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    Lever unit
    1.
    发明授权
    Lever unit 有权

    公开(公告)号：US09730356B2

    公开(公告)日：2017-08-08

    申请号：US14901346

    申请日：2013-06-28

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： John P Franz ,  Michael L Sabotta ,  David A Moore ,  Tahir Cader ,  Alan B Doerr

    IPC: H05K7/14 ,  H05K7/20 ,  G11B33/12

    CPC classification number: H05K7/1487 ,  G11B33/128 ,  H05K7/1404 ,  H05K7/1489 ,  H05K7/20709

    Abstract: An assembly to connect two electronic components is provided herein. The assembly includes a lever unit with a lever and a base. The lever includes a primary cam member and a secondary cam member connected thereto. The lever also includes a hook member extending therefrom. The base includes a guide structure to engage with a drive pin. Rotation of the lever to move a first electronic component along a y-axis towards, a backplane. The secondary cam member to move the drive pin along the guide structure, and the hook member to engage with a second electronic component and mate the first electronic component and the second electronic component along the second axis.

    HEAT REMOVAL ASSEMBLY
    2.
    发明申请
    HEAT REMOVAL ASSEMBLY 审中-公开
    加热组件

    公开(公告)号：US20150354901A1

    公开(公告)日：2015-12-10

    申请号：US14650571

    申请日：2012-12-19

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： David A Moore ,  John P Franz ,  Tahir Cader ,  Michael L Sabotta

    IPC: F28D15/02

    CPC classification number: F28D15/02 ,  F28D15/0208 ,  F28D15/0275 ,  F28D15/04 ,  F28F2280/105 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A heat removal assembly is provided herein. The heat removal assembly includes an evaporator block, a heat pipe, and a condenser plate. The evaporator block removes heat from an electronic component. The evaporator block engages with the electronic component and forms a thermal connection therebetween that removes the heat from the electronic component. The heat pipe connects to the evaporator block to remove heat from the evaporator block. The condenser plate connects to the heat pipe and receives heat from the heat pipe. The condenser plate includes a thermal mating surface that mates with a thermal member, such that the heat is removed from the assembly via the thermal mating surface.

    Abstract translation: 本文提供散热组件。 除热组件包括蒸发器块，热管和冷凝器板。 蒸发器块从电子部件移除热量。 蒸发器块与电子部件接合并在其间形成热连接，从而从电子部件移除热量。 热管连接到蒸发器块以从蒸发器块移除热量。 冷凝器板连接到热管并从热管接收热量。 冷凝器板包括与热构件配合的热配合表面，使得热量经由热配合表面从组件移除。

    HEAT DISSIPATING SYSTEM
    3.
    发明申请
    HEAT DISSIPATING SYSTEM 审中-公开
    热灭火系统

    公开(公告)号：US20140376178A1

    公开(公告)日：2014-12-25

    申请号：US14376124

    申请日：2012-02-09

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： David A Moore ,  John P. Franz ,  Tahir Cader ,  Michael L. Sabotta

    IPC: H05K7/20 ,  H02G5/10

    CPC classification number: H05K7/20781 ,  G06F1/20 ,  G06F2200/201 ,  H02G5/10 ,  H05K7/2079 ,  H05K7/20818 ,  H05K7/20827

    Abstract: Heat dissipating system and method are disclosed. An example method includes removing heat from a rack component via a thermal transport. The method also includes applying a pressure at a fluid cooled thermal bus bar on a rack system to form a thermally conductive dry disconnect interface and form a heat path between the thermal transport and the fluid cooled thermal bus bar.

