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1.发明公开公开(公告)号：US20240045009A1
公开(公告)日：2024-02-08
申请号：US18267504
申请日：2021-12-23
Applicant: HITACHI, LTD.
Inventor： Motomune KODAMA , Yota ICHIKI , Shinji FUJITA
IPC: G01R33/3815 , G01R33/28 , G01R33/38
CPC classification number: G01R33/3815 , G01R33/288 , G01R33/3804
Abstract: A superconducting magnet apparatus includes a superconducting coil, a persistent current switch, a cryostat, an external resistance element that attenuates energy accumulated in the superconducting coil when the superconducting coil is demagnetized, an external power supply capable of energizing a reverse current of a persistent current to the superconducting coil, and a circuit breaker capable of freely cutting off energization between the external power supply and the superconducting coil. A method for demagnetizing a superconducting magnet includes causing the reverse current of the persistent current to flow from the external power supply, and switching the persistent current switch to an off-state and switching the circuit breaker to an off-state, and demagnetizing the superconducting magnet by causing a current flowing through the superconducting coil to flow to an external resistance element when the amount of current flowing through the persistent current switch decreases.
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2.发明申请Structure, Electronic Element Module, Heat Exchanger, Fuel Rod, and Fuel Assembly 有权结构，电子元件模块，换热器，燃料棒和燃料组件公开(公告)号：US20150318062A1
公开(公告)日：2015-11-05
申请号：US14646223
申请日：2012-11-21
Applicant: HITACHI, LTD.
Inventor： Ryou ISHIBASHI , Takashi NAITOU , Motomune KODAMA , Takuya AOYAGI , Tetsushi HINO , Motoo AOYAMA , Tsuneyuki HASHIMOTO , Katsuhito TAKAHASHI , Junichi SAKANO , Hiroshi NAKANO
CPC classification number: G21C3/34 , C03C8/14 , C03C8/18 , C03C8/24 , C04B37/025 , C04B2237/10 , C04B2237/365 , C04B2237/38 , C04B2237/403 , C04B2237/405 , C04B2237/407 , C04B2237/765 , C04B2237/84 , F28D7/16 , F28F19/02 , F28F21/006 , F28F21/04 , F28F2255/06 , G21C3/07 , G21C3/20 , H01L23/15 , H01L23/3735 , H01L23/473 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/49109 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , H05K1/0306 , H05K1/18 , H05K7/20509 , Y02E30/40 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: Provided is a structure including a first member (2); a second member (3) disposed opposite to the first member (2); and a glass layer (4) disposed between the first member (2) and the second member (3) so as to bond the first member (2) and the second member (3). A glass transition point of the glass layer (4) is lower than a temperature of the glass layer (4) under operation. In the glass layer (4), at least either of ceramic and metallic particles 4b, 4c is dispersed. In a temperature region lower than the glass transition point of the glass layer (4), a thermal expansion coefficient thereof falls in between thermal expansion coefficients of the first member (2) and the second member (3). This allows thermal strain caused within the structure (1) to be reduced when the structure (1) is operated at a higher temperature than a room temperature.
Abstract translation: 提供包括第一构件（2）的结构; 与所述第一构件（2）相对设置的第二构件（3）; 以及设置在所述第一构件（2）和所述第二构件（3）之间以便结合所述第一构件（2）和所述第二构件（3）的玻璃层（4）。 玻璃层（4）的玻璃化转变点低于在使用中的玻璃层（4）的温度。 在玻璃层（4）中，陶瓷和金属颗粒4b，4c中的至少任一个被分散。 在比玻璃层（4）的玻璃化转变点低的温度区域中，其热膨胀系数落在第一部件（2）和第二部件（3）的热膨胀系数之间。 这使得当结构（1）在比室温更高的温度下操作时，允许在结构（1）内引起的热应变减小。
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公开(公告)号：US20210272722A1
公开(公告)日：2021-09-02
申请号：US17186223
申请日：2021-02-26
Applicant: HITACHI, LTD.
Inventor： Shinji FUJITA , Tsuyoshi WAKUDA , Yota ICHIKI , Motomune KODAMA
Abstract: A superconducting wire connector includes superconducting wires and a sintered body containing MgB2. The superconducting wires are connected by the sintered body. At least one of the superconducting wires includes a superconducting core having a first outer surface. The sintered body is in contact with the first outer surface. A method of connecting superconducting wires by a sintered body containing MgB2 includes exposing a superconducting core of at least one of the superconducting wires by removing a portion, positioned in the middle in a longitudinal direction of the at least one of the superconducting wires, of a metal sheath disposed around the superconducting core, disposing the at least one of the superconducting wires through a container, filling the container with a raw material of MgB2, and forming the sintered body being in contact with an outer surface of the superconducting core by sintering the raw material filled in the container.
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公开(公告)号：US20200090835A1
公开(公告)日：2020-03-19
申请号：US16092231
申请日：2017-03-10
Applicant: HITACHI, LTD.
