公开(公告)号：US20180305822A1

公开(公告)日：2018-10-25

申请号：US15565475

申请日：2015-05-06

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： CHALAM KASHYAP ,  KUAN-TING WU ,  TONY C. KANG

IPC: C23C28/00 ,  C25D5/10 ,  C25D13/22

CPC classification number: C23C28/00 ,  C23C28/023 ,  C23C28/322 ,  C23C28/34 ,  C25D5/10 ,  C25D13/02 ,  C25D13/22

Abstract: Various examples described herein provide for a substrate, or a method for preparing a substrate, including a first electroplated layer disposed over a metal substrate, a second electroplated layer disposed under the metal substrate, and an electrophoretic deposition layer disposed over the first electroplated layer.