    Abstract translation: 公开了散热系统和方法。 示例性方法包括经由热传输从机架部件移除热量。 该方法还包括在机架系统上的流体冷却热汇流条上施加压力以形成导热干式断开接口，并在热传输和流体冷却的热汇流条之间形成热路径。

    ELECTRONIC APPARATUS HAVING A COOLING APPARATUS
    5.
    发明申请
    ELECTRONIC APPARATUS HAVING A COOLING APPARATUS 有权
    具有冷却装置的电子装置

    公开(公告)号：US20160066472A1

    公开(公告)日：2016-03-03

    申请号：US14780482

    申请日：2013-03-29

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Tahir Cader ,  Niru Kumari ,  John Franz ,  Cullen E. Bash ,  David A. Moore ,  Sergio Escobar-Vargas

    IPC: H05K7/20

    CPC classification number: H05K7/20263 ,  F28D15/025 ,  F28D15/0266 ,  F28D15/04 ,  F28D15/06 ,  F28D2021/0028 ,  G06F1/20 ,  G06F1/206 ,  G06F2200/201 ,  H01L23/427 ,  H05K7/20272 ,  H05K7/20281 ,  H05K7/20836 ,  Y02D10/16

    Abstract: According to an example, a cooling system includes a cooling fluid reservoir, a cooling apparatus in fluid communication with the cooling fluid reservoir, a chamber having a side in thermal contact with a portion of the heat generating component, in which cooling fluid delivered by the cooling apparatus is to be heated through receipt of heat from the heat generating component, a cooling plate positioned at a distance and separated from the chamber, and a cooling fluid tube connecting the chamber and the cooling plate, in which the heated cooling fluid is to flow through the cooling fluid tube to the cooling plate. The cooling plate is also to be in thermal contact with a heat exchanger that that is to remove heat from the cooling fluid.

    Abstract translation: 根据一个实例，冷却系统包括冷却流体储存器，与冷却流体储存器流体连通的冷却装置，具有与发热部件的一部分热接触的一侧的室，其中由 冷却装置将通过从发热部件接收热量，一定距离并与腔室分离的冷却板加热，以及连接腔室和冷却板的冷却流体管，其中加热的冷却流体为 流经冷却流体管至冷却板。 冷却板也将与热交换器热接触，热交换器是从冷却流体中除去热量。

    Data center canopy including turning vanes
    8.
    发明授权
    Data center canopy including turning vanes 有权
    数据中心冠层包括转动叶片

    公开(公告)号：US09545034B2

    公开(公告)日：2017-01-10

    申请号：US14797708

    申请日：2015-07-13

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Matthew Richard Slaby ,  Felipe Visbal ,  Tahir Cader

    IPC: H05K7/20 ,  F24F7/08

    CPC classification number: H05K7/20745 ,  F24F7/08 ,  H05K7/20181

    Abstract: Examples provide data center canopies, data center housings, and data centers including turning vanes to facilitate air flow. In some examples, a data center canopy may include turning vanes to direct portions of an exhaust flow from an exhaust inlet toward floor sections to be output via exhaust outlets opposite the floor sections. Other examples are described and claimed.

    Abstract translation: 示例提供数据中心檐篷，数据中心外壳和数据中心，包括转向叶片以促进气流。 在一些示例中，数据中心冠层可以包括转向叶片以将废气流的一部分从排气入口引导到地板部分，以通过与地板部分相对的排气出口输出。 其他的例子被描述和要求保护。

    DATA CENTER CANOPY INCLUDING TURNING VANES
    9.
    发明申请
    DATA CENTER CANOPY INCLUDING TURNING VANES 有权
    数据中心包括滚动窗口

    公开(公告)号：US20160100507A1

    公开(公告)日：2016-04-07

    申请号：US14797708

    申请日：2015-07-13

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Matthew Richard Slaby ,  Felipe Visbal ,  Tahir Cader

    IPC: H05K7/20 ,  F24F7/08

    CPC classification number: H05K7/20745 ,  F24F7/08 ,  H05K7/20181

    Abstract: Examples provide data center canopies, data center housings, and data centers including turning vanes to facilitate air flow. In some examples, a data center canopy may include turning vanes to direct portions of an exhaust flow from an exhaust inlet toward floor sections to be output via exhaust outlets opposite the floor sections. Other examples are described and claimed.

    Abstract translation: 示例提供数据中心檐篷，数据中心外壳和数据中心，包括转向叶片以促进气流。 在一些示例中，数据中心冠层可以包括转向叶片以将废气流的一部分从排气入口引导到地板部分，以通过与地板部分相对的排气出口输出。 其他的例子被描述和要求保护。

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