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公开(公告)号:US20180039308A1
公开(公告)日:2018-02-08
申请号:US15546951
申请日:2015-04-20
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: David A. Moore , Kianoush Naeli , Valerie J. Marty , James McKinnell
Abstract: An electronic device includes a housing enclosure, which at least sealingly contains an electronic component, a barrier, a pump, and a coolant. The electronic component is located on a substrate, while the barrier defines a circulation loop in which the coolant is exposed to the electronic component. The pump is positioned within the circulation loop to cause flow of the coolant through the circulation loop.
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公开(公告)号:US20160157376A1
公开(公告)日:2016-06-02
申请号:US14901346
申请日:2013-06-28
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: John P. Franz , Michael L. Sabotta , David A. Moore , Tahir Cader , Alan B. Doerr
CPC classification number: H05K7/1487 , G11B33/128 , H05K7/1404 , H05K7/1489 , H05K7/20709
Abstract: An assembly to connect two electronic components is provided herein. The assembly includes a lever unit with a lever and a base. The lever includes a primary cam member and a secondary cam member connected thereto. The lever also includes a hook member extending therefrom. The base includes a guide structure to engage with a drive pin. Rotation of the lever to move a first electronic component along a y-axis towards, a backplane. The secondary cam member to move the drive pin along the guide structure, and the hook member to engage with a second electronic component and mate the first electronic component and the second electronic component along the second axis.
Abstract translation: 本文提供了用于连接两个电子部件的组件。 组件包括具有杠杆和底座的杠杆单元。 杠杆包括主凸轮构件和与其连接的次级凸轮构件。 杠杆还包括从其延伸的钩构件。 基座包括与驱动销接合的引导结构。 杠杆的旋转以使第一电子部件沿y轴向背板移动。 副凸轮构件沿着导向结构移动驱动销,并且钩构件与第二电子部件接合并且沿着第二轴线配合第一电子部件和第二电子部件。
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公开(公告)号:US20180030977A1
公开(公告)日:2018-02-01
申请号:US15546992
申请日:2015-04-20
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Kianoush Naeli , David A. Moore
CPC classification number: F04B43/043 , B41J2/17596 , F04B53/10 , G06F1/20 , G06F1/203 , G06F2200/201 , H05K7/20272
Abstract: A pump includes a main chamber and a pair of valves on opposite ends of the main chamber. The respective valves each contain a freely movable member to selectively open and close each respective valve, wherein the freely movable member is formed from at least some of the same material used to form a chamber portion of the respective valves. A force applicator is coupled relative to the main chamber to alternately induce a suction action and an expulsion action.
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公开(公告)号:US10684662B2
公开(公告)日:2020-06-16
申请号:US15546951
申请日:2015-04-20
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: David A. Moore , Kianoush Naeli , Valerie J. Marty , James McKinnell
IPC: G06F1/20 , H05K5/06 , H05K7/20 , H05K9/00 , H01L23/473
Abstract: An electronic device includes a housing enclosure, which at least sealingly contains an electronic component, a barrier, a pump, and a coolant. The electronic component is located on a substrate, while the barrier defines a circulation loop in which the coolant is exposed to the electronic component. The pump is positioned within the circulation loop to cause flow of the coolant through the circulation loop along one side of the at least one barrier in one direction and along an opposite side of the at least one barrier in an opposite direction.
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公开(公告)号:US10352314B2
公开(公告)日:2019-07-16
申请号:US15546977
申请日:2015-04-20
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Kianoush Naeli , David A. Moore
Abstract: A pump includes a main chamber and a pair of valves on opposite ends of the main chamber. At least a portion of the respective valves and of the main chamber is formed from a single, unitary piece. The respective valves each contain a freely movable member to permit selective opening and closing of each respective valve. A force applicator alternately induces a suction action and an expulsion action in the main chamber.
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公开(公告)号:US20160066472A1
公开(公告)日:2016-03-03
申请号:US14780482
申请日:2013-03-29
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Tahir Cader , Niru Kumari , John Franz , Cullen E. Bash , David A. Moore , Sergio Escobar-Vargas
IPC: H05K7/20
CPC classification number: H05K7/20263 , F28D15/025 , F28D15/0266 , F28D15/04 , F28D15/06 , F28D2021/0028 , G06F1/20 , G06F1/206 , G06F2200/201 , H01L23/427 , H05K7/20272 , H05K7/20281 , H05K7/20836 , Y02D10/16
Abstract: According to an example, a cooling system includes a cooling fluid reservoir, a cooling apparatus in fluid communication with the cooling fluid reservoir, a chamber having a side in thermal contact with a portion of the heat generating component, in which cooling fluid delivered by the cooling apparatus is to be heated through receipt of heat from the heat generating component, a cooling plate positioned at a distance and separated from the chamber, and a cooling fluid tube connecting the chamber and the cooling plate, in which the heated cooling fluid is to flow through the cooling fluid tube to the cooling plate. The cooling plate is also to be in thermal contact with a heat exchanger that that is to remove heat from the cooling fluid.
