公开(公告)号：US11249264B2

公开(公告)日：2022-02-15

申请号：US17122658

申请日：2020-12-15

Applicant: Google LLC

Inventor： William F. Edwards, Jr. ,  Melanie Beauchemin ,  Timothy Conrad Lee ,  Federico Pio Centola ,  Madhusudan K. Iyengar ,  Michael Chi Kin Lau ,  Zuowei Shen ,  Justin Sishung Lee

IPC: H04B10/00 ,  G02B6/42

Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.

公开(公告)号：US11650384B2

公开(公告)日：2023-05-16

申请号：US17668062

申请日：2022-02-09

Applicant: Google LLC

Inventor： William F. Edwards, Jr. ,  Melanie Beauchemin ,  Timothy Conrad Lee ,  Federico Pio Centola ,  Madhusudan K. Iyengar ,  Michael Chi Kin Lau ,  Zuowei Shen ,  Justin Sishung Lee

IPC: H04B10/00 ,  G02B6/42

CPC classification number: G02B6/4269 ,  G02B6/428 ,  G02B6/4284

Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.

公开(公告)号：US20230244046A1

公开(公告)日：2023-08-03

申请号：US18131640

申请日：2023-04-06

Applicant: Google LLC

Inventor： William F. Edwards, JR. ,  Melanie Beauchemin ,  Timothy Conrad Lee ,  Federico Pio Centola ,  Madhusudan K. Iyengar ,  Michael Chi Kin Lau ,  Zuowei Shen ,  Justin Sishung Lee

IPC: G02B6/42

CPC classification number: G02B6/4269 ,  G02B6/428 ,  G02B6/4284

Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.

公开(公告)号：US20220269019A1

公开(公告)日：2022-08-25

申请号：US17668062

申请日：2022-02-09

Applicant: Google LLC

Inventor： William F. Edwards, JR. ,  Melanie Beauchemin ,  Timothy Conrad Lee ,  Federico Pio Centola ,  Madhusudan K. Iyengar ,  Michael Chi Kin Lau ,  Zuowei Shen ,  Justin Sishung Lee

IPC: G02B6/42

Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.

公开(公告)号：US20220003946A1

公开(公告)日：2022-01-06

申请号：US17122658

申请日：2020-12-15

Applicant: Google LLC

Inventor： William F. Edwards, Jr. ,  Melanie Beauchemin ,  Timothy Conrad Lee ,  Federico Pio Centola ,  Madhusudan K. Iyengar ,  Michael Chi Kin Lau ,  Zuowei Shen ,  Justin Sishung Lee

IPC: G02B6/42

Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.