-
公开(公告)号：US20190075663A1
公开(公告)日：2019-03-07
申请号：US15878422
申请日：2018-01-24
Applicant: HTC Corporation
Inventor： Chun Tseng , Shih-Po Chien , Yi-Ting Liu , Yu-Jing Liao , I-Cheng Chuang , Chi-Jer Wang , Wen-Shian Lin
CPC classification number: H05K5/0017 , H04M1/0202 , H04M1/0266 , H05K5/03
Abstract: An electronic device including a housing, a display component and an electronic component is provided. The housing includes a transparent cover and a middle frame, and the transparent cover is assembled to the middle frame. The display component is disposed in the housing. The electronic component is disposed in the housing, wherein the transparent cover has a flat portion and a connecting portion. The connecting portion curvingly extends from a side of the flat portion and includes at least one bonding surface, and a thickness of the flat portion is different from a thickness of the connecting portion.
-
2.发明授权公开(公告)号：US10191202B2
公开(公告)日：2019-01-29
申请号：US15068648
申请日：2016-03-14
Applicant: HTC Corporation
Inventor： Po-Chin Huang , Shih-Po Chien , Yu-Jing Liao , I-Cheng Chuang
IPC: G02F1/1333 , F21V8/00 , G06F3/044 , G06F1/16
Abstract: A touch panel assembly includes a touch panel, a flexible circuit board, an input element and a light emitting element. The touch panel includes sensing series and pads. The pads are disposed on bonding regions of the touch panel and electrically connected to the sensing series. The flexible circuit board includes bonding portions and a light guide portion. Each bonding portion is disposed at the bonding region and includes terminals electrically connecting the pads. The light guide portion includes a connecting portion connecting the corresponding bonding portion and an extending portion connecting the connecting portion and extended away from the touch panel. The input element is located right above the extending portion. The light emitting element is disposed at a light incident side of the light guide portion.
-
公开(公告)号：US09939858B2
公开(公告)日：2018-04-10
申请号：US14596224
申请日：2015-01-14
Applicant: HTC Corporation
Inventor： Hung-Wen Lin , Hsin-Chih Liu , Yu-Jing Liao , Ya-Lin Hsiao
IPC: G06F1/20
CPC classification number: G06F1/203 , G06F2200/201
Abstract: An electronic device including a case having a space, a circuit board disposed in the space, a heat source disposed on the circuit board and a vapor chamber disposed at a side of the circuit board and adjacent to the heat source is provided. The vapor chamber includes an upper sheet, a bottom sheet assembled with the upper sheet to form a chamber, and a working fluid disposed in the chamber.
-
公开(公告)号：US09867312B2
公开(公告)日：2018-01-09
申请号：US14108348
申请日：2013-12-17
Applicant: HTC Corporation
Inventor： Hung-Wen Lin , Ting-An Kuo , Yu-Jing Liao , I-Cheng Chuang
IPC: H05K7/20 , H05K9/00 , H01L23/467 , H01L23/552 , F04D33/00 , H05K1/02 , H04R17/00
CPC classification number: H05K7/20009 , F04D33/00 , H01L23/467 , H01L23/552 , H04R17/00 , H05K1/0203 , H05K7/20172 , H05K9/0026
Abstract: An electronic module includes a substrate, a metallic shielding cover, an electronic component and a piezoelectric element. The metallic shielding cover is disposed on the substrate and forms an accommodating chamber together with the substrate, wherein the metallic shielding cover has an opening, and the accommodating chamber is communicated with outside via the opening. The electronic component is disposed on the substrate and accommodated in the accommodating chamber. The piezoelectric element is adhered to the metallic shielding cover, wherein the piezoelectric element after being enabled is configured to bring a local portion of the metallic shielding cover for vibrating to change the volume of the accommodating chamber. In addition, a heat dissipation module is also disclosed.
