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    AGENT COMPOSITION DETERMINATION BASED ON THERMAL VALUES
    3.
    发明申请
    AGENT COMPOSITION DETERMINATION BASED ON THERMAL VALUES 有权

    公开(公告)号：US20220097309A1

    公开(公告)日：2022-03-31

    申请号：US17418791

    申请日：2019-05-03

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Jacob Wright ,  Matthew A. Shepherd ,  Vanessa Verzwyvelt ,  Xin Cheng

    IPC: B29C64/393 ,  B29C64/165 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02

    Abstract: According to examples, an apparatus may include a processor and a memory on which are stored machine-readable instructions that when executed by the processor, may cause the processor to identify a property of a portion of a three-dimensional (3D) part to be fabricated and determine, based on the identified property, a thermal value associated with the portion. The instructions may also cause the processor to, based on the determined thermal value, determine a first agent composition to be used to fabricate the portion and determine a second agent composition to be used to fabricate a section external and adjacent to the portion, in which the first agent composition and the second agent composition may be determined to cause the portion and the external section to be fabricated to have the identified property while maintaining the external section separate from the portion.

    ORIENTATION BASED 3D MODEL SECTION THICKNESS DETERMINATIONS
    4.
    发明申请
    ORIENTATION BASED 3D MODEL SECTION THICKNESS DETERMINATIONS 有权

    公开(公告)号：US20220083023A1

    公开(公告)日：2022-03-17

    申请号：US17419032

    申请日：2019-05-03

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Matthew A. Shepherd ,  Vanessa Verzwyvelt ,  Jacob Wright ,  Xin Cheng ,  Dennis J. Schissler ,  Morgan T. Schramm

    IPC: G05B19/4099

    Abstract: According to examples, an apparatus may include a processor and a memory on which are stored machine-readable instructions that when executed by the processor, may cause the processor to identify a first orientation of a first surface portion of a three-dimensional (3D) model. The instructions may also cause the processor to, based on the identified first orientation of the first surface portion, determine a first thickness of a first section of a first geological region of the 3D model, the first section being adjacent to the first surface portion, in which a plurality of different orientations of 3D model surface portions are correlated to a plurality of different thicknesses. The instructions may further cause the processor to define the first section of the first geological region to have the determined first thickness.

    Three-dimensional printer color management
    5.
    发明授权
    Three-dimensional printer color management 有权

    公开(公告)号：US11457125B2

    公开(公告)日：2022-09-27

    申请号：US16769218

    申请日：2017-12-20

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Miguel Angel Lopez Alvarez ,  Morgan T. Schramm ,  Xin Cheng ,  Jay S. Gondek

    IPC: H04N1/60 ,  B33Y50/00

    Abstract: In some examples, with respect to three-dimensional printer color management, three-dimensional printer native space coordinates of a three-dimensional printer may be mapped to three-dimensional printer printing agent space coordinates of the three-dimensional printer. The three-dimensional printer printing agent space coordinates may be mapped to color space coordinates. The color space coordinates may be mapped to two-dimensional printer printing agent space coordinates of a two-dimensional printer. The two-dimensional printer printing agent space coordinates may be mapped to two-dimensional printer native space coordinates of the two-dimensional printer. A color management protocol of the two-dimensional printer may be utilized, based on the mapping of the three-dimensional printer native space coordinates to the two-dimensional printer native space coordinates, for the three-dimensional printer to print a three-dimensional object.

    SIMULATED THERMAL VALUE MODIFICATIONS FOR 3D MODEL SECTIONS
    8.
    发明申请
    SIMULATED THERMAL VALUE MODIFICATIONS FOR 3D MODEL SECTIONS 有权

    公开(公告)号：US20220092235A1

    公开(公告)日：2022-03-24

    申请号：US17417938

    申请日：2019-05-03

    Applicant: Hewlett-Packard Development Company, L.P

    Inventor： Jacob Wright ,  Xin Cheng ,  Matthew A. Shepherd ,  Vanessa Verzwyvelt

    IPC: G06F30/20 ,  B29C64/386 ,  B22F10/80 ,  B33Y50/00 ,  G06F119/08

    Abstract: According to examples, an apparatus may include a processor and a memory on which are stored machine-readable instructions that when executed by the processor, may cause the processor access a thermal simulation of a three-dimensional (3D) model, the thermal simulation identifying thermal values simulated to occur across the 3D model during fabrication of a 3D part corresponding to the 3D model. The instructions may also cause the processor to determine a modification to be applied to first thermal values corresponding to a first section of the 3D model, in which the modification may increase accuracy of the first thermal values in the thermal simulation and to apply the determined modification to the first thermal values to generate a modified thermal simulation of the 3D model.

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