公开(公告)号：US20230028233A1

公开(公告)日：2023-01-26

申请号：US17955796

申请日：2022-09-29

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Chao SHEN ,  Zhiqiang XIANG ,  Xiaojing LIAO

IPC: H01H85/046 ,  H01H85/06 ,  H05K1/18

Abstract: This application provides an embedded substrate, a circuit board assembly, and an electronic device. The embedded substrate in this application includes an insulation layer, and an electronic element and a conductive connector that are embedded inside the insulation layer. The conductive connector is electrically connected to the electronic element. The conductive connector includes at least one fuse unit, the fuse unit includes a fusible structure and two electrical connection ends, the fusible structure is connected between the two electrical connection ends in a direction of an electrical path of the conductive connector, and the fusible structure is configured to be blown when a passing current exceeds a preset current threshold, to disconnect an electrical connection between the electronic element and an external connection end. In this application, maintenance and replacement costs are low during current burning prevention, and a volume is compact.

公开(公告)号：US20230299018A1

公开(公告)日：2023-09-21

申请号：US18324329

申请日：2023-05-26

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Chen KANG ,  Chao SHEN ,  Xiaojing LIAO ,  Junhe WANG

IPC: H01L23/00 ,  H01L23/552 ,  H01L23/31 ,  H05K1/18 ,  H01L23/498

CPC classification number: H01L23/564 ,  H01L23/552 ,  H01L23/31 ,  H05K1/185 ,  H01L23/49822 ,  H05K2201/0206

Abstract: This application provides a package substrate and a communication device. The package substrate includes a package body, a first circuit layer, a second circuit layer, an electronic component, and a moisture-proof structure. The package body includes a top surface and a bottom surface that are oppositely disposed, the first circuit layer is disposed on the top surface of the package body, and the second circuit layer is disposed on the bottom surface of the package body. The electronic component is packaged inside the package body. The moisture-proof structure is disposed on the package body and is connected between the first circuit layer and the second circuit layer, and the moisture-proof structure surrounds the electronic component. According to technical solutions of this application, external water vapor can be prevented from entering the package substrate from a peripheral side of the package substrate, to effectively prevent moisture absorption.