Abstract translation: 根据一个实例,冷却系统包括冷却流体储存器,与冷却流体储存器流体连通的冷却装置,具有与发热部件的一部分热接触的一侧的室,其中由 冷却装置将通过从发热部件接收热量,一定距离并与腔室分离的冷却板加热,以及连接腔室和冷却板的冷却流体管,其中加热的冷却流体为 流经冷却流体管至冷却板。 冷却板也将与热交换器热接触,热交换器是从冷却流体中除去热量。
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公开(公告)号:US20150239639A1
公开(公告)日:2015-08-27
申请号:US14427709
申请日:2012-10-31
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Stefan J. Wenner , Richard H. Hodge , David A. Moore , John R. Drake
CPC classification number: B65D81/3816 , B65B11/585 , B65D19/38 , B65D81/38 , B65D2519/0086 , C09K5/063
Abstract: A thermal stabilization shipping system comprises a pallet (30, 130, 330) to underlie a palletized load (22) and a blanket (50, 250 150, 350) dimensioned to drape over a top of the palletized load (22) and reach down to the pallet (30, 130, 330). The blanket (50, 250 150, 350) has compartments (54, 154, 454) containing a phase change material (60).
Abstract translation: 一种热稳定运输系统包括一个托盘(30,130,330),该托盘位于托盘装载物(22)的下面,一个橡皮布(50,250,150,350)的尺寸适于悬挂在托盘化的载荷(22)的顶部上, 到所述托盘(30,130,330)。 毯子(50,250,150,350)具有包含相变材料(60)的隔间(54,154,454)。
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公开(公告)号:US20180030976A1
公开(公告)日:2018-02-01
申请号:US15546977
申请日:2015-04-20
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Kianoush Naeli , David A. Moore
CPC classification number: F04B43/043 , F04B45/04 , F04B53/10 , G06F1/1656 , G06F1/20 , G06F1/203 , H05K7/20272
Abstract: A pump includes a main chamber and a pair of valves on opposite ends of the main chamber. At least a portion of the respective valves and of the main chamber is formed from a single, unitary piece. The respective valves each contain a freely movable member to permit selective opening and closing of each respective valve. A force applicator alternately induces a suction action and an expulsion action in the main chamber.
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公开(公告)号:US09713285B2
公开(公告)日:2017-07-18
申请号:US14780482
申请日:2013-03-29
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Tahir Cader , Niru Kumari , John Franz , Cullen E. Bash , David A. Moore , Sergio Escobar-Vargas
CPC classification number: H05K7/20263 , F28D15/025 , F28D15/0266 , F28D15/04 , F28D15/06 , F28D2021/0028 , G06F1/20 , G06F1/206 , G06F2200/201 , H01L23/427 , H05K7/20272 , H05K7/20281 , H05K7/20836 , Y02D10/16
Abstract: According to an example, a cooling system includes a cooling fluid reservoir, a cooling apparatus in fluid communication with the cooling fluid reservoir, a chamber having a side in thermal contact with a portion of the heat generating component, in which cooling fluid delivered by the cooling apparatus is to be heated through receipt of heat from the heat generating component, a cooling plate positioned at a distance and separated from the chamber, and a cooling fluid tube connecting the chamber and the cooling plate, in which the heated cooling fluid is to flow through the cooling fluid tube to the cooling plate. The cooling plate is also to be in thermal contact with a heat exchanger that that is to remove heat from the cooling fluid.
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公开(公告)号:US20160029510A1
公开(公告)日:2016-01-28
申请号:US14771800
申请日:2013-03-14
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Tahir Cader , John P. Franz , Jon Kolas , David A. Moore
IPC: H05K7/20
CPC classification number: H05K7/20 , H05K7/20272
Abstract: An apparatus to cool an electronic module is provided herein. The apparatus includes a support member and a retaining member. The support member to receive the cooling module. The support member includes a cooling module alignment member to align the cooling module therein. The retaining member to secure the cooling module.
Abstract translation: 本文提供冷却电子模块的装置。 该装置包括支撑构件和保持构件。 支撑构件接收冷却模块。 支撑构件包括冷却模块对准构件以将冷却模块对准。 保持构件用于固定冷却模块。
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