公开(公告)号：US12269125B2

公开(公告)日：2025-04-08

申请号：US18288613

申请日：2022-01-25

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takafumi Ogiwara ,  Hayate Joan

IPC: B23K26/53 ,  B23K26/073 ,  G01N21/95 ,  H01L21/67

Abstract: A laser processing device includes: a laser irradiation unit; and a control unit. The control unit is configured to execute a first control to control the laser irradiation unit to form modified regions for division along each of lines extending in an X direction and cracks extending from the modified regions in a direction of a surface, a second control to control the laser irradiation unit to form modified regions for division along each of a plurality of lines in a Y direction and cracks extending from the modified regions in the direction of the surface, and a third control to control the laser irradiation unit to form cracks extending from a plurality of modified regions for suppressing warpage before the second control, the cracks being formed to reach a back surface and not to be continuous with the cracks extending from the modified regions for division.