-
公开(公告)号：US09570843B2
公开(公告)日：2017-02-14
申请号：US14303607
申请日：2014-06-13
Applicant: HTC Corporation
Inventor： I-Hsuan Lin , Chih-Kai Hu , Yi-Ting Liu , Yu-Jing Liao
IPC: H01R11/30 , H01R13/62 , H01R13/703
CPC classification number: H01R13/6205 , H01R13/7037
Abstract: A conductive structure, including a holder, a first magnetic element, and a conductive terminal, is provided. The holder has a receiving space. The first magnetic element is disposed in the holder. The conductive terminal is disposed in the receiving space corresponding to the first magnetic element. The conductive terminal is attracted to the first magnetic element and is hidden in the receiving space of the holder. When the conductive terminal is moved close to a conductive contact provided with a second magnetic element, the conductive terminal is attracted to the second magnetic element and moves from the receiving space to be in contact with and electrically connected with the conductive contact. An electronic assembly, including a housing and the conductive structure, is also provided.
Abstract translation: 提供了包括保持器，第一磁性元件和导电端子的导电结构。 支架有一个接收空间。 第一磁性元件设置在保持器中。 导电端子设置在对应于第一磁性元件的接收空间中。 导电端子被吸引到第一磁性元件并且被隐藏在保持器的接收空间中。 当导电端子靠近具有第二磁性元件的导电触点移动时，导电端子被吸引到第二磁性元件并且从接收空间移动以与导电触点接触并与其电连接。 还提供了包括壳体和导电结构的电子组件。
-
Patent Agency Ranking
公开(公告)号：US09346198B2
公开(公告)日：2016-05-24
申请号：US13863389
申请日：2013-04-16
Applicant: HTC Corporation
Inventor： Chih-Kai Hu , Yu-Jing Liao , I-Cheng Chuang
CPC classification number: H05K5/0243 , B29C33/42 , B29C43/02 , B29C43/021 , B29C2043/022 , B29L2031/3481 , G06F1/1626 , G06F1/1656
Abstract: A molded casing suitable for a handheld electronic device is provided. The handheld electronic device includes a body and the molded casing, and at least one part of the body is covered with the molded casing. The molded casing is in a uniform thickness and has a continuous mosaic surface. The mosaic surface is composed of a plurality of non-coplanar polygons, wherein an intersection line is formed between any two adjacent polygons. An end of any one of the intersection lines is connected to an end of another intersection line or an edge of the mosaic surface, and an equivalence radius of a vertex angle at each intersection line is less than or equal to 0.1 millimeter. A mold assembly and a forming method for fabricating the molded case are also provided.
Abstract translation: 提供了适用于手持电子设备的模制套管。 手持电子设备包括主体和模制外壳，并且主体的至少一部分被模制外壳覆盖。 成型壳体的厚度均匀且具有连续的马赛克表面。 镶嵌表面由多个非共面多边形组成，其中在任何两个相邻的多边形之间形成交线。 交叉线中的任何一个的端部连接到另一交叉线的一端或马赛克面的边缘，并且每个交叉线处的顶角的等效半径小于或等于0.1毫米。 还提供了用于制造模制壳体的模具组件和成形方法。
-
公开(公告)号：US20150200063A1
公开(公告)日：2015-07-16
申请号：US14153090
申请日：2014-01-13
Applicant: HTC Corporation
Inventor： I-Cheng Chuang , Yu-Jing Liao , Ying-Yen Cheng , Chih-Wei Tu , Hung-Wen Lin
IPC: H01H13/14
CPC classification number: H01H13/14 , H01H13/02 , H01H2207/04 , H01H2239/052
Abstract: A switch structure and an electronic device using the same are provided. The electronic device has a casing, and the switch structure is disposed at an inner side of the key portion of the casing. The switch structure includes an elastic member, a force transmission member and a strain sensor. The elastic member is connected to the casing. The force transmission member is located inside the casing. The strain sensor is disposed on the elastic member, and the strain sensor and the force transmission member are disposed are two opposite sides of the elastic member respectively. The elastic member is configured to be deformed by the force transmission member when an external force is applied to an outside of the key portion.
