公开(公告)号：US20210119358A1

公开(公告)日：2021-04-22

申请号：US17135736

申请日：2020-12-28

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Hong WU ,  Zhen LV

IPC: H01R12/58 ,  H01R12/70 ,  H01R43/24 ,  H01R43/02

Abstract: Methods and apparatuses to provide a pin, a pin combination structure and a package body are described. A baffle structure is sleeved on the pin. The baffle structure is used to prevent a plastic packaging material from overflowing from a cavity that accommodates the plastic packaging material. The cavity is in a mold for packaging the package body.

公开(公告)号：US20230219269A1

公开(公告)日：2023-07-13

申请号：US18183988

申请日：2023-03-15

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Fankun WU ,  Zhen LV ,  Zhaozheng HOU

IPC: B29C45/36 ,  B29C45/28 ,  B29C45/26 ,  B29C45/14

CPC classification number: B29C45/36 ,  B29C45/28 ,  B29C45/2608 ,  B29C45/14065 ,  B29C2045/14147 ,  B29L2031/34

Abstract: An injection mold and an injection molding method are provided. The injection mold includes a housing and a cover. The housing is provided with a mold cavity. The mold cavity is configured to accommodate a power module. The cover is provided with a plurality of vias. The cover is detachably connected to the housing. The cover is located in the mold cavity and locates the power module jointly with the housing. The plurality of vias are configured to match a plurality of pins of the power module. In this application, the cover is disposed, and the cover is provided with the vias for pins to pass through. By using covers with different arrangement manners of vias, a same set of injection molds can be compatible with power modules of a same series that have different locations of pins. Arrangement manners of vias on different covers are different.