公开(公告)号：US20230299018A1

公开(公告)日：2023-09-21

申请号：US18324329

申请日：2023-05-26

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Chen KANG ,  Chao SHEN ,  Xiaojing LIAO ,  Junhe WANG

IPC: H01L23/00 ,  H01L23/552 ,  H01L23/31 ,  H05K1/18 ,  H01L23/498

CPC classification number: H01L23/564 ,  H01L23/552 ,  H01L23/31 ,  H05K1/185 ,  H01L23/49822 ,  H05K2201/0206

Abstract: This application provides a package substrate and a communication device. The package substrate includes a package body, a first circuit layer, a second circuit layer, an electronic component, and a moisture-proof structure. The package body includes a top surface and a bottom surface that are oppositely disposed, the first circuit layer is disposed on the top surface of the package body, and the second circuit layer is disposed on the bottom surface of the package body. The electronic component is packaged inside the package body. The moisture-proof structure is disposed on the package body and is connected between the first circuit layer and the second circuit layer, and the moisture-proof structure surrounds the electronic component. According to technical solutions of this application, external water vapor can be prevented from entering the package substrate from a peripheral side of the package substrate, to effectively prevent moisture absorption.