公开(公告)号：US20030177832A1

公开(公告)日：2003-09-25

申请号：US10384645

申请日：2003-03-11

Applicant: HITACHI METALS, LTD.

Inventor： Hiroyuki Hatano ,  Masakatsu Saitoh ,  Sinji Furuichi

IPC: G01P015/12

CPC classification number: G01P15/123 ,  G01P15/18 ,  G01P2015/084

Abstract: An ultra-small and slim semiconductor acceleration sensor with high sensitivity is provided. The acceleration sensor has a mass portion formed at a center part of a silicon semiconductor substrate, a frame formed on an edge part of the substrate, thin elastic support arms which are provided on top surfaces of the mass portion and the frame and connect the mass portion and the frame, and strain gauges constituted by a plurality of pairs of piezoresistors formed on top surfaces of the elastic support arms. A distance between a pair of Z-axis strain gauges provided on the top surface of the elastic support arm is made longer by 0.4L to 1.2L or shorter by 1.0L to 1.8L than a distance between a pair of X-axis strain gauges, whereby output of the Z-axis strain gauge is made at the same level as output of the X-axis strain gauge. Alternatively, an angle formed by the Z-axis strain gauge with an X-axis is made 10 to 30 degrees or 65 to 90 degrees, whereby the output of the Z-axis strain gauge is made at the same level as the output of the X-axis strain gauge.

Abstract translation: 提供了一种具有高灵敏度的超小型半导体加速度传感器。 加速度传感器具有形成在硅半导体基板的中心部分的质量部分，形成在基板的边缘部分上的框架，薄的弹性支撑臂设置在质量部分和框架的顶表面上并且连接质量 部分和框架，以及由形成在弹性支撑臂的顶表面上的多对压电电阻器构成的应变计。 设置在弹性支撑臂的顶表面上的一对Z轴应变计之间的距离比一对X轴应变计之间的距离长0.4L至1.2L或更短1.0L至1.8L 由此，Z轴应变计的输出与X轴应变计的输出相同。 或者，由Z轴应变计与X轴形成的角度为10〜30度或65〜90度，由此将Z轴应变计的输出设定为与 X轴应变仪。

公开(公告)号：US20040123664A1

公开(公告)日：2004-07-01

申请号：US10733643

申请日：2003-12-12

Applicant: HITACHI METALS, LTD.

Inventor： Daigo Ohtoyo ,  Masakatsu Saitoh

IPC: G01P015/12

CPC classification number: G01P15/18 ,  B81B3/0072 ,  B81B2201/0235 ,  B81B2203/0109 ,  B81B2203/051 ,  G01P15/0802 ,  G01P15/123 ,  G01P2015/084

Abstract: An acceleration sensor is disclosed that has a structure in which elastic support arms are not broken even if subjected to an impact that may be caused during a usual handling. The acceleration sensor comprises a mass portion, a mass portion top plate fixed onto the mass portion, a rectangular thick support frame surrounding the mass portion, a frame top plate fixed onto the frame, and four elastic support arms hanging the mass portion in the center of the frame and bridging the mass portion top plate and the frame top plate. There are provided lateral grooves just below the support arms on side surfaces of the mass portion and on inner side surfaces of the frame. Due to the grooves, the mass portion top plate and the frame top plate have their portions bonded to the mass portion/the frame and their portions protruding toward the support arms. Cross sections on boundaries between the bonded portions and the protruding portions are larger than those connecting the protruding portions to the support arms. Breakage of the elastic support arms is prevented, because the strain caused in the mass portion/the frame by an impact applied from outside is not directly transmitted to the support arms and is released in the protruding portions having a larger cross section than the support arms.

Abstract translation: 公开了一种加速度传感器，其具有弹性支撑臂即使经受可能在通常的操作期间引起的冲击也不会破裂的结构。 加速度传感器包括质量部分，固定在质量部分上的质量部分顶板，围绕质量部分的矩形厚支撑框架，固定在框架上的框架顶板和悬挂在中心部分的质量部分的四个弹性支撑臂 并桥接质量部分顶板和框架顶板。 在质量部分的侧表面和框架的内侧表面上，在支撑臂正下方具有横向槽。 由于凹槽，质量部分顶板和框架顶板的部分结合到质量部分/框架，并且其部分朝向支撑臂突出。 接合部分和突出部分之间的边界上的横截面大于将突出部分连接到支撑臂的横截面。 防止弹性支撑臂的破损，因为通过从外部施加的冲击在质量部分/框架中引起的应变不直接传递到支撑臂并且被释放在具有比支撑臂更大的横截面的突出部分中 。

公开(公告)号：US20040123663A1

公开(公告)日：2004-07-01

申请号：US10717476

申请日：2003-11-21

Applicant: HITACHI METALS, LTD.

