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公开(公告)号：US11931827B2
公开(公告)日：2024-03-19
申请号：US17263304
申请日：2020-06-22
发明人： Huanyin Xin , Zhongqian Li , Hong Chen , Jiangang Lu , Hongjiang Zhang , Jiangang Yin , Yunfeng Gao
IPC分类号： B23K26/38 , B23K26/00 , B23K26/06 , B23K26/067 , B23K26/08 , G02B27/09 , B23K101/40 , B23K101/42 , B23K103/00
CPC分类号： B23K26/38 , B23K26/0006 , B23K26/0608 , B23K26/0626 , B23K26/0648 , B23K26/0676 , B23K26/08 , G02B27/0916 , G02B27/0927 , G02B27/0955 , B23K2101/40 , B23K2101/42 , B23K2103/56
摘要： Provided are a laser cutting device and a laser cutting method. The laser cutting device comprises a beam expanding element provided with a plurality of lens sets, wherein optical axes of the plurality of lens sets are located in the same line and each lens set comprises at least one lens; the beam expanding element is configured to convert an incident beam into a first beam; and a spectroscopic element arranged on a light path of an emitted light of the beam expanding element, and wherein the spectroscopic element is configured to convert the first beam into multiple second beams that are annular and spaced apart from each other.
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公开(公告)号：US10981251B2
公开(公告)日：2021-04-20
申请号：US16094374
申请日：2016-06-08
发明人： Xuerui Yuan , Xiaojun Zhang , Lingtian Diao , Yuguo Peng , Jiangang Lu , Xiao Liu , Guodong Ma , Jiangang Tang , Jiangang Yin , Yunfeng Gao
IPC分类号： B23K26/53 , B23K26/06 , B23K26/0622 , B23K26/082 , B23K26/00 , B23K26/16 , B28D5/00
摘要： A method for cutting sapphire comprising a sapphire body and a coating formed on the sapphire body, the method comprising: focusing a first CO2 laser beam the coating via a CO2 focusing assembly to remove the coating with a predetermined thickness extending along a first path; wherein dust and debris generated during removal of the coating are removed while the coating is removed; focusing an ultrafast laser beam on the sapphire body via an optical path shaping assembly to form a plurality of restructuring channels distributed along a second path and penetrating through the sapphire; wherein the second path coincides with the first path; scanning, by the second CO2 laser beam, the sapphire body via a galvanometer focusing assembly, wherein a path of the second CO2 laser beam scanning the sapphire body via a galvanometer focusing assembly coincides with or deviates from the second path, so that the sapphire cracks along the restructuring channels.
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3.发明申请公开(公告)号：US20200238442A1
公开(公告)日：2020-07-30
申请号：US16838006
申请日：2020-04-01
发明人： XIAOJUN ZHANG , Xuerui Yuan , Pingping Yu , Jiangang Lu , Jiangang Yin , Yun Feng Gao
IPC分类号： B23K26/38 , B23K26/064 , B23K26/06 , B23K26/402 , C03B33/10 , B28B11/12
摘要： The present disclosure relates to a laser cutting field, and in particular to a laser cutting head for cutting hard, brittle products and a laser cutting device for cutting hard, brittle products. The laser cutting head includes a polarizing element, a binary phase element and a focusing element. The polarizing element, the binary phase element and the focusing element are disposed in sequence. The polarizing element, the binary phase element, and the focusing element are structured and configured together such that a laser light is configured to pass through the polarizing element to form a polarizing laser light that is emitted to the binary phase element, the binary phase element modulating phase of the polarizing laser light. A diffractive laser light is formed in a location of the binary phase element, which is emitted to the focusing element.
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公开(公告)号：US20190118306A1
公开(公告)日：2019-04-25
申请号：US16094374
申请日：2016-06-08
发明人： Xuerui Yuan , Xiaojun Zhang , Lingtian Diao , Yuguo Peng , Jiangang Lu , Xiao Liu , Guodong Ma , Jiangang Tang , Jiangang Yin , Yunfeng Gao
IPC分类号： B23K26/53 , B28D5/00 , B23K26/00 , B23K26/082 , B23K26/06 , B23K26/0622 , B23K26/16
摘要： A method for cutting sapphire comprising a sapphire body and a coating formed on the sapphire body, the method comprising: focusing a first CO2 laser beam the coating via a CO2 focusing assembly to remove the coating with a predetermined thickness extending along a first path; wherein dust and debris generated during removal of the coating are removed while the coating is removed; focusing an ultrafast laser beam on the sapphire body via an optical path shaping assembly to form a plurality of restructuring channels distributed along a second path and penetrating through the sapphire; wherein the second path coincides with the first path; scanning, by the second CO2 laser beam, the sapphire body via a galvanometer focusing assembly, wherein a path of the second CO2 laser beam scanning the sapphire body via a galvanometer focusing assembly coincides with or deviates from the second path, so that the sapphire cracks along the restructuring channels.
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