公开(公告)号：US20230359022A1

公开(公告)日：2023-11-09

申请号：US18196686

申请日：2023-05-12

申请人： HUAWEI TECHNOLOGIES CO., LTD. ,  FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.

发明人： Frank Senger ,  Ulrich Hofmann ,  Stephan Marauska ,  Christian Janicke ,  Thomas Von Wantoch ,  Joerg Albers ,  Gunnar Wille ,  Yong Cao

IPC分类号： G02B26/10 ,  G02B26/08

CPC分类号： G02B26/101 ,  G02B26/0841 ,  G02B26/0858 ,  G02B26/085

摘要： The present disclosure provides a deflection device (100, 200, 300, 400) for use in a scanner. The deflection device (100, 200, 300, 400) includes a substrate (102, 202), a mirror (106, 206, 304, 404) and actuator means (110). The mirror (106, 206, 304, 404) arranged in a recess (104, 204, 306, 406) in the substrate (102, 202) by connector means (108) in such a way that it can rotate about at least two axes in an oscillatory manner. The actuator means (110) causes the mirror (106, 206, 304, 404) to oscillate. The actuator means (110) are arranged in one or more trenches (112A-D) in the substrate (102, 202) surrounding the recess (104, 204, 306, 406), in such a way that a change of shape of the actuator means (110) will cause a movement in the substrate (102, 202), thereby inducing oscillatory movement of the mirror (106, 206, 304, 404).

公开(公告)号：US20230359019A1

公开(公告)日：2023-11-09

申请号：US18196678

申请日：2023-05-12

申请人： HUAWEI TECHNOLOGIES CO., LTD. ,  FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.

发明人： Thomas Knieling ,  Ulrich Hofmann ,  Stephan Marauska ,  Berkan Zorlubas ,  Fabian Schwarz ,  Frank Senger ,  Yong Cao

IPC分类号： G02B26/08 ,  H03H3/007 ,  H03H9/10

CPC分类号： G02B26/0858 ,  H03H3/0073 ,  H03H9/1057

摘要： A micromechanical resonator wafer assembly includes an actuator wafer supporting an outer actuator layer. The outer actuator layer includes an oscillating part configured to be driven by an electrical drive signal. The micromechanical resonator wafer assembly further includes a device wafer mounted on top of the actuator wafer. The device wafer includes a plurality of inner actuators. Each of the inner actuators include an oscillation body configured to oscillate about one or more axes. The device wafer is physically connected to the actuator wafer such that each of the inner actuators forms with the outer actuator layer a coupled oscillation system for excitation of the oscillation body of the respective inner actuator. The micromechanical resonator wafer assembly provides external actuation of the oscillation body of each of the inner actuators by use of the outer actuator layer and hence, provides improved scan angles with fast start-up time.