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    PRINTED CIRCUIT BOARD ASSEMBLY
    2.
    发明申请
    PRINTED CIRCUIT BOARD ASSEMBLY 审中-公开
    印刷电路板组装

    公开(公告)号：US20160334594A1

    公开(公告)日：2016-11-17

    申请号：US15112363

    申请日：2014-01-31

    Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

    Inventor： Kevin B LEIGH ,  Paul Kessler ROSENBERG ,  George D MEGASON

    IPC: G02B6/42

    CPC classification number: G02B6/4292 ,  G02B6/4245 ,  G02B6/4249 ,  G02B6/4269 ,  G02B6/428 ,  G02B6/4284 ,  G02B6/43

    Abstract: An optoelectronic assembly for a printed circuit board (PCB) assembly is described herein. The optoelectronic assembly may include a component carrier for mounting an active component, and a connector assembly for achieving a coupling between the component carrier and PCB-side optical infrastructure on a printed circuit board (PCB). The connector assembly can include a plurality of optical fibers connected to the component carrier, a first optical connector connected to the optical fibers for coupling with the PCB-side optical infrastructure on the PCB, and a housing member for housing the optical fibers and the first optical connector.

    Abstract translation: 本文描述了用于印刷电路板（PCB）组件的光电组件。 光电组件可以包括用于安装有源部件的部件载体和用于实现印刷电路板（PCB）上的部件载体和PCB侧光学基础设施之间的耦合的连接器组件。 连接器组件可以包括连接到部件载体的多个光纤，连接到光纤的第一光连接器，用于与PCB上的PCB侧光学基础设施耦合，以及用于容纳光纤的壳体部件和第一 光连接器

    REMOVABLE MODULE
    5.
    发明申请
    REMOVABLE MODULE 审中-公开

    公开(公告)号：US20180278332A1

    公开(公告)日：2018-09-27

    申请号：US15765018

    申请日：2015-10-01

    Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

    Inventor： Kevin B LEIGH ,  John NORTON

    IPC: H04B10/40 ,  H04B10/25 ,  H04B10/80 ,  G02B6/42

    CPC classification number: H04B10/40 ,  G02B6/4261 ,  G02B6/4268 ,  G02B6/428 ,  G02B6/4284 ,  G02B6/4292 ,  H04B10/25 ,  H04B10/801 ,  H04Q11/00 ,  H04Q2213/13098

    Abstract: One example of a removable module includes an optical transceiver, optical cables, electrical cables, a power conditioner, and a housing. The optical transceiver converts optical signals received through an optical cable to electrical signals to distribute to a plurality of computing devices through electrical cables and converts electrical signals received from the plurality of computing devices through the electrical cables to optical signals to transmit through the optical cable. The power conditioner receives power from a system with the removable module installed in the system to provide power to the optical transceiver. The housing encloses the optical transceiver and the power conditioner and includes an air intake port and an air exhaust vent. The housing is received by a bay of the system, which provides an interface to the power conditioner and provides air to the air intake port with the removable module installed in the system.

    OPTICAL SIGNALS
    7.
    发明申请
    OPTICAL SIGNALS 审中-公开

    公开(公告)号：US20190028784A1

    公开(公告)日：2019-01-24

    申请号：US15752247

    申请日：2015-08-14

    Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

    Inventor： Kevin B LEIGH

    IPC: H04Q11/00

    CPC classification number: H04Q11/0005 ,  H04J14/0257 ,  H04J14/028 ,  H04Q11/00 ,  H04Q2011/0016 ,  H04Q2011/0039 ,  H04Q2011/0041 ,  H04Q2213/1301 ,  H04Q2213/13292 ,  H04Q2213/1332

    Abstract: Examples disclosed herein relate, in one aspect to a method. The method may include determining an input bandwidth capacity of a network device comprising a network device port coupled to a plurality of computing devices; based on the input bandwidth capacity; generating a management signal, the management signal indicating a set of output lanes for each of the plurality of computing devices and indicating a different wavelength for each of the set of output lanes of each of a plurality of computing devices; sending the management signal to the plurality of computing devices through an optical bus; and receiving, through the optical bus, an optical signal comprising, for each computing device, a set of output signals from the set of output lanes indicated by the management signal, each output signal being represented by a wavelength indicated by the management signal.

    MODULAR BACKPLANES
    8.
    发明申请
    MODULAR BACKPLANES 审中-公开

    公开(公告)号：US20180287713A1

    公开(公告)日：2018-10-04

    申请号：US15472479

    申请日：2017-03-29

    Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

    Inventor： Kevin B LEIGH ,  John NORTON

    IPC: H04B10/80 ,  H04Q11/00

    CPC classification number: H04B10/801 ,  H04B10/808 ,  H04Q11/0071

    Abstract: An example modular backplane device that transforms signals is described. The example disclosed herein comprises a plurality of interface connectors evenly distributed on a first side of a housing of the modular backplane to transfer a plurality of first signals. The example further comprises one or more aggregation point connectors on an edge of the first side of the housing of the modular backplane to transfer data, transfer management information, and receive electrical power. The modular backplane device example also comprises a logic board coupled to the plurality of interface connectors and to the one or more aggregation point connectors. The logic board is to transform signals and comprises signal transformation logic and a management processor.

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