公开(公告)号：US20250157834A1

公开(公告)日：2025-05-15

申请号：US18723082

申请日：2022-12-20

Applicant: HPSP Co., Ltd.

Inventor： Kun Young LIM

IPC: H01L21/67

Abstract: The present invention provides a high-pressure heat treatment apparatus and a gas monitoring module used therefor, the high-pressure heat treatment apparatus comprising: an inner chamber formed to accommodate an object for heat treatment; an outer chamber having a first part and a second part disposed to face each other to define an accommodation space, and an inner O-ring and an outer O-ring disposed in a corresponding region between the first part and the second part, wherein the accommodation space accommodates the inner chamber; an air supply module configured to supply a reaction gas for the heat treatment to the inner chamber at a first pressure higher than atmospheric pressure, and to supply a protective gas to the outer chamber at a second pressure set in relation to the first pressure; a monitoring module having a buffer channel positioned between the inner O-ring and the outer O-ring and supplied with a buffer gas at a third pressure, and a sensing unit configured to sense an environment related to the buffer gas; and a control module configured to determine whether an internal leak of a gas flowing from the accommodation space to the buffer channel via the inner O-ring occurs, on the basis of a result of sensing the environment related to the buffer gas.

公开(公告)号：US20230204288A1

公开(公告)日：2023-06-29

申请号：US18145336

申请日：2022-12-22

Applicant: HPSP Co., Ltd.

Inventor： Kun Young LIM

IPC: F27B17/00 ,  F27D7/02

CPC classification number: F27B17/0025 ,  F27D7/02 ,  F27D2007/063

Abstract: Provided is a high pressure heat treatment apparatus including: an internal chamber accommodating an object to be heat-treated; an external chamber including a high-temperature zone accommodating the internal chamber and a low-temperature zone having a lower temperature than the high-temperature zone; a gas supply module including a process gas line for supplying a process gas for the heat treatment to the internal chamber at a first pressure higher than that of the atmosphere and a protective gas line for supplying a protective gas to the external chamber at a second pressure set in relation to the first pressure; a switch module configured to switch the high-temperature zone and the low-temperature zone into a communication state; and a purge module configured to purge the protective gas in the high-temperature zone to the low-temperature zone in the communication state.

公开(公告)号：US20240096661A1

公开(公告)日：2024-03-21

申请号：US18467838

申请日：2023-09-15

Applicant: HPSP Co., Ltd.

Inventor： Kun Young LIM ,  Hyeseong YOON

IPC: H01L21/67 ,  H01L21/66

CPC classification number: H01L21/67103 ,  H01L22/26 ,  H01L22/34

Abstract: Provided is a gas box assembly for a high pressure processing apparatus, the assembly including: a housing having an inner space; a supply module disposed in the inner space and supplying a process gas to a chamber of the high pressure processing apparatus; an exhaust module exhausting a gas occurring due to processing of an object in the chamber; and a charge module charging a protection gas into the inner space at a pressure higher than an external pressure of the housing to block external air from being introduced into the inner space.

公开(公告)号：US20230204290A1

公开(公告)日：2023-06-29

申请号：US18145331

申请日：2022-12-22

Applicant: HPSP Co., Ltd.

Inventor： Kun Young LIM

IPC: F27D7/02 ,  F27D99/00 ,  F27D7/06

CPC classification number: F27D7/02 ,  F27D99/007 ,  F27D7/06 ,  F27D2001/0059

Abstract: Provided is a high pressure heat treatment apparatus including: an internal chamber accommodating an object to be heat-treated; an external chamber including a housing and a partition plate partitioning the housing into a high-temperature zone accommodating the internal chamber and a low-temperature zone having a lower temperature than the high-temperature zone, the partition plate including a discharge hole for allowing the high-temperature zone and the low-temperature zone to communicate with each other; a gas supply module configured to supply a process gas for the heat treatment to the internal chamber at a first pressure higher than that of the atmosphere, and supply a protective gas to the high-temperature zone and the low-temperature zone at a second pressure set in relation to the first pressure; and a discharge module configured to open the discharge hole to discharge the protective gas in the high-temperature zone to the low-temperature zone.

公开(公告)号：US20230194174A1

公开(公告)日：2023-06-22

申请号：US18068776

申请日：2022-12-20

Applicant: HPSP Co., Ltd.

Inventor： Kun Young LIM

IPC: F27D7/02 ,  F27D7/06

CPC classification number: F27D7/02 ,  F27D7/06 ,  F27D2007/063 ,  F27D2021/0007

Abstract: Provided is a gas management assembly for a high pressure heat-treatment apparatus, the assembly including: a housing having an inner space; a gas supply module disposed in the inner space and configured to supply a gas to internal and external chambers of the high pressure heat-treatment apparatus; a gas exhaust module disposed in the inner space and configured to exhaust the gas caused by heat treatment of an object from the internal chamber; a detection module connected to the gas exhaust module in the inner space and configured to detect the residual gas remaining in the internal chamber; and a control module configured to control at least one of the gas supply module and the gas exhaust module based on a detection result of the residual gas by the detection module.

公开(公告)号：US20240096662A1

公开(公告)日：2024-03-21

申请号：US18467848

申请日：2023-09-15

Applicant: HPSP Co., Ltd.

Inventor： Kun Young LIM ,  Bin Hong MIN

IPC: H01L21/67 ,  H01L21/66

CPC classification number: H01L21/67103 ,  H01L22/26 ,  H01L22/34

Abstract: Provided is a high pressure processing apparatus including: a first chamber accommodating an object to be processed; a second chamber surrounding the first chamber and heating the first chamber; a third chamber including a 3-1-th chamber surrounding a portion of the second chamber and a 3-2-th chamber surrounding another portion of the second chamber; and a supply module supplying a process gas for processing the object in the first chamber at a first pressure, supplying a protection gas to a space between the second chamber and the first chamber at a second pressure set in relation to the first pressure, and supplying a defense gas to a space between each of the 3-1-th chamber and the 3-2-th chamber and the second chamber at a third pressure lower than the first pressure and the second pressure and higher than an external pressure of the third chamber to block external air from being introduced into the third chamber.