Method for Strengthening Glass and Glass Using the Same
    1.
    发明申请
    Method for Strengthening Glass and Glass Using the Same 失效
    使用玻璃和玻璃加强玻璃的方法

    公开(公告)号:US20110293928A1

    公开(公告)日:2011-12-01

    申请号:US13112331

    申请日:2011-05-20

    IPC分类号: B32B17/06 C03C21/00

    摘要: A method for strengthening glass and a glass using the same are provided. The method for strengthening glass includes the following steps. Firstly, a glass substrate, which has a first surface and a second surface opposite to the first surface, is provided. Next, a barrier film is formed on at least one of the first surface and the second surface. Then, the glass substrate with the barrier film is immersed in a strengthening solution. The strengthening solution includes first ions, and the barrier film can limit the first ions in the quantity entering the glass substrate.

    摘要翻译: 提供一种加强玻璃和使用其的玻璃的方法。 强化玻璃的方法包括以下步骤。 首先,设置具有与第一面相反的第一面和第二面的玻璃基板。 接下来,在第一表面和第二表面中的至少一个上形成阻挡膜。 然后,将具有阻挡膜的玻璃基板浸渍在强化溶液中。 强化溶液包括第一离子,并且阻挡膜可以限制进入玻璃基底的量的第一离子。

    Method for strengthening glass and glass using the same
    2.
    发明授权
    Method for strengthening glass and glass using the same 失效
    使用其加强玻璃和玻璃的方法

    公开(公告)号:US08652639B2

    公开(公告)日:2014-02-18

    申请号:US13112331

    申请日:2011-05-20

    IPC分类号: B32B17/06

    摘要: A method for strengthening glass and a glass using the same are provided. The method for strengthening glass includes the following steps. Firstly, a glass substrate, which has a first surface and a second surface opposite to the first surface, is provided. Next, a barrier film is formed on at least one of the first surface and the second surface. Then, the glass substrate with the barrier film is immersed in a strengthening solution. The strengthening solution includes first ions, and the barrier film can limit the first ions in the quantity entering the glass substrate.

    摘要翻译: 提供一种加强玻璃和使用其的玻璃的方法。 强化玻璃的方法包括以下步骤。 首先,设置具有与第一面相反的第一面和第二面的玻璃基板。 接下来,在第一表面和第二表面中的至少一个上形成阻挡膜。 然后,将具有阻挡膜的玻璃基板浸渍在强化溶液中。 强化溶液包括第一离子,并且阻挡膜可以限制进入玻璃基底的量的第一离子。

    Magnetron sputtering cathode mechanism
    3.
    发明授权
    Magnetron sputtering cathode mechanism 失效
    磁控溅射阴极机构

    公开(公告)号:US08052852B2

    公开(公告)日:2011-11-08

    申请号:US12255062

    申请日:2008-10-21

    申请人: Guan-Yeu Chu

    发明人: Guan-Yeu Chu

    IPC分类号: C23C14/35

    摘要: A magnetron sputtering cathode mechanism includes a backing plate, a target, at least one magnetic component and at least one magnet. The backing plate has a first surface and a second surface opposite to the first surface. The first surface has at least one positioning recess, and the target has a bombarded surface and a non-bombarded surface opposite to the bombarded surface. The non-bombarded surface contacts with the first surface and has at least one combining recess. The magnetic component is disposed between the backing plate and the target and has a combining portion and a positioning portion. The combining portion is positioned in the combining recess, and the positioning portion is received in the positioning recess. The magnet is disposed at the second surface. The magnetic component is attracted to the corresponding magnet so as to fix the target at the backing plate.

    摘要翻译: 磁控溅射阴极机构包括背板,靶,至少一个磁性部件和至少一个磁体。 背板具有与第一表面相对的第一表面和第二表面。 第一表面具有至少一个定位凹槽,并且靶具有被轰击表面和与被轰击表面相对的非轰击表面。 未被轰击的表面与第一表面接触并且具有至少一个组合凹部。 磁性部件设置在背板和靶之间,具有组合部和定位部。 组合部分位于组合凹槽中,并且定位部分被容纳在定位凹槽中。 磁体设置在第二表面。 磁性部件被吸引到相应的磁体上,以将靶材固定在背板上。

    Sputtering target and sputtering equipment
    4.
    发明申请
    Sputtering target and sputtering equipment 审中-公开
    溅射靶和溅射设备

    公开(公告)号:US20070240980A1

    公开(公告)日:2007-10-18

    申请号:US11599986

    申请日:2006-11-16

    IPC分类号: C23C14/00

    CPC分类号: C23C14/3407

    摘要: A sputtering target having at least one flat first sputtering surface and at least one second sputtering surfaces respectively and laterally abutted against the flat first sputtering surface and slanting in one direction relative to the first sputtering surface. By means of adjusting the position of the second sputtering surface related to the first sputtering surface and utilizing the differently slanted second sputtering surface of the sputtering target, the distribution of the thin film deposited on the surfaced of a substrate is relatively controlled and a uniform thickness of the thin film is obtained.

    摘要翻译: 溅射靶具有至少一个平坦的第一溅射表面和至少一个第二溅射表面,并且横向抵靠平坦的第一溅射表面并相对于第一溅射表面在一个方向上倾斜。 通过调整与第一溅射表面相关的第二溅射表面的位置并利用溅射靶的不同倾斜的第二溅射表面,沉积在衬底表面上的薄膜的分布被相对地控制并且具有均匀的厚度 的薄膜。