DISPLAY SUBSTRATE AND METHOD FOR MAKING THE SAME, DISPLAY APPARATUS

    公开(公告)号:US20200176711A1

    公开(公告)日:2020-06-04

    申请号:US16615110

    申请日:2019-05-07

    摘要: There is provided a display substrate, a manufacturing method thereof, and a display device, relating to the field of display technology. The display substrate includes: a base substrate; a self-luminescent layer disposed on a side of the base substrate; and an encapsulation film layer disposed on a side of the self-luminescent layer away from the base substrate. The display substrate has a gap, which penetrates through the self-luminescent layer and the encapsulation film layer, and separates the self-luminescent layer and the encapsulation film layer into at least two parts with a part corresponding to a to-be-perforated area of the display substrate and another part corresponds to a non-perforated area of the display substrate other than the to-be-perforated area. The edge of the encapsulation film layer adjacent to the gap covers the side surface of the edge of the self-luminescent layer adjacent to the gap.

    DISPLAY PANEL, METHOD FOR FABRICATING THE SAME, AND DISPLAY DEVICE

    公开(公告)号:US20190123115A1

    公开(公告)日:2019-04-25

    申请号:US16149707

    申请日:2018-10-02

    IPC分类号: H01L27/32 H01L51/00 H01L51/52

    摘要: The disclosure relates to a display panel, a method for fabricating the same, and a display device. The display panel includes: a base substrate, and a thin film transistor structure, an anode layer, a light-emitting layer, a cathode layer, and an encapsulation layer, which are arranged successively on the base substrate, wherein at least one installation hole for installing a hardware structure is arranged in a display area of the display panel, and the installation hole runs through the base substrate and the respective layers on the display panel in the direction perpendicular to the base substrate; and the edge of the installation hole is arranged with an encapsulation layer material, and the encapsulation layer material covers at least the light-emitting layer and the cathode layer adjacent to the edge of the installation hole, in the direction parallel to the base substrate.