公开(公告)号：US09647187B1

公开(公告)日：2017-05-09

申请号：US14290986

申请日：2014-05-30

Applicant: HRL LABORATORIES LLC

Inventor： Daniel Yap ,  Kevin Geary ,  James Schaffner

IPC: G02B6/12 ,  H01L21/00 ,  G01S13/00 ,  H01L33/62 ,  G01S7/481 ,  H01L21/768 ,  H01L33/64 ,  H01L23/48 ,  H01L23/498 ,  H01L23/522 ,  G01S13/44

CPC classification number: G02B6/10 ,  G01S7/4815 ,  G01S7/4817 ,  G01S7/495 ,  G01S13/4463 ,  G02B3/0056 ,  G02F1/0147 ,  G02F1/025 ,  G02F1/2955 ,  G02F2001/0151 ,  H01L21/76879 ,  H01L23/481 ,  H01L23/49827 ,  H01L23/5226 ,  H01L33/62 ,  H01L33/64

Abstract: A two-dimensional phased array beam former comprising at least first and second chips having each top and bottom surfaces, the bottom surface of the first chip being attached to the top surface of the second chip; the first and second chips having each an emitter side surface, the emitter side surfaces of the first and second chips facing a same direction and comprising each a plurality of emitters; wherein each of said first and second chips comprises at least one conductive post extending between said top and bottom surfaces; the at least one conductive post of the first chip being vertically aligned with and connected to the at least one conductive post of the second chip.