公开(公告)号：US20110116236A1

公开(公告)日：2011-05-19

申请号：US12820611

申请日：2010-06-22

Applicant: HIDEKI AKAHORI

Inventor： HIDEKI AKAHORI

IPC: H05K7/20 ,  H05K3/30 ,  H01R9/00

CPC classification number: H05K1/141 ,  H01L23/36 ,  H01L23/49541 ,  H01L2924/0002 ,  H05K1/056 ,  H05K3/202 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/3447 ,  H05K3/403 ,  H05K2201/09072 ,  H05K2201/09181 ,  H05K2201/09745 ,  H05K2201/10166 ,  H05K2201/1034 ,  H05K2201/10765 ,  H05K2201/10969 ,  Y10T29/4913 ,  Y10T29/49147 ,  H01L2924/00

Abstract: A heat conduction board, include a heat dissipation member; a heat conduction member which is arranged on the heat dissipation member and conducts a heat thereto; a lead frame which is formed in a wire pattern shape, and is arranged on the heat conduction member; and a printed circuit board which mounts a second electronic component for controlling a first electronic component; wherein the first electronic component and the printed circuit board are soldered to the lead frame.

Abstract translation: 导热板包括散热构件; 布置在散热构件上并传导热量的导热构件; 引线框架，其形成为线状，并布置在导热构件上; 以及安装用于控制第一电子部件的第二电子部件的印刷电路板; 其中所述第一电子部件和所述印刷电路板焊接到所述引线框架。