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公开(公告)号：US20170325358A1
公开(公告)日：2017-11-09
申请号：US15525851
申请日：2014-11-14
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： John FRANZ , Wade D VINSON , Tahir CADER
IPC: H05K7/20
CPC classification number: H05K7/20236 , H05K7/20272 , H05K7/20781
Abstract: The present disclosure provides a system including a cooling rack for servers, a first enclosure, and a second enclosure. The first enclosure can be coupled to the cooling rack for servers and houses electronics. The second enclosure can be coupled to the cooling rack for servers beneath the first enclosure with a minimal sliding clearance in between the two enclosures. The second enclosure also holds an electronics cartridge and connects to the cooling rack for servers via a slide that enables the second enclosure to slide out from under the first enclosure so that the electronics cartridge can be removed from a top of the enclosure. Further, the second enclosure may contain a fluid to immerse components and absorb heat from the electronics cartridge.
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公开(公告)号：US20190098798A1
公开(公告)日：2019-03-28
申请号：US15714811
申请日：2017-09-25
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： John FRANZ , Vincent W. MICHNA
Abstract: An example memory device includes a printed circuit board, a case, a bus, and memory modules. The case includes a number of walls, and at least some of the walls and the printed circuit board together form a liquid coolant chamber that is liquid-tight (excluding any hose connectors). The bus includes memory sockets connected to the printed circuit board and located within the liquid coolant chamber, and the memory modules are installed in the memory sockets and within the liquid coolant chamber. The bus also includes a connector to connect to a memory bus of a main printed circuit board of a computing device, the connector being external to the liquid coolant chamber.
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Patent Agency Ranking
公开(公告)号：US20180067506A1
公开(公告)日：2018-03-08
申请号：US15258871
申请日：2016-09-07
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Charles R. HANNA , Tahir CADER , John FRANZ
CPC classification number: G05D7/0676 , G06F1/20 , G06F1/206 , G06F2200/201 , H05K7/20772
Abstract: Examples include a module to power and control a pump to cool an electronic module. The module comprises an electronic module connector to connect to a printed circuit assembly of the electronic module. The connector transmits power to provide power to the pump and a control signal to control the pump. A controller may be electrically connected to the electronic module connector to receive the control signal to control the pump. The module may also comprise a first supply connector to connect to a first supply fluid line to provide fluid to the pump and a first return connector to connect to a first return fluid line to receive fluid from the pump. The module may also include a second supply connector to connect to a second supply fluid line and a second return connector to connect to a second return fluid line.
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公开(公告)号：US20170017277A1
公开(公告)日：2017-01-19
申请号：US15120423
申请日：2014-04-11
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： John FRANZ , Tahir CADER , Cullen E BASH , Niru KUMARI , Sarah ANTHONY , Sergio ESCOBAR-VARGAS , Siamak TAVALLAEI
CPC classification number: G06F1/20 , G06F2200/201 , H05K7/20509 , H05K7/20727 , H05K7/20736 , H05K7/20772 , H05K7/20781
Abstract: Apparatuses associated with liquid coolant supply are disclosed. One example apparatus is a computing cartridge which includes a first electronic device and a liquid-cooled cold plate. The computing cartridge also includes a first thermal couple between the first electronic device and the cold plate. The computing cartridge also includes an inlet fluid connector. The inlet fluid connector may supply a liquid coolant to the cold plate The computing cartridge also includes an outlet fluid connector. The outlet fluid connector may facilitate return of the coolant from the cold plate.
Abstract translation: 公开了与液体冷却剂供应相关的装置。 一个示例性装置是包括第一电子装置和液冷冷板的计算盒。 计算盒还包括第一电子装置和冷板之间的第一热耦合。 计算盒还包括入口流体连接器。 入口流体连接器可以向冷板供应液体冷却剂。计算盒还包括出口流体连接器。 出口流体连接器可以帮助冷却剂从冷板返回。
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公开(公告)号：US20160357233A1
公开(公告)日：2016-12-08
申请号：US15120511
申请日：2014-04-30
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Thomas Robert BOWDEN , Allen B DOERR , John FRANZ , Melvin K BENEDICT , Joseph ALLEN , John NORTON , Binh NGUYEN
CPC classification number: G06F1/206 , G06F1/185 , G06F1/20 , G06F13/42 , H01L23/367 , H01L23/4093 , H01L2924/0002 , H01L2924/00
Abstract: A thermal management assembly in accordance with one example may include a first thermal management member that includes a first main region that is continuous, a first connection region that is discontinuous, and a first top side. The thermal management assembly may also include a second thermal management member that includes a second main region, a second connection region, and a second top side. The second main region and the second connection region are continuous. The thermal management assembly may further include a connection member to couple the first thermal management member and the second thermal management member to a memory device via the first connection region and the second connection region. The first top side and the second top side are substantially level with a top side of the memory device in a horizontal direction when the first thermal management member and the second thermal management member are coupled to the memory device.
Abstract translation: 根据一个示例的热管理组件可以包括第一热管理构件，其包括连续的第一主区域，不连续的第一连接区域和第一顶侧面。 热管理组件还可以包括第二热管理构件，其包括第二主区域，第二连接区域和第二顶侧。 第二主区域和第二连接区域是连续的。 热管理组件还可以包括连接构件，用于经由第一连接区域和第二连接区域将第一热管理构件和第二热管理构件连接到存储装置。 当第一热管理构件和第二热管理构件联接到存储装置时，第一顶侧和第二顶侧基本上与存储装置的顶侧在水平方向平齐。
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公开(公告)号：US20210360824A1
公开(公告)日：2021-11-18
申请号：US16876804
申请日：2020-05-18
Applicant: Hewlett Packard Enterprise Development LP
Inventor： John FRANZ , Harvey LUNSMAN
Abstract: A non-circular disconnect, comprising: a male body to insert into a non-circular female disconnect; a male poppet, wherein: when the non-circular disconnect is not inserted into the non-circular female disconnect, the male poppet is held in place, via spring force, at an opening of the non-circular male body to create a seal to prevent leakage; and when the non-circular disconnect is inserted into the non-circular female disconnect, the male poppet is pushed inwards, to allow for liquid to flow through the non-circular disconnect, by a plunger in the non-circular female disconnect.
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公开(公告)号：US20190037724A1
公开(公告)日：2019-01-31
申请号：US16072156
申请日：2016-01-29
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： John FRANZ
Abstract: Examples herein disclose a power system including a power distribution unit (PDU) rack and a power module. The PDU rack is positioned in vertically in a server rack to distribute power to the power module. The power module is positioned horizontally in a server rack and includes multiple connectors. The power module is coupled perpendicularly to the PDU rack and receives power cables for delivering power to multiple servers in the server rack.
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