Inventor： Motomune KODAMA , Shigeho TANIGAWA , Hiroshi KOTAKI , Hideki TANAKA , Kazuya NISHI , Takaaki SUZUKI
Abstract: The present invention is intended to increase the critical current density of a wire rod having a shape with good symmetry such as a round wire or a square wire by making use of mechanical milling method. The production method of the present invention for the MgB2 superconducting wire rod comprises a mixing process of preparing a powder by adding a solid organic compound to a magnesium powder and a boron powder and then applying an impact to the powder to prepare a mixture of the powder in which boron particles are dispersed inside magnesium particles, a filling process of filling a metal tube with the mixture, an elongation process of elongating the metal tube filled with the mixture and a heat treatment process of heat-treating the metal tube to synthesize MgB2.
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公开(公告)号：US20170278608A1
公开(公告)日：2017-09-28
申请号：US15505839
申请日：2015-03-27
Applicant: HITACHI, LTD.
Inventor： Toshiaki KUSUNOKI , Hideki TANAKA , Motomune KODAMA , Hiroyuki YAMAMOTO
CPC classification number: H01F6/06 , H01F6/006 , Y10S505/882
Abstract: Provided is a high-performance persistent current switch that is provided with a superconducting coil in which a decrease of a critical current or a critical magnetic field is suppressed. A means for solving the problem is as follows. A persistent current switch provided with a superconducting coil in a switch unit. A superconducting coil 5 includes a winding portion 53 which is formed using a superconductor thin film formed on an outer circumferential face of a base member 50. The winding portion 53 includes a first winding portion 51 and a second winding portion 52 which are formed in a double helical shape to be parallel to each other. A terminating end portion 51b of the first winding portion 51 and a starting end portion 52a of the second winding portion 52, which are adjacent to each other, are connected to each other.
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Patent Agency Ranking
公开(公告)号：US20170236768A1
公开(公告)日：2017-08-17
申请号：US15501374
申请日：2015-09-09
Applicant: HITACHI, LTD.
Inventor： Takashi NAITO , Motomune KODAMA , Takuya AOYAGI , Shigeru KIKUCHI , Takashi NOGAWA , Mutsuhiro MORI , Eiichi IDE , Toshiaki MORITA , Akitoyo KONNO , Taigo ONODERA , Tatsuya MIYAKE , Akihiko MIYAUCHI
IPC: H01L23/373 , H01L23/00 , C03C8/02 , C03C8/24 , C03C8/08
CPC classification number: H01L23/3733 , C03C3/122 , C03C3/125 , C03C3/21 , C03C8/02 , C03C8/08 , C03C8/18 , C03C8/24 , C09J1/00 , C09J11/04 , H01L21/52 , H01L23/3731 , H01L23/3735 , H01L24/29 , H01L25/07 , H01L25/18 , H01L2224/29211 , H01L2224/29224 , H01L2224/29239 , H01L2224/29247 , H01L2224/29287 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014
Abstract: A heat-dissipating structure is formed by bonding a first member and a second member, each being any of a metal, ceramic, and semiconductor, via a die bonding member; or a semiconductor module formed by bonding a semiconductor chip, a metal wire, a ceramic insulating substrate, and a heat-dissipating base substrate including metal, with a die bonding member interposed between each. At least one of the die bonding members includes a lead-free low-melting-point glass composition and metal particles. The lead-free low-melting-point glass composition accounts for 78 mol % or more in terms of the total of the oxides V2O5, TeO2, and Ag2O serving as main ingredients. The content of each of TeO2 and Ag2O is 1 to 2 times the content of V2O5, and at least one of BaO, WO3, and P2O5 is included as accessory ingredients, and at least one of Y2O3, La2O3, and Al2O3 is included as additional ingredients.
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公开(公告)号：US20190035519A1
公开(公告)日：2019-01-31
申请号：US16072897
申请日：2017-01-10
Applicant: HITACHI, LTD.
Inventor： Motomune KODAMA , Hideki TANAKA , Hiroshi KOTAKI , Kazuya NISHI , Takaaki SUZUKI
Abstract: The present invention addresses the problem of providing a wire material capable of ensuring high critical current density, regardless of the cross-sectional shape thereof. This super-conducting wire material is equipped with an MgB2 filament, the number density of cavities having a major axis of 10 μm or higher in a longitudinal cross-section of the superconducting wire material is in the range of 5-500 mm−2, and the average value of the angle formed between the major axis of the cavities and the axis of the wire material is 60 degrees or more.
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公开(公告)号：US20160257610A1
公开(公告)日：2016-09-08
申请号：US15033167
申请日：2013-12-04
Applicant: HITACHI, LTD.
