公开(公告)号：US20150318062A1

公开(公告)日：2015-11-05

申请号：US14646223

申请日：2012-11-21

Applicant: HITACHI, LTD.

Inventor： Ryou ISHIBASHI ,  Takashi NAITOU ,  Motomune KODAMA ,  Takuya AOYAGI ,  Tetsushi HINO ,  Motoo AOYAMA ,  Tsuneyuki HASHIMOTO ,  Katsuhito TAKAHASHI ,  Junichi SAKANO ,  Hiroshi NAKANO

IPC: G21C3/34 ,  H05K7/20 ,  G21C3/20 ,  G21C3/07 ,  H05K1/03 ,  H05K1/18

CPC classification number: G21C3/34 ,  C03C8/14 ,  C03C8/18 ,  C03C8/24 ,  C04B37/025 ,  C04B2237/10 ,  C04B2237/365 ,  C04B2237/38 ,  C04B2237/403 ,  C04B2237/405 ,  C04B2237/407 ,  C04B2237/765 ,  C04B2237/84 ,  F28D7/16 ,  F28F19/02 ,  F28F21/006 ,  F28F21/04 ,  F28F2255/06 ,  G21C3/07 ,  G21C3/20 ,  H01L23/15 ,  H01L23/3735 ,  H01L23/473 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H05K1/0306 ,  H05K1/18 ,  H05K7/20509 ,  Y02E30/40 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Provided is a structure including a first member (2); a second member (3) disposed opposite to the first member (2); and a glass layer (4) disposed between the first member (2) and the second member (3) so as to bond the first member (2) and the second member (3). A glass transition point of the glass layer (4) is lower than a temperature of the glass layer (4) under operation. In the glass layer (4), at least either of ceramic and metallic particles 4b, 4c is dispersed. In a temperature region lower than the glass transition point of the glass layer (4), a thermal expansion coefficient thereof falls in between thermal expansion coefficients of the first member (2) and the second member (3). This allows thermal strain caused within the structure (1) to be reduced when the structure (1) is operated at a higher temperature than a room temperature.

Abstract translation: 提供包括第一构件（2）的结构; 与所述第一构件（2）相对设置的第二构件（3）; 以及设置在所述第一构件（2）和所述第二构件（3）之间以便结合所述第一构件（2）和所述第二构件（3）的玻璃层（4）。 玻璃层（4）的玻璃化转变点低于在使用中的玻璃层（4）的温度。 在玻璃层（4）中，陶瓷和金属颗粒4b，4c中的至少任一个被分散。 在比玻璃层（4）的玻璃化转变点低的温度区域中，其热膨胀系数落在第一部件（2）和第二部件（3）的热膨胀系数之间。 这使得当结构（1）在比室温更高的温度下操作时，允许在结构（1）内引起的热应变减小。