公开(公告)号：US20110175700A1

公开(公告)日：2011-07-21

申请号：US12294675

申请日：2007-04-16

申请人： Gordon L. Bourns ,  Stelar Chu ,  Daniel E. Grindell ,  David Huang ,  John Kelly ,  Eric Meijer

发明人： Gordon L. Bourns ,  Stelar Chu ,  Daniel E. Grindell ,  David Huang ,  John Kelly ,  Eric Meijer

IPC分类号： H01C7/13 ,  H05K3/10

CPC分类号： H01C7/021 ,  H01C1/016 ,  H01C1/1406 ,  H01C1/1413 ,  H01C7/005 ,  H01C7/028 ,  H01C7/041 ,  H01C7/049 ,  H01C7/18 ,  H01C17/02 ,  H01C17/281 ,  Y10T29/49165

摘要： Surface-mountable conductive polymer electronic devices include at least one conductive polymer active layer laminated between upper and lower electrodes. Upper and lower insulation layers, respectively, sandwich the upper and lower electrodes. First and second planar conductive terminals are formed on the lower insulation layer. First and second cross-conductors are provided by plated through-hole vias, whereby the cross-conductors connect each of the electrodes to one of the terminals. Certain embodiments include two or more active layers, arranged in a vertically-stacked configuration and electrically connected by the cross-conductors and electrodes in parallel. Several embodiments include at least one cross-conductor having a chamfered or beveled entry hole through the upper insulation layer to provide enhanced adhesion between the cross-conductor and the insulation layer. Several methods for manufacturing the present surface-mountable conductive polymer electronic devices are also provided.

摘要翻译： 表面安装导电聚合物电子器件包括层压在上电极和下电极之间的至少一个导电聚合物有源层。 上下绝缘层分别夹着上下电极。 第一和第二平面导电端子形成在下绝缘层上。 第一和第二导体由电镀通孔通孔提供，由此将导体将每个电极连接到其中一个端子。 某些实施方案包括两个或更多个有源层，其被布置成垂直堆叠的构造并且由交叉导体和电极并联电连接。 几个实施例包括至少一个具有通过上绝缘层的倒角或斜面进入孔的交叉导体，以在交叉导体和绝缘层之间提供增强的粘合。 还提供了用于制造本表面安装导电聚合物电子器件的几种方法。

公开(公告)号：US08542086B2

公开(公告)日：2013-09-24

申请号：US12294675

申请日：2007-04-16

申请人： Gordon L. Bourns ,  Stelar Chu ,  Daniel E. Grindell ,  David Huang ,  John Kelly ,  Erik Meijer

发明人： Gordon L. Bourns ,  Stelar Chu ,  Daniel E. Grindell ,  David Huang ,  John Kelly ,  Erik Meijer

IPC分类号： H01C7/10

CPC分类号： H01C7/021 ,  H01C1/016 ,  H01C1/1406 ,  H01C1/1413 ,  H01C7/005 ,  H01C7/028 ,  H01C7/041 ,  H01C7/049 ,  H01C7/18 ,  H01C17/02 ,  H01C17/281 ,  Y10T29/49165

摘要： Surface-mountable conductive polymer electronic devices include at least one conductive polymer active layer laminated between upper and lower electrodes. Upper and lower insulation layers, respectively, sandwich the upper and lower electrodes. First and second planar conductive terminals are formed on the lower insulation layer. First and second cross-conductors are provided by plated through-hole vias, whereby the cross-conductors connect each of the electrodes to one of the terminals. Certain embodiments include two or more active layers, arranged in a vertically-stacked configuration and electrically connected by the cross-conductors and electrodes in parallel. Several embodiments include at least one cross-conductor having a chamfered or beveled entry hole through the upper insulation layer to provide enhanced adhesion between the cross-conductor and the insulation layer. Several methods for manufacturing the present surface-mountable conductive polymer electronic devices are also provided.

摘要翻译： 表面安装导电聚合物电子器件包括层压在上电极和下电极之间的至少一个导电聚合物有源层。 上下绝缘层分别夹着上下电极。 第一和第二平面导电端子形成在下绝缘层上。 第一和第二导体由电镀通孔通孔提供，由此将导体将每个电极连接到其中一个端子。 某些实施方案包括两个或更多个有源层，其被布置成垂直堆叠的构造并且由交叉导体和电极并联电连接。 几个实施例包括至少一个具有通过上绝缘层的倒角或斜面进入孔的交叉导体，以在交叉导体和绝缘层之间提供增强的粘合。 还提供了用于制造本表面安装导电聚合物电子器件的几种方法。