公开(公告)号：US20230411297A1

公开(公告)日：2023-12-21

申请号：US17841188

申请日：2022-06-15

Applicant: Google LLC

Inventor： Georgios Konstadinidis ,  Woon-Seong Kwon ,  Jaesik Lee ,  Teckgyu Kang ,  Jin Y. Kim ,  Sukalpa Biswas ,  Biao He ,  Yujeong Shim

IPC: H01L23/538 ,  H01L25/065 ,  H01L25/18 ,  H01L21/48 ,  H01L25/00

CPC classification number: H01L23/5381 ,  H01L25/0655 ,  H01L25/18 ,  H01L23/5384 ,  H01L23/5385 ,  H01L21/4853 ,  H01L21/486 ,  H01L25/50

Abstract: A microelectronic system may include a substrate having a first surface, one or more interposers mounted to and electrically connected to the first surface, first and second application specific integrated circuits (ASICs) each at least partially overlying and electrically connected to one of the interposers, a plurality of high-bandwidth memory elements (HBMs) each at least partially overlying and electrically connected to one of the interposers, and an active silicon bridge mounted to and electrically connected to the first surface and providing an electrical connection between the first and second ASICs, the active silicon bridge having active microelectronic devices therein. The microelectronic system may be configured such that the first and second ASICs and the active silicon bridge each have a purely digital CMOS interface therein. A plurality of bumps providing the electrical connection between the ASICs and the active silicon bridge may be configured to receive serial data therethrough.