RADIATION IMAGING SENSOR
    5.
    发明申请
    RADIATION IMAGING SENSOR 审中-公开
    辐射成像传感器

    公开(公告)号:US20150144795A1

    公开(公告)日:2015-05-28

    申请号:US14547581

    申请日:2014-11-19

    IPC分类号: G01J5/10 G01J5/08 G01J5/02

    摘要: The present invention relates to a radiation imaging sensor with at least one detection element, which is implemented on a substrate as a micromechanical resonator and which absorbs the radiation to be detected. The resonator is set into a resonant oscillation with an excitation device and a shift in the resonance frequency of the detection element under exposure to radiation is detected with a detection device. The radiation sensor is characterized by the fact that it comprises a scanning device with a single-axis or multi-axis tiltable scanning element. The facility to tilt the device means that the detection element can be used to detect radiation from different directions. The imaging sensor can be realized in a compact manner and be economically produced.

    摘要翻译: 本发明涉及具有至少一个检测元件的放射线成像传感器,该检测元件在作为微机械谐振器的基板上实现并且吸收待检测的辐射。 谐振器被设置为具有激励装置的谐振振荡,并且利用检测装置检测在暴露于辐射下的检测元件的谐振频率的偏移。 辐射传感器的特征在于它包括具有单轴或多轴可倾斜扫描元件的扫描装置。 倾斜设备的设备意味着检测元件可用于检测来自不同方向的辐射。 成像传感器可以以紧凑的方式实现并且经济地制造。

    METHOD FOR PRODUCING STRUCTURED OPTICAL COMPONENTS
    8.
    发明申请
    METHOD FOR PRODUCING STRUCTURED OPTICAL COMPONENTS 有权
    生产结构光学元件的方法

    公开(公告)号:US20150040368A1

    公开(公告)日:2015-02-12

    申请号:US14361392

    申请日:2012-09-28

    摘要: The method according to the invention is used for producing optical components, in particular covers for encapsulating micro-systems, wherein at least one reinforcing element, which is produced before being arranged, is arranged on a first substrate, as a result of which a stack is produced. This stack is heated after being connected to a second substrate, as a result of which the first substrate is deformed such that at least one region, covered by the reinforcing element, of the first substrate is moved and/or is inclined or the first substrate is brought into contact with the reinforcing element. In an alternative method according to the invention, the reinforcing element is arranged on the second substrate, wherein this stack is then connected to the first substrate. The first substrate is subsequently heated and deformed such that a region of the first substrate is brought into contact with the reinforcing element.

    摘要翻译: 根据本发明的方法用于制造光学部件,特别是用于封装微系统的盖,其中在布置之前产生的至少一个加强元件布置在第一基板上,结果是堆叠 生产。 该叠层在与第二基板连接之后被加热,其结果是第一基板变形使得第一基板的被增强元件覆盖的至少一个区域移动和/或倾斜,或者第一基板 与增强元件接触。 在根据本发明的替代方法中,加强元件布置在第二基板上,其中该堆叠然后连接到第一基板。 随后第一衬底被加热和变形,使得第一衬底的区域与增强元件接触。

    Radiation imaging sensor
    10.
    发明授权

    公开(公告)号:US10041837B2

    公开(公告)日:2018-08-07

    申请号:US14547581

    申请日:2014-11-19

    摘要: The present invention relates to a radiation imaging sensor with at least one detection element, which is implemented on a substrate as a micromechanical resonator and which absorbs the radiation to be detected. The resonator is set into a resonant oscillation with an excitation device and a shift in the resonance frequency of the detection element under exposure to radiation is detected with a detection device. The radiation sensor is characterized by the fact that it comprises a scanning device with a single-axis or multi-axis tiltable scanning element. The facility to tilt the device means that the detection element can be used to detect radiation from different directions. The imaging sensor can be realized in a compact manner and be economically produced.