公开(公告)号：US12128498B2

公开(公告)日：2024-10-29

申请号：US15762174

申请日：2016-08-17

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takafumi Ogiwara ,  Yuta Kondoh

IPC: B23K26/08 ,  B23K26/00 ,  B23K26/04 ,  B23K26/0622 ,  B23K26/53 ,  H01L21/78

CPC classification number: B23K26/0869 ,  B23K26/0006 ,  B23K26/04 ,  B23K26/048 ,  B23K26/0622 ,  B23K26/08 ,  B23K26/53 ,  H01L21/78

Abstract: A laser processing method includes: a first step of converging laser light having a wavelength larger than 1064 nm on an object to be processed with a rear face of a silicon substrate as a laser light entrance surface and moving a first converging point of the laser light along a line to cut, and thereby forming a first modified region along the line to cut; and a second step of converging the laser light having a wavelength larger than 1064 nm on the object to be processed with the rear face as the laser light entrance surface after the first step and moving a second converging point of the laser light along the line to cut while offsetting the second converging point with respect to a position where the first converging point is aligned, and there by forming a second modified region along the line to cut.

公开(公告)号：US12272577B2

公开(公告)日：2025-04-08

申请号：US17908288

申请日：2021-03-03

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi Sakamoto ,  Takafumi Ogiwara ,  Iku Sano

IPC: H01L21/67 ,  B23K26/03 ,  B23K26/53 ,  B23K103/00 ,  G01N21/95

Abstract: An inspection device includes a laser irradiation unit irradiating a wafer with laser light, a display displaying information, and a control unit. The control unit is constituted to execute deriving of an estimated processing result including information a modified region and a crack extending from the modified region formed on the wafer when the wafer is irradiated with the laser light by the laser irradiation unit on the basis of set recipes (processing conditions), and controlling the display so as to display an estimated processing result image depicting both a graphic image of the wafer and a graphic image of the modified region and the crack in the wafer in consideration of positions of the modified region and the crack in the wafer derived as the estimated processing result.

公开(公告)号：US12269125B2

公开(公告)日：2025-04-08

申请号：US18288613

申请日：2022-01-25

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takafumi Ogiwara ,  Hayate Joan

IPC: B23K26/53 ,  B23K26/073 ,  G01N21/95 ,  H01L21/67

Abstract: A laser processing device includes: a laser irradiation unit; and a control unit. The control unit is configured to execute a first control to control the laser irradiation unit to form modified regions for division along each of lines extending in an X direction and cracks extending from the modified regions in a direction of a surface, a second control to control the laser irradiation unit to form modified regions for division along each of a plurality of lines in a Y direction and cracks extending from the modified regions in the direction of the surface, and a third control to control the laser irradiation unit to form cracks extending from a plurality of modified regions for suppressing warpage before the second control, the cracks being formed to reach a back surface and not to be continuous with the cracks extending from the modified regions for division.

公开(公告)号：US11806805B2

公开(公告)日：2023-11-07

申请号：US16614882

申请日：2018-05-17

Applicant: Kyoritsu Chemical & Co., Ltd. ,  HAMAMATSU PHOTONICS K.K.

Inventor： Mikiharu Kuchiki ,  Hidefumi Kinda ,  Daisuke Kurita ,  Takeshi Sakamoto ,  Takafumi Ogiwara ,  Yuta Kondoh ,  Naoki Uchiyama

IPC: B23K26/16 ,  B23K26/40 ,  H01L21/50 ,  H01L21/67 ,  H01L21/78 ,  B23K101/40 ,  B23K26/53

CPC classification number: B23K26/16 ,  B23K26/40 ,  B23K26/53 ,  H01L21/50 ,  H01L21/67092 ,  H01L21/78 ,  B23K2101/40

Abstract: A object cutting method includes a first step of attaching an expandable sheet to a front surface or a back surface of a object, a second step of irradiating the object with a laser light along a line to cut to form a modified region, and expanding the expandable sheet to divide at least a part of the object into a plurality of chips and to form a gap that exists between the chips and extends to a side surface crossing the front surface and the back surface of the object, a third step of, after the second step, filling the gap with a resin from an outer edge portion including the side surface of the object, a fourth step of, after the third step, curing and shrinking the resin, and a fifth step of, after the fourth step, taking out the chips from the expandable sheet.

公开(公告)号：US11380586B2

公开(公告)日：2022-07-05

申请号：US16632291

申请日：2018-07-18

Applicant: IWATANI CORPORATION ,  HAMAMATSU PHOTONICS K.K.

Inventor： Toshiki Manabe ,  Takehiko Senoo ,  Koichi Izumi ,  Tadashi Shojo ,  Takafumi Ogiwara ,  Takeshi Sakamoto

IPC: H01L21/78 ,  H01L21/268 ,  H01L21/3065

Abstract: A cutting method includes: forming a reformed region in a workpiece; and after forming the reformed region in the workpiece, forming a groove in the workpiece along an intended cut line. In the forming a groove, a first dry etching process is performed from a front surface toward a rear surface of the workpiece. After the first dry etching process, a first pressure-reducing process is performed in which the workpiece is placed under an atmosphere of reduced pressure as compared to pressure during the first dry etching process. After the first pressure-reducing process, a second dry etching process is performed from the front surface toward the rear surface of the workpiece.

