed to a speaker assembly in which a speaker is mounted in an enclosure structure. The enclosure structure exposes a speaker opening of the speaker and provides a sealed enclosure for a rear portion of the speaker, and further includes an electrically conductive portion. One or more electronic components are coupled to the electrically conductive portion of the enclosure structure (which is grounded in some implementations). The electrically conductive portion of the enclosure structure is configured to provide electromagnetic shielding for the electronic components and forms part of the sealed enclosure of the speaker. In some implementations, the electrically conductive portion of the enclosure structure is thermally coupled to the electronic components and acts as a heat sink that is configured to absorb heat generated by the electronic components and dissipate the generated heat away from the electronic components.

公开(公告)号：US20240272683A1

公开(公告)日：2024-08-15

申请号：US18643419

申请日：2024-04-23

Applicant: Google LLC

Inventor： Xiaoping Qin ,  Christen Cameron Bilger ,  Frederic Heckmann ,  Frances Kwee ,  Justin Leong ,  James Castro

IPC: G06F1/16 ,  G02F1/1333 ,  G02F1/1337 ,  G06F3/16 ,  G06F21/83 ,  G10L15/28 ,  H04L12/28 ,  H04R1/02 ,  H04R1/34

CPC classification number: G06F1/166 ,  G02F1/133308 ,  G02F1/133753 ,  G06F1/1605 ,  G06F1/1626 ,  G06F1/1637 ,  G06F1/1658 ,  G06F1/1683 ,  G06F1/1686 ,  G06F1/1688 ,  G06F1/1698 ,  G06F3/167 ,  G06F21/83 ,  G10L15/28 ,  H04R1/023 ,  H04R1/025 ,  H04R1/028 ,  H04R1/345 ,  G02F1/133325 ,  G02F1/133761 ,  H04L12/282 ,  H04R2499/15

Abstract: This application is directed to a speaker assembly in which a speaker is mounted in an enclosure structure. The enclosure structure exposes a speaker opening of the speaker and provides a sealed enclosure for a rear portion of the speaker, and further includes an electrically conductive portion. One or more electronic components are coupled to the electrically conductive portion of the enclosure structure (which is grounded in some implementations). The electrically conductive portion of the enclosure structure is configured to provide electromagnetic shielding for the electronic components and forms part of the sealed enclosure of the speaker. In some implementations, the electrically conductive portion of the enclosure structure is thermally coupled to the electronic components and acts as a heat sink that is configured to absorb heat generated by the electronic components and dissipate the generated heat away from the electronic components.

公开(公告)号：US11994917B2

公开(公告)日：2024-05-28

申请号：US17889683

申请日：2022-08-17

Applicant: Google LLC

Inventor： Xiaoping Qin ,  Christen Cameron Bilger ,  Frederic Heckmann ,  Frances Kwee ,  Justin Leong ,  James Castro

IPC: G06F1/16 ,  G02F1/1333 ,  G02F1/1337 ,  G06F3/16 ,  G06F21/83 ,  G10L15/28 ,  H04L12/28 ,  H04R1/02 ,  H04R1/34

CPC classification number: G06F1/166 ,  G02F1/133308 ,  G02F1/133753 ,  G06F1/1605 ,  G06F1/1626 ,  G06F1/1637 ,  G06F1/1658 ,  G06F1/1683 ,  G06F1/1686 ,  G06F1/1688 ,  G06F1/1698 ,  G06F3/167 ,  G06F21/83 ,  G10L15/28 ,  H04R1/023 ,  H04R1/025 ,  H04R1/028 ,  H04R1/345 ,  G02F1/133325 ,  G02F1/133761 ,  H04L12/282 ,  H04R2499/15

Abstract: This application is directed to a speaker assembly in which a speaker is mounted in an enclosure structure. The enclosure structure exposes a speaker opening of the speaker and provides a sealed enclosure for a rear portion of the speaker, and further includes an electrically conductive portion. One or more electronic components are coupled to the electrically conductive portion of the enclosure structure (which is grounded in some implementations). The electrically conductive portion of the enclosure structure is configured to provide electromagnetic shielding for the electronic components and forms part of the sealed enclosure of the speaker. In some implementations, the electrically conductive portion of the enclosure structure is thermally coupled to the electronic components and acts as a heat sink that is configured to absorb heat generated by the electronic components and dissipate the generated heat away from the electronic components.

公开(公告)号：US20220404864A1

公开(公告)日：2022-12-22

申请号：US17889683

申请日：2022-08-17

Applicant: Google LLC

Inventor： Xiaoping Qin ,  Christen Cameron Bilger ,  Frederic Heckmann ,  Frances Kwee ,  Justin Leong ,  James Castro

IPC: G06F1/16 ,  G02F1/1333 ,  G02F1/1337 ,  G06F3/16 ,  G10L15/28 ,  G06F21/83 ,  H04R1/02 ,  H04R1/34

Abstract: This application is directed to a speaker assembly in which a speaker is mounted in an enclosure structure. The enclosure structure exposes a speaker opening of the speaker and provides a sealed enclosure for a rear portion of the speaker, and further includes an electrically conductive portion. One or more electronic components are coupled to the electrically conductive portion of the enclosure structure (which is grounded in some implementations). The electrically conductive portion of the enclosure structure is configured to provide electromagnetic shielding for the electronic components and forms part of the sealed enclosure of the speaker. In some implementations, the electrically conductive portion of the enclosure structure is thermally coupled to the electronic components and acts as a heat sink that is configured to absorb heat generated by the electronic components and dissipate the generated heat away from the electronic components.

公开(公告)号：US20210011518A1

公开(公告)日：2021-01-14

申请号：US16651545

申请日：2019-04-24

Applicant: GOOGLE LLC

Inventor： Xiaoping QIN ,  Christen Cameron BILGER ,  Frederic Heckmann ,  Frances KWEE ,  Justin LEONG ,  James CASTRO

IPC: G06F1/16 ,  H04R1/02 ,  H04R1/34

Abstract: This application is directed to a speaker assembly in which a speaker is mounted in an enclosure structure. The enclosure structure exposes a speaker opening of the speaker and provides a sealed enclosure for a rear portion of the speaker, and further includes an electrically conductive portion. One or more electronic components are coupled to the electrically conductive portion of the enclosure structure (which is grounded in some implementations). The electrically conductive portion of the enclosure structure is configured to provide electromagnetic shielding for the electronic components and forms part of the sealed enclosure of the speaker. In some implementations, the electrically conductive portion of the enclosure structure is thermally coupled to the electronic components and acts as a heat sink that is configured to absorb heat generated by the electronic components and dissipate the generated heat away from the electronic components.