Inventor： Masakatsu Saitoh ,  Shinji Furuichi ,  Takashi Satoh

IPC: G01P015/12

CPC classification number: G01P15/18 ,  G01P1/023 ,  G01P15/0802 ,  G01P15/123 ,  G01P2015/084

Abstract: An acceleration sensor in which a regulation plate is fixed with adhesive onto a support frame of a sensor chip of the sensor to limit the movement of a mass portion of the sensor chip within a predetermined gap range. In the acceleration sensor, the adhesion area of the adhesive can be controlled to a predetermined value to prevent a variation of the sensitivity due to the variation of the adhesion area. The sensor chip comprises the mass portion, the frame surrounding the mass portion and having on an upper surface of the frame a plurality of the recesses to fill adhesive into, elastic support arms bridging the mass portion and the frame, and strain gauges formed on the elastic support arms. The regulation plate is fixed with paste onto the frame with the predetermined gap with an upper surface of the mass portion. The paste contains hard plastic balls, of a diameter larger than the predetermined gap, mixed with adhesive. The adhesive is preferably of silicon-rubber resin.

Abstract translation: 一种加速度传感器，其中调节板用粘合剂固定到传感器的传感器芯片的支撑框架上，以将传感器芯片的质量部分的运动限制在预定的间隙范围内。 在加速度传感器中，可以将粘合剂的粘合面积控制在预定值，以防止粘附面积变化引起的灵敏度变化。 传感器芯片包括质量部分，围绕质量部分的框架，并且在框架的上表面上具有多个凹部以将粘合剂填充到桥接质量部分和框架的弹性支撑臂中，以及形成在其上的应变计 弹性支撑臂。 调节板用浆料固定到具有与质量部分的上表面的预定间隙的框架上。 该糊料包含直径大于预定间隙的硬塑料球，与粘合剂混合。 粘合剂优选为硅橡胶树脂。

公开(公告)号：US20030150269A1

公开(公告)日：2003-08-14

申请号：US10357408

申请日：2003-02-04

Applicant: HITACHI METALS, LTD.

Inventor： Masakatsu Saitoh

IPC: G01P015/12

CPC classification number: G01P15/18 ,  G01P15/123 ,  G01P2015/084

Abstract: A microminiature and thin semiconductor acceleration sensor with high sensitivity is provided. The acceleration sensor has a mass portion formed in a center part of a silicon semiconductor substrate, a frame formed at a perimeter portion of the substrate, thin elastic support arms, which are provided at upper part of the mass portion and the frame and connect the mass portion and the frame, and a plurality of pairs of piezoresistors disposed on top surface sides of the elastic support arms. At least one of the mass portion and the thick frame has a cross section vertical to a respective top surface, spreading in width from the respective top surface toward a respective bottom surface. Since a side length of the mass portion and/or a width of the frame at a site, where the elastic support arms each is connected, are made short, the elastic support arm is made long, hereby the sensitivity of the sensor is enhanced.

公开(公告)号：US20030057447A1

公开(公告)日：2003-03-27

申请号：US10243650

申请日：2002-09-16

Applicant: HITACHI METALS, LTD.

Inventor： Masakatsu Saitoh ,  Shigenori Tanaka ,  Yoshio Ikeda

IPC: H01L031/0328

CPC classification number: G01P15/18 ,  B81B3/0078 ,  B81B2201/0235 ,  B81B2203/0109 ,  B81B2203/053 ,  B81B2203/058 ,  G01P15/0802 ,  G01P15/123 ,  G01P2015/084 ,  G01P2015/0842

Abstract: A microminiature and thin semiconductor acceleration sensor with high sensitivity is provided. The acceleration sensor has a mass portion formed in a center part of a silicon semiconductor substrate, a frame formed at a perimeter portion of the substrate, thin elastic support arms, which are provided at upper part of the mass portion and the frame and connect the mass portion and the frame, and a plurality of pairs of piezoresistors disposed on top surface sides of the elastic support arms. In the mass portion, a plurality of recessed portions which are recessed toward a center thereof from a perimeter thereof are formed, each of the elastic support arms is attached to the top surface of the mass portion at the bottom of each of the recessed portions, and sides of the elastic support arms are spaced from sides of the recessed portions. Since the volume of the mass portion and the length of the elastic support arms can be independently made large, sensitivity can be made higher.

Abstract translation: 提供了一种具有高灵敏度的微型和薄型半导体加速度传感器。 加速度传感器具有形成在硅半导体基板的中心部分的质量部分，形成在基板的周边部分的框架，薄的弹性支撑臂，其设置在质量部分和框架的上部，并将 质量部分和框架，以及设置在弹性支撑臂的顶表面侧上的多对压电电感器。 在质量部分中，形成有从其周边向其中心凹陷的多个凹部，每个凹部的底部都安装有弹性支撑臂，该质量部分的顶面， 并且弹性支撑臂的侧面与凹部的侧面间隔开。 由于质量部分的体积和弹性支撑臂的长度可以独立地变大，因此可以提高灵敏度。