公开(公告)号：US11794414B2

公开(公告)日：2023-10-24

申请号：US16608376

申请日：2018-01-29

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Nicola Baldo ,  David Pinheiro ,  Albert Trenchs Magana ,  Esteve Comas Cespedes

IPC: B29C64/393 ,  B33Y50/02 ,  G01R19/165 ,  G01R21/00 ,  B29C64/268

CPC classification number: B29C64/393 ,  B29C64/268 ,  B33Y50/02 ,  G01R19/16595 ,  G01R21/00

Abstract: A method and apparatus is described in which a signal indicative of an operation of a energy source of a 3D printer during a second predetermined time period commencing with the end of a first predetermined time period is obtained, the first predetermined time period commencing with an activation of the energy source, wherein the energy source is active throughout the first and second time periods; the obtained signal is compared with a reference signal; and it is determined, based on the comparison, whether the energy source is operating according to predetermined characteristics.

公开(公告)号：US20210402695A1

公开(公告)日：2021-12-30

申请号：US16607919

申请日：2018-07-26

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： David Soriano ,  Douglas Pederson ,  Nicola Baldo ,  Steve Ringwald ,  Samrin Sing ,  Matthew Baker

IPC: B29C64/35 ,  B29C64/153 ,  B29C64/386 ,  B33Y40/00 ,  B33Y50/00

Abstract: In example implementations, a powder level sensor is provided. The powder level sensor includes a capacitive sensor, a processor, and a cleaning mechanism. The processor is communicatively coupled to the capacitive sensor. The processor interprets a measurement of the capacitive sensor to detect a layer of residual build material on a surface of the powder level sensor. The cleaning mechanism may be communicatively coupled to the processor. The processor activates the cleaning mechanism to remove the layer of residual build material on the surface of the powder level sensor.

公开(公告)号：US11660808B2

公开(公告)日：2023-05-30

申请号：US16607919

申请日：2018-07-26

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： David Soriano ,  Douglas Pederson ,  Nicola Baldo ,  Steve Ringwald ,  Samrin Sing ,  Matthew Baker

IPC: B29C64/153 ,  B33Y40/00 ,  B33Y50/00 ,  B29C64/386 ,  B29C64/35 ,  B22F12/50 ,  B22F12/90 ,  B22F10/30 ,  B33Y10/00 ,  B22F10/14 ,  B22F12/10

CPC classification number: B29C64/153 ,  B22F10/30 ,  B22F12/50 ,  B22F12/90 ,  B29C64/35 ,  B29C64/386 ,  B33Y40/00 ,  B33Y50/00 ,  B22F10/14 ,  B22F12/10 ,  B33Y10/00

Abstract: In example implementations, a powder level sensor is provided. The powder level sensor includes a capacitive sensor, a processor, and a cleaning mechanism. The processor is communicatively coupled to the capacitive sensor. The processor interprets a measurement of the capacitive sensor to detect a layer of residual build material on a surface of the powder level sensor. The cleaning mechanism may be communicatively coupled to the processor. The processor activates the cleaning mechanism to remove the layer of residual build material on the surface of the powder level sensor.