公开(公告)号：US20210204392A1

公开(公告)日：2021-07-01

申请号：US17202916

申请日：2021-03-16

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Yue WEN ,  Chao WANG

IPC: H05K1/02

Abstract: A surface wave excitation device includes a transmission line disposed on a wire layer PCB, and a same quantity of layers are respectively disposed above and below the wire layer PCB. A copper wire is disposed on each layer of PCB, and the copper wire forms a closed region. Closed regions on the PCB that are respectively disposed above and below the wire layer PCB and that have a same distance from the wire layer PCB are in a same shape, and a closed region on a PCB farther away from the wire layer PCB occupies a larger area. The wire layer PCB includes first and second closed regions, the first closed region is disposed on one side of the transmission line, and the second closed region is disposed on the other side, and shapes of the first and second closed regions are mutually symmetrical with the transmission line as a symmetry axis.

公开(公告)号：US20190013643A1

公开(公告)日：2019-01-10

申请号：US16111727

申请日：2018-08-24

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Yue WEN ,  Zhiguang XU ,  Sulin YANG

IPC: H01S5/024 ,  H01S5/022 ,  G02B6/42

Abstract: An optical component packaging structure includes a base, a sealing cover, and a cooler. The base includes a mounting surface and a back surface that faces a direction opposite to that faced by the mounting surface. The cooler includes a cooling plate, a heat dissipation plate disposed opposite to the cooling plate, and a conductive connection body connecting the cooling plate and the heat dissipation plate. The cooling plate includes a cooling surface. The cooler is partially built in the base. The cooling plate faces a direction the same as the mounting surface. The sealing cover covers the mounting surface, and the sealing cover and the mounting surface form a sealing cavity. The cooling surface is located inside the sealing cavity. The heat dissipation plate protrudes from the back surface and is sealedly connected to the base.

公开(公告)号：US20190238233A1

公开(公告)日：2019-08-01

申请号：US16381096

申请日：2019-04-11

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Zhiguang XU ,  Yue WEN

IPC: H04B10/40 ,  H04B10/25 ,  H04B10/50

CPC classification number: H04B10/40 ,  G02B6/42 ,  H04B10/2504 ,  H04B10/506

Abstract: Embodiments provide an optical transceiver assembly for resolving a problem that an optical assembly has a large size. The optical transceiver assembly may include a first cavity, a second cavity and WDMs. The first cavity may include at least two optical receivers, which may be configured to receive light of different wavelengths, respectively. The second cavity may include at least two optical transmitters, may be configured to emit light of different wavelengths, respectively. Each of the at least two optical receivers and each of the at least two optical transmitters may correspond to different WDMs, respectively. The WDM corresponding to one of the at least wo optical receivers can be configured to: separate, from light emitted from an optical fiber, light of a wavelength receivable by the corresponding optical receiver, transmit the light to the corresponding optical receiver, and reflect the other wavelengths.

公开(公告)号：US20160301494A1

公开(公告)日：2016-10-13

申请号：US15187437

申请日：2016-06-20

Applicant: Huawei Technologies Co., Ltd.

Inventor： Yue WEN ,  Zhiguang XU ,  Huafeng LIN ,  Xiaoping ZHOU ,  Jing HU

IPC: H04J14/02 ,  H04B10/50 ,  G02B6/30 ,  G02B6/42 ,  G02B6/293 ,  H04B10/40 ,  H04B10/27

CPC classification number: H04J14/02 ,  G02B6/29338 ,  G02B6/29361 ,  G02B6/2938 ,  G02B6/30 ,  G02B6/4215 ,  G02B6/4246 ,  G02B6/4263 ,  G02B6/4278 ,  G02B6/428 ,  G02B6/4284 ,  G02B6/4292 ,  G02B6/4295 ,  H04B10/27 ,  H04B10/40 ,  H04B10/503 ,  H04J14/0236 ,  H04J14/0245 ,  H04J14/0249 ,  H04J14/0282

Abstract: A circuit board of the optical module comprises: a first electrical interface is configured to connect an electrical interface of a board or a second electrical interface of another optical module, and a second electrical interface is configured to connect a first electrical interface of another optical module; a first optical port is configured to connect an optical transmission device or a second optical port of another optical module, and a second optical port is configured to connect an optical receiving device or a first optical port of another optical module; and a optical transceiver assembly multiplexes downstream light and demultiplexes upstream light. The optical module provided in solutions of the present invention can be flexibly combined with another optical module, enabling flexible and gradual upgrade of an optical module bandwidth according to a user requirement by using various combination manners.

Abstract translation: 光模块的电路板包括：第一电接口被配置为连接另一光模块的电路板或第二电接口的电接口，第二电接口被配置为连接另一光模块的第一电接口 ; 第一光口被配置为连接另一光模块的光传输设备或第二光口，第二光口被配置为连接另一光模块的光接收设备或第一光端口; 并且光收发器组件复用下行光并解复用上游光。 在本发明的解决方案中提供的光模块可以灵活地与另一光模块组合，通过使用各种组合方式，可以根据用户需求灵活地逐渐升级光模块带宽。