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    Signal line driving circuit and image display device
    4.
    发明申请
    Signal line driving circuit and image display device 审中-公开

    公开(公告)号：US20060181502A1

    公开(公告)日：2006-08-17

    申请号：US11402352

    申请日：2006-04-11

    申请人： Yasushi Kubota ,  Hajime Washio ,  Kazuhiro Maeda ,  Graham Cairns ,  Michael Brownlow

    发明人： Yasushi Kubota ,  Hajime Washio ,  Kazuhiro Maeda ,  Graham Cairns ,  Michael Brownlow

    IPC分类号： G09G3/36

    CPC分类号： G09G3/3677 ,  G09G2310/0289

    摘要： A signal line driving circuit includes a shift register having a plurality of shift circuits, each of which shifts a start pulse successively to the next stage, synchronizing with the timing of a clock signal. In this signal line driving circuit, shift pulses are outputted from an AND gate based on output pulses of two adjacent shift circuits. Meanwhile, a width specifying pulse for specifying a pulse width of the shift pulse is inputted via a transistor whose ON/OFF operation is controlled by the shift pulse. A logical operation circuit operates an AND of the shift pulse and the width specifying pulse and outputs the result of operation to a signal line. When the shift pulse is non-active, the transistor becomes OFF, which causes the signal line transmitting the width specifying pulse to be disconnected from the signal line driving circuit, thereby reducing a capacitive load of wiring. As a result, reduction of a parasitic capacitance of the wiring, reduction in the number of elements, reduction in the size of an amplitude of an input signal, etc. in the signal line driving circuit are attained.

    Active matrix display
    5.
    发明授权
    Active matrix display 失效
    主动矩阵显示

    公开(公告)号：US07158109B2

    公开(公告)日：2007-01-02

    申请号：US10236033

    申请日：2002-09-04

    申请人： Graham Cairns ,  Michael Brownlow

    发明人： Graham Cairns ,  Michael Brownlow

    IPC分类号： G09G5/00

    CPC分类号： G09G3/36 ,  G09G3/3648

    摘要： An active matrix display comprises an active matrix array of pixels divided into first and second sets, the pixels 35 of the first set are refreshed in the conventional active matrix way by a first refreshing arrangement M1, 6, 7. Pixels 36 for displaying a graphical feature such as an icon overlaid on the active matrix display image have a second refreshing arrangement M2, 6, 37 to allow the icon pixels of each icon to be switched to the same state, such as maximum back or maximum white. The icon pixels 36 may also have the first refreshing arrangement M1, 6, 7 so that they can be used either as part of the active matrix for displaying arbitrary data or when selected as such, for overlaying the icon image on the arbitrary image data.

    摘要翻译： 有源矩阵显示器包括被划分为第一和第二组的像素的有源矩阵阵列，第一组的像素35通过第一刷新装置M1,6,7以常规有源矩阵方式刷新。 用于显示诸如重叠在有源矩阵显示图像上的图标的图形特征的像素36具有第二刷新装置M 2,6,37，以允许每个图标的图标像素切换到相同的状态，诸如最大背面或 最大白。 图标像素36还可以具有第一刷新装置M 1，6，7，使得它们可以用作用于显示任意数据的有源矩阵的一部分，或者当被选择时，用于将图标图像叠加在任意图像数据上 。

    Integrated MEMS packaging
    6.
    发明申请
    Integrated MEMS packaging 有权
    集成MEMS封装

    公开(公告)号：US20060148137A1

    公开(公告)日：2006-07-06

    申请号：US11178148

    申请日：2005-07-08

    申请人： John Hartzell ,  Harry Walton ,  Michael Brownlow

    发明人： John Hartzell ,  Harry Walton ,  Michael Brownlow

    IPC分类号： H01L21/84

    CPC分类号： B81C1/0023 ,  H01L27/1214

    摘要： An integrated MEMS package and associated packaging method are provided. The method includes: forming an electrical circuit, electrically connected to the first substrate; integrating a MEMS device on a first substrate region, electrically connected to the first substrate; providing a second substrate overlying the first substrate; and, forming a wall along the first region boundaries, between the first and second substrate. In one aspect, the electrical circuit is formed using thin-film processes; and, wherein integrating the MEMS device on the first substrate region includes forming the MEMS using thin-film processes, simultaneous with the formation of the electrical device. Alternately, the MEMS device is formed in a separate process, attached to the first substrate, and electrical interconnections are formed to the first substrate using thin-film processes.

    摘要翻译： 提供集成MEMS封装和相关封装方法。 该方法包括：形成电连接到第一基板的电路; 将MEMS器件集成在电连接到第一衬底的第一衬底区域上; 提供覆盖所述第一基板的第二基板; 以及沿所述第一区域边界在所述第一和第二基板之间形成壁。 在一个方面，使用薄膜工艺形成电路; 并且其中将MEMS器件集成在第一衬底区域上包括使用薄膜工艺形成MEMS，同时形成电子器件。 或者，MEMS器件以独立的工艺形成，附接到第一衬底，并且使用薄膜工艺将电互连形成到第一衬底。

    Method for integrated MEMS packaging
    7.
    发明申请
    Method for integrated MEMS packaging 有权
    集成MEMS封装的方法

    公开(公告)号：US20070099327A1

    公开(公告)日：2007-05-03

    申请号：US11640592

    申请日：2006-12-18

    申请人： John Hartzell ,  Harry Walton ,  Michael Brownlow

    发明人： John Hartzell ,  Harry Walton ,  Michael Brownlow

    IPC分类号： H01L21/00

    CPC分类号： B81C1/0023 ,  H01L27/1214

    摘要： An integrated MEMS package and associated packaging method are provided. The method includes: forming an electrical circuit, electrically connected to the first substrate; integrating a MEMS device on a first substrate region, electrically connected to the first substrate; providing a second substrate overlying the first substrate; and, forming a wall along the first region boundaries, between the first and second substrate. In one aspect, the electrical circuit is formed using thin-film processes; and, wherein integrating the MEMS device on the first substrate region includes forming the MEMS using thin-film processes, simultaneous with the formation of the electrical device. Alternately, the MEMS device is formed in a separate process, attached to the first substrate, and electrical interconnections are formed to the first substrate using thin-film processes.

    摘要翻译： 提供集成MEMS封装和相关封装方法。 该方法包括：形成电连接到第一基板的电路; 将MEMS器件集成在电连接到第一衬底的第一衬底区域上; 提供覆盖所述第一基板的第二基板; 以及沿所述第一区域边界在所述第一和第二基板之间形成壁。 在一个方面，使用薄膜工艺形成电路; 并且其中将MEMS器件集成在第一衬底区域上包括使用薄膜工艺形成MEMS，同时形成电子器件。 或者，MEMS器件以独立的工艺形成，附接到第一衬底，并且使用薄膜工艺将电互连形成到第一衬底。