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    HEAT DISSIPATING SYSTEM
    1.
    发明申请
    HEAT DISSIPATING SYSTEM 审中-公开
    热灭火系统

    公开(公告)号：US20140376178A1

    公开(公告)日：2014-12-25

    申请号：US14376124

    申请日：2012-02-09

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： David A Moore ,  John P. Franz ,  Tahir Cader ,  Michael L. Sabotta

    IPC: H05K7/20 ,  H02G5/10

    CPC classification number: H05K7/20781 ,  G06F1/20 ,  G06F2200/201 ,  H02G5/10 ,  H05K7/2079 ,  H05K7/20818 ,  H05K7/20827

    Abstract: Heat dissipating system and method are disclosed. An example method includes removing heat from a rack component via a thermal transport. The method also includes applying a pressure at a fluid cooled thermal bus bar on a rack system to form a thermally conductive dry disconnect interface and form a heat path between the thermal transport and the fluid cooled thermal bus bar.

    Abstract translation: 公开了散热系统和方法。 示例性方法包括经由热传输从机架部件移除热量。 该方法还包括在机架系统上的流体冷却热汇流条上施加压力以形成导热干式断开接口，并在热传输和流体冷却的热汇流条之间形成热路径。

    LEVER UNIT
    2.
    发明申请
    LEVER UNIT 有权
    杠杆单位

    公开(公告)号：US20160157376A1

    公开(公告)日：2016-06-02

    申请号：US14901346

    申请日：2013-06-28

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： John P. Franz ,  Michael L. Sabotta ,  David A. Moore ,  Tahir Cader ,  Alan B. Doerr

    IPC: H05K7/14 ,  H05K7/20

    CPC classification number: H05K7/1487 ,  G11B33/128 ,  H05K7/1404 ,  H05K7/1489 ,  H05K7/20709

    Abstract: An assembly to connect two electronic components is provided herein. The assembly includes a lever unit with a lever and a base. The lever includes a primary cam member and a secondary cam member connected thereto. The lever also includes a hook member extending therefrom. The base includes a guide structure to engage with a drive pin. Rotation of the lever to move a first electronic component along a y-axis towards, a backplane. The secondary cam member to move the drive pin along the guide structure, and the hook member to engage with a second electronic component and mate the first electronic component and the second electronic component along the second axis.

    Abstract translation: 本文提供了用于连接两个电子部件的组件。 组件包括具有杠杆和底座的杠杆单元。 杠杆包括主凸轮构件和与其连接的次级凸轮构件。 杠杆还包括从其延伸的钩构件。 基座包括与驱动销接合的引导结构。 杠杆的旋转以使第一电子部件沿y轴向背板移动。 副凸轮构件沿着导向结构移动驱动销，并且钩构件与第二电子部件接合并且沿着第二轴线配合第一电子部件和第二电子部件。

    SERVER RACK LIFT
    3.
    发明申请
    SERVER RACK LIFT 有权
    服务器机架提升

    公开(公告)号：US20160121915A1

    公开(公告)日：2016-05-05

    申请号：US14530539

    申请日：2014-10-31

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Suzie Mkandawire ,  Alan B. Doerr ,  John P. Franz ,  Michael L. Sabotta ,  Jeffery M. Giardina

    IPC: B62B3/02 ,  B65G1/04 ,  B62B5/00

    CPC classification number: B62B3/02 ,  B62B5/0083

    Abstract: An example of a server rack lifting apparatus can include a first side portion, a second side portion opposing the first side portion, a back portion connecting the first side portion to the second side portion, a first lifting surface associated with the first side portion to engage a portion of a server rack, a second lifting surface associated with the second side portion to engage an opposing portion of the server rack, and a motive component to adjust a height of the first and second lifting surfaces.

    Abstract translation: 服务器机架提升装置的一个例子可以包括第一侧部分，与第一侧部分相对的第二侧部分，连接第一侧部分到第二侧部分的后部，与第一侧部分相关联的第一提升表面， 接合服务器机架的一部分，与第二侧部相关联的第二提升表面以接合服务器机架的相对部分，以及用于调整第一和第二提升表面的高度的动力部件。

    LIQUID COOLING
    4.
    发明申请
    LIQUID COOLING 有权
    液体冷却

    公开(公告)号：US20150369544A1

    公开(公告)日：2015-12-24

    申请号：US14764341

    申请日：2013-01-31

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： John P. Franz ,  Tahir Cader ,  Michael L Sabotta ,  David A Moore

    IPC: F28F1/40

    CPC classification number: F28F1/40 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20254 ,  H05K7/20781 ,  H01L2924/00

    Abstract: An assembly for liquid cooling is provided herein. The assembly includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.

    Abstract translation: 本文提供了用于液体冷却的组件。 组件包括热构件，支撑构件和衬垫。 热构件包括由导热材料形成的冷却销的阵列，以从热构件延伸。 支撑构件包括入口通道和出口通道。 用于向冷却销阵列提供流体的入口通道。 从冷却销阵列接收流体的出口通道。 加热构件和支撑构件之间的垫圈以形成冷却通道，其间具有流体密封。

    THERMALLY ACTUATED VALVE
    5.
    发明申请
    THERMALLY ACTUATED VALVE 有权
    热启动阀

    公开(公告)号：US20140174545A1

    公开(公告)日：2014-06-26

    申请号：US13724085

    申请日：2012-12-21

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： John P. Franz ,  Michael Lawrence Sabotta ,  Tahir Cader

    IPC: F16K17/38

    CPC classification number: F16K17/38 ,  F16K31/025 ,  Y10T137/0324 ,  Y10T137/7737

    Abstract: A thermally actuated valve is provided herein. The thermally actuated valve includes a valve fitting, a valve body, and a movement control mechanism. The valve fitting includes an active member to selectively activate based on an input. The valve body includes a passive wax member that moves between a passive contraction state and a passive expansion state based on a passive temperature. The movement control mechanism is disposed between the valve fitting and the valve body. The movement control mechanism controls movement of the valve body between an open state and a dosed state based on movement of at least one of the active member and the passive wax member.

    Abstract translation: 本文提供热致动阀。 热致动阀包括阀配件，阀体和移动控制机构。 阀配件包括有源构件，用于基于输入选择性地启动。 阀体包括基于被动温度在被动收缩状态和被动膨胀状态之间移动的被动蜡构件。 移动控制机构设置在阀配件和阀体之间。 移动控制机构基于活动构件和被动蜡构件中的至少一个的移动来控制阀体在打开状态和打剂状态之间的移动。

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