Inventor： Motomune KODAMA , Masanori MIYAGI , Takuya AOYAGI , Takashi NAITO
IPC: C03C17/04 , C03C3/12 , C03C8/24 , B32B38/00 , B32B7/14 , B32B17/06 , C03C17/00 , B32B37/14 , C03C3/21 , B32B1/02
CPC classification number: C03C17/04 , B32B1/02 , B32B7/14 , B32B17/06 , B32B37/14 , B32B38/0008 , B32B2250/02 , B32B2255/20 , B32B2307/304 , B32B2307/412 , B32B2419/00 , B32B2439/40 , B32B2457/00 , B32B2605/00 , C03C3/122 , C03C3/21 , C03C8/02 , C03C8/08 , C03C8/18 , C03C8/24 , C03C17/003 , C03C17/007 , C03C17/008 , C03C27/06 , C03C2217/218 , C03C2217/23 , C03C2218/32 , E06B3/66 , E06B3/6612 , E06B3/66357 , Y02B80/22 , Y02B80/24
Abstract: A sealed structural body has an internal space and is made of glass, wherein at least a part of a boundary between the internal space of the sealed structural body and the outside is separated by a sealing material containing a metal material and a lead-free oxide glass. The lead-free oxide glass contains at least one of element Ag or P, Te, and V.
Abstract translation: 密封结构体具有内部空间并由玻璃制成，其中密封结构体的内部空间与外部之间的边界的至少一部分由包含金属材料和无铅氧化物的密封材料分开 玻璃。 无铅氧化物玻璃含有元素Ag或P，Te和V中的至少一种。
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公开(公告)号：US20140287227A1
公开(公告)日：2014-09-25
申请号：US14178847
申请日：2014-02-12
Applicant: HITACHI, LTD.
Inventor： Motomune KODAMA , Takashi NAITO , Tadashi FUJIEDA , Yuichi SAWAI , Takuya AOYAGI , Masanori MIYAGI
CPC classification number: H01L24/29 , C04B35/645 , C04B37/026 , C04B2237/10 , C04B2237/12 , C04B2237/125 , C04B2237/343 , C04B2237/365 , C04B2237/366 , C04B2237/368 , C04B2237/407 , C04B2237/55 , C04B2237/708 , C04B2237/72 , C04B2237/86 , H01L24/27 , H01L24/32 , H01L24/83 , H01L2224/2731 , H01L2224/29082 , H01L2224/29109 , H01L2224/29111 , H01L2224/29113 , H01L2224/29118 , H01L2224/29124 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29169 , H01L2224/29209 , H01L2224/29211 , H01L2224/29213 , H01L2224/29218 , H01L2224/29224 , H01L2224/29239 , H01L2224/29244 , H01L2224/29247 , H01L2224/29269 , H01L2224/29288 , H01L2224/29294 , H01L2224/29309 , H01L2224/29311 , H01L2224/29313 , H01L2224/29318 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29369 , H01L2224/32013 , H01L2224/32225 , H01L2224/32245 , H01L2224/32505 , H01L2224/83055 , H01L2224/83075 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83203 , H01L2224/83487 , H01L2224/83801 , H01L2224/8384 , H01L2924/15788 , H01L2924/351 , Y10T428/265 , H01L2924/00014 , H01L2924/05432 , H01L2924/01047 , H01L2924/00012 , H01L2924/00
Abstract: Disclosed is a jointed body wherein multiple base members are jointed to each other through a jointing layer, and at least one of the base members is a base member of a ceramic material, semiconductor or glass. The joint material layer contains a metal and an oxide. The oxide contains V and Te, and is present between the metal and the base members. Disclosed is also a joint material in the form of a paste containing an oxide glass containing V and Te, metal particles, and a solvent; in the form of a foil piece or plate in which particles of an oxide glass containing V and Te are embedded; or in the form of a foil piece or plate containing a layer of an oxide glass containing V and Te, and a layer of a metal.
Abstract translation: 公开了一种接合体，其中多个基底构件通过接合层彼此接合，并且至少一个基底构件是陶瓷材料，半导体或玻璃的基底构件。 接合材料层含有金属和氧化物。 氧化物含有V和Te，并且存在于金属和基体之间。 还公开了含有含有V和Te，金属颗粒和溶剂的氧化物玻璃的糊状物的接合材料; 以包含V和Te的氧化物玻璃的颗粒嵌入的箔片或板的形式; 或以包含含有V和Te的氧化物玻璃层和金属层的箔片或板的形式。
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公开(公告)号：US20230008754A1
公开(公告)日：2023-01-12
申请号：US17785142
申请日：2020-09-03
Applicant: HITACHI, LTD.
Inventor： Hideki TANAKA , Takaaki SUZUKI , Motomune KODAMA
Abstract: A superconducting wire comprises a MgB2 filament, a base material, a high-thermal expansion metal, and a stabilizing material. The high-thermal expansion metal is a metal (for example, stainless steel) having a higher thermal expansion coefficient at room temperature than the MgB2 and the base material (for example, iron or niobium). The manufacturing method includes a step of packing a mixed powder in a first metal pipe, a step of performing wire-drawing on the first metal pipe formed of the metal to be the base material, a step of producing a composite wire by accommodating the first metal pipe in a second metal pipe formed of the high-thermal expansion metal and the stabilizing material, a step of performing wire-drawing on the composite wire, and a step of performing heat treatment.
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