Abstract:
A light-emitting diode (LED) is bonded to a pair of metal leads which are attached to a metal lead frame with a plurality of lead pairs, such that its optical axis is parallel to the longitudinal axis of the leads. The device so formed is encapsulated in two colors of plastic, a clear portion over the diode to transmit light from the diode and a dark portion behind the diode to improve the diode on-off contrast and make a hermetic seal with the leads. After encapsulation individual devices are separated from each other by cutting the leads from the lead frame.