公开(公告)号：US20240396194A1

公开(公告)日：2024-11-28

申请号：US18202870

申请日：2023-05-26

Applicant: Google LLC

Inventor： George Earl Grant Sterling ,  Michael C. Hamilton ,  Lev Ioffe ,  Charles Neill

IPC: H01P1/20

Abstract: A microwave filter includes a multilayer stack. The multilayer stack includes one or more first-type layers composed of a first superconductor material having a first superconducting critical temperature; and one or more second-type layers composed of a non-superconductor metal or a second superconductor material having a second superconducting critical temperature that is lower than the first superconducting critical temperature. The multilayer stack is configured to behave as a dissipative metal for photons having a frequency above twice a superconducting gap frequency of the multilayer stack and to behave as a superconductor for photons having a frequency below twice the superconducting gap frequency of the multilayer stack.

公开(公告)号：US20240194661A1

公开(公告)日：2024-06-13

申请号：US18080729

申请日：2022-12-13

Applicant: Google LLC

Inventor： Zhimin Jamie Yao ,  Michael C. Hamilton ,  Marissa Giustina ,  Brian James Burkett ,  Theodore Charles White ,  Ofer Naaman

IPC: H01L25/00 ,  H01L23/00

CPC classification number: H01L25/50 ,  H01L24/81 ,  H01L24/13 ,  H01L2224/13109 ,  H01L2224/81815

Abstract: A method includes providing a first chip having a circuit element layer stack, the circuit element layer stack including a plurality of circuit elements distributed across a plurality of layers. The circuit element layer stack has a sacrificial material filling a space between the plurality of circuit elements in the plurality of layers and a coherent device layer disposed on the circuit element layer stack. The method includes removing the sacrificial material.

公开(公告)号：US20240194532A1

公开(公告)日：2024-06-13

申请号：US18080715

申请日：2022-12-13

Applicant: Google LLC

Inventor： Zhimin Jamie Yao ,  Michael C. Hamilton ,  Marissa Giustina ,  Brian James Burkett ,  Theodore Charles White ,  Ofer Naaman

IPC: H01L21/822 ,  H01L21/02 ,  H01L21/311 ,  H01L21/768 ,  H01L23/00 ,  H01L25/07

CPC classification number: H01L21/8221 ,  H01L21/02505 ,  H01L21/02598 ,  H01L21/31127 ,  H01L21/7688 ,  H01L24/16 ,  H01L24/29 ,  H01L25/074 ,  B82Y10/00

Abstract: A method includes providing a first chip having a circuit element layer stack, the circuit element layer stack including a plurality of circuit elements distributed across a plurality of layers. The circuit element layer stack has a sacrificial material filling a space between the plurality of circuit elements in the plurality of layers and a coherent device layer disposed on the circuit element layer stack. The method includes removing the sacrificial material.