公开(公告)号：US20170325358A1

公开(公告)日：2017-11-09

申请号：US15525851

申请日：2014-11-14

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John FRANZ ,  Wade D VINSON ,  Tahir CADER

IPC: H05K7/20

CPC classification number: H05K7/20236 ,  H05K7/20272 ,  H05K7/20781

Abstract: The present disclosure provides a system including a cooling rack for servers, a first enclosure, and a second enclosure. The first enclosure can be coupled to the cooling rack for servers and houses electronics. The second enclosure can be coupled to the cooling rack for servers beneath the first enclosure with a minimal sliding clearance in between the two enclosures. The second enclosure also holds an electronics cartridge and connects to the cooling rack for servers via a slide that enables the second enclosure to slide out from under the first enclosure so that the electronics cartridge can be removed from a top of the enclosure. Further, the second enclosure may contain a fluid to immerse components and absorb heat from the electronics cartridge.

公开(公告)号：US20170303439A1

公开(公告)日：2017-10-19

申请号：US15512023

申请日：2014-09-30

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Tahir CADER ,  John P FRANZ ,  Wade D VINSON ,  Arlen L ROESNER ,  Kevin B LEIGH ,  Dave MAYER

IPC: H05K7/20 ,  H05K7/14 ,  H01R13/00

CPC classification number: H05K7/20736 ,  H01R13/005 ,  H05K7/1487 ,  H05K7/1492 ,  H05K7/20781 ,  H05K7/20836

Abstract: A modular utility assembly is provided herein. The modular utility assembly includes a power module, a network module, and a cooling module. The power module includes a power connector to mate with and provide power to an electronic module. The network module includes a network connector to mate with and provide a network connection between the network module and the electronic module. The cooling module includes a cooling connector to mate with and connect to a cooling component on the electronic module.

公开(公告)号：US20170231118A1

公开(公告)日：2017-08-10

申请号：US15329246

申请日：2014-07-31

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Tahir CADER ,  Wade D VINSON ,  Douglas Kent GARDAY ,  John P FRANZ

IPC: H05K7/20

Abstract: An apparatus is provided herein. The apparatus includes a sensor module and a control module. The sensor module to receive a measured environmental condition. The control module to use the measured environmental condition to determine a fluid temperature to cool a first set of components and determine an air temperature to cool a second set of components.