摘要:
An apparatus and method supports thermal processing of a microelectronic device such as a semiconductor chip in a substrate by heating the substrate with secondary radiation from an energy transfer device 40, which has a first set of energy transfer regions comprised of an emissive and thermally conductive material, and a second set of thermally insulating regions comprised of a reduced emissivity and reduced thermal conductivity material or free space. A multi-zone radiant energy source 30 provides radiative energy to energy transfer device 40, with a process controller 36, preferably a multi-zone controller, altering the amount of energy provided by each heat zone associated with each emissive region of energy transfer device 40. Sensors detect the thermal energy level of each energy transfer region to allow controller 36 to adjust the secondary radiation emitted by each region in real time, resulting in a predetermined and controlled distribution of thermal energy on substrate 20. Energy transfer device 40 can have plural emissive and thermally conductive concentric rings separated from each other by reduced emissivity and reduced thermal conductivity regions such as free space gaps 42. Alternatively, a solid plate 54 having an emissive coating or emissive surface 52 can have reduced emissivity and reduced conductivity isolation regions such as trenches 56 for defining the multi-zone high-emissivity and high thermal conductivity energy transfer regions.
摘要:
Single Ended Line Probing (SELP) techniques for devices having transformerless hybrid circuits are disclosed. These SELP techniques provide an accurate estimate of the length of a transmission medium (e.g., subscriber loop in Digital Subscriber Line (DSL) system) by computing a transfer function that accounts for the characteristics of the transformerless hybrid circuit and the transmission medium, and relating the transfer function to the length of the transmission medium at one or more frequencies.
摘要:
An apparatus and method supports thermal processing of a microelectronic device such as a semiconductor chip in a substrate by heating the substrate with secondary radiation from an energy transfer device 40, which has a first set of energy transfer regions comprised of an emissive and thermally conductive material, and a second set of thermally insulating regions comprised of a reduced emissivity and reduced thermal conductivity material or free space. A multi-zone-radiant energy source 30 provides radiative energy to energy transfer device 40, with a process controller 36, preferably a multi-zone controller, altering the amount of energy provided by each heat zone associated with each emissive region of energy transfer device 40. Sensors detect the thermal energy level of each energy transfer region to allow controller 36 to adjust the secondary radiation emitted by each region in real time, resulting in a predetermined and controlled distribution of thermal energy on substrate 20. Energy transfer device 40 can have plural emissive and thermally conductive concentric rings separated from each other by reduced emissivity and reduced thermal conductivity regions such as free space gaps 42. Alternatively, a solid plate 54 having an emissive coating or emissive surface 52 can have reduced emissivity and reduced conductivity isolation regions such as trenches 56 for defining the multi-zone high-emissivity and high thermal conductivity energy transfer regions.
摘要:
SELP techniques that provide an accurate estimate of the length of a transmission medium (e.g., subscriber loop in a DSL system) are disclosed. A probe signal is transmitted over the transmission medium at one or more frequencies. A reflected version of the probe signal is then received. Transmission medium impedance is determined based on the ratio of the reflected version of the probe signal and the transmitted probe signal. An estimate of transmission medium length is determined by comparing its impedance to a plurality of predetermined impedances, each of which is associated with a transmission medium having known length. Thus, the length of the systems transmission medium is identified. The transmission medium impedance can also be used to identify the presence of load coils and short circuits in the transmission medium.
摘要:
Double-ended line probing (DELP) techniques are described herein that enable a loop configuration to be identified based on mathematically simple error functions, which are both time-efficient and less sensitive to measurement errors. A DELP algorithm uses readily available data about the channel that is generated prior to the modem operation (e.g., theoretical loop models) and other available data (e.g., that provided by loop diagnostic modules) to estimate the loop configuration including the line length and gauge, as well as the number of bridge taps and their gauges, lengths, and locations.
摘要:
Double-ended line probing (DELP) techniques are described herein that enable a loop configuration to be identified based on mathematically simple error functions, which are both time-efficient and less sensitive to measurement errors. A DELP algorithm uses readily available data about the channel that is generated prior to the modem operation (e.g., theoretical loop models) and other available data (e.g., that provided by loop diagnostic modules) to estimate the loop configuration including the line length and gauge, as well as the number of bridge taps and their gauges, lengths, and locations.