公开(公告)号：US11453222B2

公开(公告)日：2022-09-27

申请号：US16959375

申请日：2019-10-25

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： James Michael Gardner ,  Sirena Lu ,  Frank D. Derryberry ,  Michael W. Cumbie

IPC: B41J2/175

Abstract: A liquid level sensor package for a replaceable print liquid reservoir, the package including a number of heater circuits, each heater circuit including a heater element to dissipate heat and a number of control devices, each control device individually controllable to be electrically connected to the heater element, the heater element to dissipate a different amount of heat when electrically connected to different ones of the control devices.

公开(公告)号：US11807005B2

公开(公告)日：2023-11-07

申请号：US18127619

申请日：2023-03-28

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Galen Cook ,  Garrett E. Clark ,  Michael W. Cumbie ,  James R. Przybyla ,  Richard Seaver ,  Frank D. Derryberry ,  Si-Lam J. Choy

IPC: B41J2/14 ,  B41J2/145

CPC classification number: B41J2/145 ,  B41J2/14 ,  B41J2002/14459 ,  B41J2202/12 ,  B41J2202/20

Abstract: In some examples, a fluid ejection die includes a plurality of nozzles arranged in a plurality of nozzle columns, the plurality of nozzle columns distributed across a width of the fluid ejection die in a staggered manner, wherein nozzles of each respective nozzle column of the plurality of nozzle columns are spaced apart along a length of the fluid ejection die, wherein the plurality of nozzle columns includes a first pair of neighboring nozzle columns that are spaced by a first distance across the width. The plurality of nozzle columns includes a second pair of neighboring nozzle columns that are spaced by a second distance across the width, the second distance being larger than the first distance.

公开(公告)号：US11712896B2

公开(公告)日：2023-08-01

申请号：US17713200

申请日：2022-04-04

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Galen Cook ,  Garrett E. Clark ,  Michael W. Cumbie ,  James R. Przybyla ,  Richard Seaver ,  Frank D. Derryberry ,  Si-Iam J. Choy

IPC: B41J2/145 ,  B41J2/14

CPC classification number: B41J2/145 ,  B41J2/14427 ,  B41J2/14145 ,  B41J2002/14459 ,  B41J2202/12 ,  B41J2202/20

Abstract: Examples include a fluid ejection device. The fluid ejection device includes a fluid ejection die with a die length and a die width, the fluid ejection die being coupled with a support structure having a fluid supply channel therethrough. The fluid ejection die includes a plurality of nozzles arranged in columns at die length positions along the die length and die width positions along the die width such that only one nozzle is positioned at each die length position. A fluid ejection chamber is coupled with each respective nozzle of the plurality of nozzles, and fluid feed hole fluidically coupled with the fluid supply channel and each respective ejection chamber.

公开(公告)号：US20230234355A1

公开(公告)日：2023-07-27

申请号：US18127619

申请日：2023-03-28

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Galen Cook ,  Garrett E. Clark ,  Michael W. Cumbie ,  James R. Przybyla ,  Richard Seaver ,  Frank D. Derryberry ,  Si-lam J. Choy

IPC: B41J2/145 ,  B41J2/14

CPC classification number: B41J2/145 ,  B41J2/14 ,  B41J2002/14459 ,  B41J2202/12 ,  B41J2202/20

Abstract: In some examples, a fluid ejection die includes a plurality of nozzles arranged in a plurality of nozzle columns, the plurality of nozzle columns distributed across a width of the fluid ejection die in a staggered manner, wherein nozzles of each respective nozzle column of the plurality of nozzle columns are spaced apart along a length of the fluid ejection die, wherein the plurality of nozzle columns includes a first pair of neighboring nozzle columns that are spaced by a first distance across the width. The plurality of nozzle columns includes a second pair of neighboring nozzle columns that are spaced by a second distance across the width, the second distance being larger than the first distance.

公开(公告)号：US20220227131A1

公开(公告)日：2022-07-21

申请号：US17713200

申请日：2022-04-04

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Galen Cook ,  Garrett E. Clark ,  Michael W. Cumbie ,  James R. Przybyla ,  Richard Seaver ,  Frank D. Derryberry ,  Si-Iam J. Choy

IPC: B41J2/145 ,  B41J2/14

Abstract: Examples include a fluid ejection device. The fluid ejection device includes a fluid ejection die with a die length and a die width, the fluid ejection die being coupled with a support structure having a fluid supply channel therethrough. The fluid ejection die includes a plurality of nozzles arranged in columns at die length positions along the die length and die width positions along the die width such that only one nozzle is positioned at each die length position. A fluid ejection chamber is coupled with each respective nozzle of the plurality of nozzles, and fluid feed hole fluidically coupled with the fluid supply channel and each respective ejection chamber.