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    MODULAR RACK SYSTEM
    3.
    发明申请
    MODULAR RACK SYSTEM 有权
    模块化机架系统

    公开(公告)号：US20150359131A1

    公开(公告)日：2015-12-10

    申请号：US14690200

    申请日：2012-10-31

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： David A Moore ,  John P Franz ,  Tahir Cader ,  Michael L Sabotta

    IPC: H05K7/14 ,  H05K7/18

    CPC classification number: H05K7/1492 ,  H05K7/14 ,  H05K7/1488 ,  H05K7/18

    Abstract: In one implementation of a modular rack system, a rack module (22, 24, 222, 522, 722, 724) comprises a bay (30, 730) comprising a first side wall (32, 732), a second side wall (32, 732) and floor (36, 736) and an intermediate wall positioning mechanism (280, 380, 390, 392, 790, 792) to support a wall (282,782) at different spacings with respect to the first side wall (32, 732). In another implementation of the modular rack system, a utility bay (148) extends across rack modules (22, 24, 222, 522, 722, 724).

    Abstract translation: 在模块化机架系统的一个实现中，机架模块（22,24,222,522,722,724）包括包括第一侧壁（32,732），第二侧壁（32），第二侧壁 ，732）和地板（36,736）以及中间壁定位机构（280,380,390,392,790,792），以相对于所述第一侧壁（32,732）以不同间隔支撑壁（282,782） ）。 在模块化机架系统的另一实施方式中，工作台（148）跨越机架模块（22,24,222,522,722,724）延伸。

    LIQUID COOLING
    5.
    发明申请
    LIQUID COOLING 有权
    液体冷却

    公开(公告)号：US20150369544A1

    公开(公告)日：2015-12-24

    申请号：US14764341

    申请日：2013-01-31

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： John P. Franz ,  Tahir Cader ,  Michael L Sabotta ,  David A Moore

    IPC: F28F1/40

    CPC classification number: F28F1/40 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20254 ,  H05K7/20781 ,  H01L2924/00

    Abstract: An assembly for liquid cooling is provided herein. The assembly includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.

    Abstract translation: 本文提供了用于液体冷却的组件。 组件包括热构件，支撑构件和衬垫。 热构件包括由导热材料形成的冷却销的阵列，以从热构件延伸。 支撑构件包括入口通道和出口通道。 用于向冷却销阵列提供流体的入口通道。 从冷却销阵列接收流体的出口通道。 加热构件和支撑构件之间的垫圈以形成冷却通道，其间具有流体密封。

    Lever unit
    6.
    发明授权
    Lever unit 有权

    公开(公告)号：US09730356B2

    公开(公告)日：2017-08-08

    申请号：US14901346

    申请日：2013-06-28

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： John P Franz ,  Michael L Sabotta ,  David A Moore ,  Tahir Cader ,  Alan B Doerr

    IPC: H05K7/14 ,  H05K7/20 ,  G11B33/12

    CPC classification number: H05K7/1487 ,  G11B33/128 ,  H05K7/1404 ,  H05K7/1489 ,  H05K7/20709

    Abstract: An assembly to connect two electronic components is provided herein. The assembly includes a lever unit with a lever and a base. The lever includes a primary cam member and a secondary cam member connected thereto. The lever also includes a hook member extending therefrom. The base includes a guide structure to engage with a drive pin. Rotation of the lever to move a first electronic component along a y-axis towards, a backplane. The secondary cam member to move the drive pin along the guide structure, and the hook member to engage with a second electronic component and mate the first electronic component and the second electronic component along the second axis.

    HEAT REMOVAL ASSEMBLY
    7.
    发明申请
    HEAT REMOVAL ASSEMBLY 审中-公开
    加热组件

    公开(公告)号：US20150354901A1

    公开(公告)日：2015-12-10

    申请号：US14650571

    申请日：2012-12-19

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： David A Moore ,  John P Franz ,  Tahir Cader ,  Michael L Sabotta

    IPC: F28D15/02

    CPC classification number: F28D15/02 ,  F28D15/0208 ,  F28D15/0275 ,  F28D15/04 ,  F28F2280/105 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A heat removal assembly is provided herein. The heat removal assembly includes an evaporator block, a heat pipe, and a condenser plate. The evaporator block removes heat from an electronic component. The evaporator block engages with the electronic component and forms a thermal connection therebetween that removes the heat from the electronic component. The heat pipe connects to the evaporator block to remove heat from the evaporator block. The condenser plate connects to the heat pipe and receives heat from the heat pipe. The condenser plate includes a thermal mating surface that mates with a thermal member, such that the heat is removed from the assembly via the thermal mating surface.

    Abstract translation: 本文提供散热组件。 除热组件包括蒸发器块，热管和冷凝器板。 蒸发器块从电子部件移除热量。 蒸发器块与电子部件接合并在其间形成热连接，从而从电子部件移除热量。 热管连接到蒸发器块以从蒸发器块移除热量。 冷凝器板连接到热管并从热管接收热量。 冷凝器板包括与热构件配合的热配合表面，使得热量经由热配合表面从组件移除。

    HEAT DISSIPATING SYSTEM
    8.
    发明申请
    HEAT DISSIPATING SYSTEM 审中-公开
    热灭火系统

    公开(公告)号：US20140376178A1

    公开(公告)日：2014-12-25

    申请号：US14376124

    申请日：2012-02-09

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： David A Moore ,  John P. Franz ,  Tahir Cader ,  Michael L. Sabotta

    IPC: H05K7/20 ,  H02G5/10

    CPC classification number: H05K7/20781 ,  G06F1/20 ,  G06F2200/201 ,  H02G5/10 ,  H05K7/2079 ,  H05K7/20818 ,  H05K7/20827

    Abstract: Heat dissipating system and method are disclosed. An example method includes removing heat from a rack component via a thermal transport. The method also includes applying a pressure at a fluid cooled thermal bus bar on a rack system to form a thermally conductive dry disconnect interface and form a heat path between the thermal transport and the fluid cooled thermal bus bar.

    Abstract translation: 公开了散热系统和方法。 示例性方法包括经由热传输从机架部件移除热量。 该方法还包括在机架系统上的流体冷却热汇流条上施加压力以形成导热干式断开接口，并在热传输和流体冷却的热汇流条之间形成热路径。

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