Patent search ap:("HEWLETT-PACKARD DEVELOPMENT COMPANY Page L.P.") AND inv:"Matthew Baker"

1.

发明申请
CLEANING MECHANISMS FOR BUILD MATERIAL LEVEL SENSORS 有权

公开(公告)号：US20210402695A1

公开(公告)日：2021-12-30

申请号：US16607919

申请日：2018-07-26

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： David Soriano , Douglas Pederson , Nicola Baldo , Steve Ringwald , Samrin Sing , Matthew Baker

IPC: B29C64/35 , B29C64/153 , B29C64/386 , B33Y40/00 , B33Y50/00

Abstract: In example implementations, a powder level sensor is provided. The powder level sensor includes a capacitive sensor, a processor, and a cleaning mechanism. The processor is communicatively coupled to the capacitive sensor. The processor interprets a measurement of the capacitive sensor to detect a layer of residual build material on a surface of the powder level sensor. The cleaning mechanism may be communicatively coupled to the processor. The processor activates the cleaning mechanism to remove the layer of residual build material on the surface of the powder level sensor.

2.

发明授权
Cleaning mechanisms for build material level sensors 有权

公开(公告)号：US11660808B2

公开(公告)日：2023-05-30

申请号：US16607919

申请日：2018-07-26

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： David Soriano , Douglas Pederson , Nicola Baldo , Steve Ringwald , Samrin Sing , Matthew Baker

IPC: B29C64/153 , B33Y40/00 , B33Y50/00 , B29C64/386 , B29C64/35 , B22F12/50 , B22F12/90 , B22F10/30 , B33Y10/00 , B22F10/14 , B22F12/10

CPC classification number: B29C64/153 , B22F10/30 , B22F12/50 , B22F12/90 , B29C64/35 , B29C64/386 , B33Y40/00 , B33Y50/00 , B22F10/14 , B22F12/10 , B33Y10/00

Abstract: In example implementations, a powder level sensor is provided. The powder level sensor includes a capacitive sensor, a processor, and a cleaning mechanism. The processor is communicatively coupled to the capacitive sensor. The processor interprets a measurement of the capacitive sensor to detect a layer of residual build material on a surface of the powder level sensor. The cleaning mechanism may be communicatively coupled to the processor. The processor activates the cleaning mechanism to remove the layer of residual build material on the surface of the powder level sensor.

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