公开(公告)号：US20240260188A1

公开(公告)日：2024-08-01

申请号：US18159930

申请日：2023-01-26

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Brian Mark Hostetler

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/40

CPC classification number: H05K1/115 ,  H05K1/0218 ,  H05K3/4038 ,  H05K2201/093 ,  H05K2201/09636 ,  H05K2201/10818 ,  H05K2201/10984

Abstract: An electronic device may comprise a printed circuit board (PCB) and a power source and processing circuitry mounted to the PCB. The PCB comprises one or more power planes and a plurality of power vias electrically connected to the power planes. The power sources are electrically connected to the power planes. The processing circuitry is electrically connected to the plurality of power vias through a plurality of interconnects. Respective diameters of the plurality of power vias vary based on location.