Abstract translation: 提供一种开关结构和使用其的电子装置。 电子装置具有壳体，并且开关结构设置在壳体的键部的内侧。 开关结构包括弹性构件，力传递构件和应变传感器。 弹性构件连接到壳体。 力传递部件位于壳体内。 应变传感器设置在弹性构件上，应变传感器和力传递构件分别设置在弹性构件的两个相对侧。 弹性构件被构造成当外力施加到钥匙部分的外部时由力传递构件变形。
-
公开(公告)号：US20150173237A1
公开(公告)日：2015-06-18
申请号：US14108348
申请日：2013-12-17
Applicant: HTC Corporation
Inventor： Hung-Wen Lin , Ting-An Kuo , Yu-Jing Liao , I-Cheng Chuang
CPC classification number: H05K7/20009 , F04D33/00 , H01L23/467 , H01L23/552 , H04R17/00 , H05K1/0203 , H05K7/20172 , H05K9/0026
Abstract: An electronic module includes a substrate, a metallic shielding cover, an electronic component and a piezoelectric element. The metallic shielding cover is disposed on the substrate and forms an accommodating chamber together with the substrate, wherein the metallic shielding cover has an opening, and the accommodating chamber is communicated with outside via the opening. The electronic component is disposed on the substrate and accommodated in the accommodating chamber. The piezoelectric element is adhered to the metallic shielding cover, wherein the piezoelectric element after being enabled is configured to bring a local portion of the metallic shielding cover for vibrating to change the volume of the accommodating chamber. In addition, a heat dissipation module is also disclosed.
Abstract translation: 电子模块包括基板，金属屏蔽盖，电子部件和压电元件。 金属屏蔽盖设置在基板上并与基板一起形成容纳室，其中金属屏蔽盖具有开口，并且容纳室经由开口与外部连通。 电子部件设置在基板上并容纳在容纳室中。 压电元件粘附到金属屏蔽罩上，其中压电元件启用后被配置为使金属屏蔽盖的局部部分振动以改变容纳室的容积。 此外，还公开了散热模块。
-
公开(公告)号：US20140306585A1
公开(公告)日：2014-10-16
申请号：US13863389
申请日：2013-04-16
Applicant: HTC Corporation
Inventor： Chih-Kai Hu , Yu-Jing Liao , I-Cheng Chuang
CPC classification number: H05K5/0243 , B29C33/42 , B29C43/02 , B29C43/021 , B29C2043/022 , B29L2031/3481 , G06F1/1626 , G06F1/1656
Abstract: A molded casing suitable for a handheld electronic device is provided. The handheld electronic device includes a body and the molded casing, and at least one part of the body is covered with the molded casing. The molded casing is in a uniform thickness and has a continuous mosaic surface. The mosaic surface is composed of a plurality of non-coplanar polygons, wherein an intersection line is formed between any two adjacent polygons. An end of any one of the intersection lines is connected to an end of another intersection line or an edge of the mosaic surface, and an equivalence radius of a vertex angle at each intersection line is less than or equal to 0.1 millimeter. A mold assembly and a forming method for fabricating the molded case are also provided.
Abstract translation: 提供了适用于手持电子设备的模制套管。 手持电子设备包括主体和模制外壳，并且主体的至少一部分被模制外壳覆盖。 成型壳体的厚度均匀且具有连续的马赛克表面。 镶嵌表面由多个非共面多边形组成，其中在任何两个相邻的多边形之间形成交线。 交叉线中的任何一个的端部连接到另一交叉线的一端或马赛克面的边缘，并且每个交叉线处的顶角的等效半径小于或等于0.1毫米。 还提供了用于制造模制壳体的模具组件和成形方法。
-
公开(公告)号：US20180260063A1
公开(公告)日：2018-09-13
申请号：US15451418
申请日：2017-03-07
Applicant: HTC Corporation
Inventor： Chun Tseng , Yi-Ting Liu , Shih-Po Chien , Chin-Kuei Wen , Jui-Liang Chen , Yu-Jing Liao , Chun-Lung Huang , Yang-Lin Chen
CPC classification number: G06F3/0414 , G06F1/1637 , G06F3/044
Abstract: A multi-sensing system, a portable electronic device, and a touch-sensing method are provided. The multi-sensing system includes a sensing sheet and a carrier. The sensing sheet includes a substrate, and a touch-sensing circuit and a force-sensing circuit disposed on the substrate, wherein an orthogonal projection of the force-sensing circuit on the substrate and an orthogonal projection of the touch-sensing circuit on the substrate are misaligned from each other. The carrier has a carrying space and a carrying shoulder adjacent to the carrying space, wherein the carrier carries the sensing sheet with the carrying shoulder. The carrying space is used to accommodate a display element. The touch-sensing circuit is located above the display element.
-
-
-
-
-
-
-
-
-
Search Results
51
records
(took 0.021 seconds)