公开(公告)号：US12246397B2

公开(公告)日：2025-03-11

申请号：US17641519

申请日：2020-09-09

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takafumi Ogiwara ,  Takeshi Sakamoto

IPC: B23K26/53 ,  B23K26/067 ,  H01L21/268 ,  H01L21/67 ,  B23K103/00 ,  G02F1/133

Abstract: A laser processing apparatus includes a support part, a light source, a spatial light modulator, a converging part, and a controller. The controller controls the spatial light modulator so that laser light is branched into a plurality of rays of processing light including 0th-order light and a plurality of converging points for the plurality of rays of processing light are located at positions different from each other in a Z direction and an X direction, and controls at least one of the support part and the converging part. The controller controls the spatial light modulator so that a converging point of the 0th-order light in the Z direction is located on an opposite side of a converging point of non-modulated light of the laser light with respect to an ideal converging point of the 0th-order light.

公开(公告)号：US11482455B2

公开(公告)日：2022-10-25

申请号：US16632298

申请日：2018-07-18

Applicant: IWATANI CORPORATION ,  HAMAMATSU PHOTONICS K.K.

Inventor： Toshiki Manabe ,  Takehiko Senoo ,  Koichi Izumi ,  Tadashi Shojo ,  Takafumi Ogiwara ,  Takeshi Sakamoto

IPC: H01L21/78 ,  B23K26/0622 ,  B23K26/364 ,  B23K26/53 ,  B23K26/06 ,  B23K26/08 ,  B23K26/12 ,  B23K26/402 ,  H01L21/268 ,  H01L21/3065 ,  B23K103/00 ,  B23K101/40

Abstract: A cutting method includes: forming a reformed region in a workpiece; and after forming the reformed region in the workpiece, cutting the workpiece along an intended cut line. In the cutting the workpiece, a dry etching process is performed from a front surface toward a rear surface of the workpiece while the workpiece is fixed on a support member at least under its own weight or by suction, to form a groove from the front surface to reach the rear surface of the workpiece.

公开(公告)号：US11103959B2

公开(公告)日：2021-08-31

申请号：US15763915

申请日：2016-08-09

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takafumi Ogiwara ,  Yuta Kondoh

IPC: B23K26/53 ,  B23K26/04 ,  B23K26/00 ,  B23K26/38 ,  B23K26/08 ,  B23K26/0622 ,  H01L21/78 ,  B23K103/00

Abstract: Provided is a laser processing method including a first step of forming a first modified region along a cutting line by converging laser light on an object having a surface and a back surface with the back surface as an incident surface and moving a first converging point along the cutting line set to pass between an effective region and an ineffective region adjacent to each other while maintaining a distance between a surface and the first converging point at a first distance, and a second step of forming a second modified region along the cutting line by converging the laser light on the object with the back surface as the incident surface and moving a second converging point along the cutting line while maintaining a distance between the surface and the second converging point at a second distance larger than the first distance.

公开(公告)号：US11007607B2

公开(公告)日：2021-05-18

申请号：US15301451

申请日：2015-03-30

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi Sakamoto ,  Takafumi Ogiwara

IPC: B23K26/53 ,  B23K26/064 ,  B23K26/03 ,  B23K26/082 ,  C03B33/02 ,  B23K26/0622 ,  B23K26/073 ,  B23K101/40 ,  B23K103/00 ,  C03B33/07

Abstract: A laser processing device includes a laser light source, a converging optical system, a controller, and a reflective spatial light modulator. The controller and the reflective spatial light modulator, while using an aberration as a reference aberration, the aberration occurring when laser light is converged at a converging position with an amount of aberration correction in a state in which an ideal converging position is shifted by a predetermined distance to a laser light entrance side from the converging position, adjusts the aberration such that a first converging length longer than a reference converging length of the reference aberration is obtained and a first converging intensity less than a reference converging intensity of the reference aberration is obtained, when a modified region is formed within a first region closest to a front face of an object to be processed.

公开(公告)号：US10755980B2

公开(公告)日：2020-08-25

申请号：US16388209

申请日：2019-04-18

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takafumi Ogiwara ,  Yuta Kondoh

IPC: H01L21/78 ,  B23K26/046 ,  B23K26/53 ,  H01L21/268 ,  H01L21/304 ,  H01L21/683 ,  H01L23/544 ,  H01L21/02 ,  B23K103/00

Abstract: Laser light is converged at an object including a semiconductor substrate formed with a plurality of functional devices on a front surface, from a back surface of the semiconductor substrate, and while a distance between the front surface and a first converging point of the laser light is maintained at a first distance, whereby a first modified region is formed along the line. The laser light is converged at the object from the back surface, and while a distance between the front surface and a second converging point is maintained at a second distance, and while the second converging point is offset with respect to a position at which the first converging point is converged, whereby a second modified region is formed along the line. A predetermined portion including the back surface and at least the second modified region is removed.