公开(公告)号：US20130122783A1

公开(公告)日：2013-05-16

申请号：US13129351

申请日：2011-04-13

申请人： Gregory E. Menk ,  Stan D. Tsai ,  Sang J. Cho ,  Slvakumar Dhandapani ,  Christopher D. Cocca ,  Jason G. Fung ,  Shou-Sung Chang ,  Charles C. Garretson

发明人： Gregory E. Menk ,  Stan D. Tsai ,  Sang J. Cho ,  Slvakumar Dhandapani ,  Christopher D. Cocca ,  Jason G. Fung ,  Shou-Sung Chang ,  Charles C. Garretson

IPC分类号： B24B53/017

CPC分类号： B24B53/017 ,  B24B37/042

摘要： A method and apparatus for conditioning a polishing pad in a CMP system is provided. In one embodiment, a method for conditioning a polishing pad includes applying a down force to the conditioning disk that urges the conditioning disk against the polishing pad, measuring a torque required to sweep the conditioning disk across the polishing pad, determining a change in down force by comparing the measured torque to a model force profile (MFP), and adjusting the down force that the conditioning disk applies against the polishing pad in response to the determined change.

摘要翻译： 提供了一种用于调节CMP系统中的抛光垫的方法和装置。 在一个实施例中，一种用于调节抛光垫的方法包括向调节盘施加向下的力，该调节盘将调节盘推向抛光垫，测量扫过经过抛光垫的调节盘所需的扭矩，确定向下力的变化 通过将测量的扭矩与模型力分布（MFP）进行比较，并且响应于确定的变化来调节调节盘对抛光垫施加的向下的力。