公开(公告)号：US20230170269A1

公开(公告)日：2023-06-01

申请号：US18159754

申请日：2023-01-26

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Fankun WU ,  Yunfei QIAO ,  Junhe WANG

IPC: H01L23/31 ,  H01L23/498 ,  H01L23/29 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L23/3121 ,  H01L23/49811 ,  H01L23/293 ,  H01L21/565 ,  H01L24/48 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/48225 ,  H01L2224/32225 ,  H01L2224/73265

Abstract: A power module is provided. The power module includes a substrate, and the substrate is used to carry components and pins of the power module. A circuit layer is disposed on the substrate, to complete an electrical connection between the carried components. The components and the pins are disposed on a same surface of the substrate, and the components and the pins are electrically connected by using the substrate. The power module further includes a sealing layer. The sealing layer is sleeved on the pins, the pins are partially exposed on a surface that is of the sealing layer and that faces away from a plastic packaging layer, and a space for accommodating the plastic packaging layer is formed between the sealing layer and the substrate.

公开(公告)号：US20230219269A1

公开(公告)日：2023-07-13

申请号：US18183988

申请日：2023-03-15

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Fankun WU ,  Zhen LV ,  Zhaozheng HOU

IPC: B29C45/36 ,  B29C45/28 ,  B29C45/26 ,  B29C45/14

CPC classification number: B29C45/36 ,  B29C45/28 ,  B29C45/2608 ,  B29C45/14065 ,  B29C2045/14147 ,  B29L2031/34

Abstract: An injection mold and an injection molding method are provided. The injection mold includes a housing and a cover. The housing is provided with a mold cavity. The mold cavity is configured to accommodate a power module. The cover is provided with a plurality of vias. The cover is detachably connected to the housing. The cover is located in the mold cavity and locates the power module jointly with the housing. The plurality of vias are configured to match a plurality of pins of the power module. In this application, the cover is disposed, and the cover is provided with the vias for pins to pass through. By using covers with different arrangement manners of vias, a same set of injection molds can be compatible with power modules of a same series that have different locations of pins. Arrangement manners of vias on different covers are different.

公开(公告)号：US20230238315A1

公开(公告)日：2023-07-27

申请号：US18190388

申请日：2023-03-27

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Yunfei QIAO ,  Fankun WU ,  Junhe WANG

IPC: H01L23/498 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L23/49811 ,  H01L23/3121 ,  H01L21/56 ,  H01L24/48

Abstract: The technology of this application relates to a semiconductor packaged structure, including a circuit board, a chip, a pin, and a plastic package body. The pin includes a connecting part and a pressfit, one end of the connecting part is welded to the circuit board, the other end is flush with a top surface of the plastic package body, the connecting part has a mounting hole, the pressfit is disposed in the mounting hole and is in an interference fit with the connecting part, the pressfit is exposed from the top surface of the plastic package body. Alternatively, the pin includes a pressfit, the plastic package body is provided with a mounting hole that runs through a plastic package body, the pressfit is provided in the mounting hole, one end of the pressfit is welded to the circuit board, the other end is exposed from the top surface of the plastic package body.