公开(公告)号：US20190237309A1

公开(公告)日：2019-08-01

申请号：US16123176

申请日：2018-09-06

Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

Inventor： Yoshito KAMAJI ,  Masahiro SUMIYA

IPC: H01J37/32 ,  G05B23/02 ,  H01L21/311 ,  H01L21/67

CPC classification number: H01J37/32935 ,  G05B23/0283 ,  G06N20/00 ,  H01L21/31116 ,  H01L21/67069 ,  H01L21/67253

Abstract: A plasma processing apparatus including a state prediction apparatus that predicts an apparatus state of the plasma processing apparatus configured to include an apparatus data recording unit that records apparatus data output from the plasma processing apparatus during the processing of the sample, a physical environment measurement data recording unit that measures physical environment in the processing chamber and records apparatus physical environment data, data correction unit that extracts a temporal change component of the physical environment from a plurality of the apparatus physical environment data recorded in the physical environment measurement data recording unit and extracts the temporal change component of the physical environment from the apparatus data to remove the temporal change components, and an apparatus state prediction calculation unit that predicts the state of the plasma processing apparatus using the apparatus data from which the temporal change component of the physical environment is removed as input data.

公开(公告)号：US20190088455A1

公开(公告)日：2019-03-21

申请号：US15904917

申请日：2018-02-26

Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

Inventor： Yoshito KAMAJI ,  Masahiro SUMIYA

IPC: H01J37/32 ,  H01J37/24 ,  G06N7/00 ,  G06F17/18

Abstract: A system that predicts an apparatus state of a plasma processing apparatus including a processing chamber in which a sample is processed is configured to have a data recording unit that records emission data of plasma during processing of the sample and electrical signal data obtained from the apparatus during the plasma processing, an arithmetic unit that includes a first calculation unit for calculating a first soundness index value of the plasma processing apparatus and a first threshold for an abnormality determination using a first algorithm with respect to the recorded emission data and a second calculation unit for calculating a second soundness index value of the plasma processing apparatus and a second threshold for the abnormality determination using a second algorithm with respect to the electrical signal data recorded in the data recording unit, and a determination unit that determines soundness of the plasma processing apparatus using the calculated first soundness index value and the first threshold and the calculated second soundness index value and the second threshold.