公开(公告)号：US5868305A

公开(公告)日：1999-02-09

申请号：US935525

申请日：1997-09-22

申请人： Hal G. Watts, Jr. ,  Robert J. Balog ,  Gary T. Freeman

发明人： Hal G. Watts, Jr. ,  Robert J. Balog ,  Gary T. Freeman

IPC分类号： B23K3/06 ,  H05K3/34

CPC分类号： H05K3/3457 ,  B23K3/0607 ,  B23K2201/42 ,  H05K2203/013

摘要： An apparatus for depositing a selected pattern of solder onto a substrate comprising a substrate support, a solder ejector, and a gas-delivery system associated with the solder ejector. The substrate support has structure for bearing a substrate on which one or more electronic components are to be mounted. The solder ejector has a housing that defines an orifice for producing a stream of molten solder droplets along a selected trajectory relative to the substrate support to deposit molten solder onto the substrate in a selected pattern. The gas delivery system has an input for receiving pressurized inert gas and an output aligned with the directed stream of molten droplets for discharging from the orifice of the solder ejector a flow of inert gas aligned with the ejected molten solder droplets. A method for depositing a selected pattern of solder onto a substrate is also described.

摘要翻译： 一种用于将选择的焊料图案沉积到包括衬底支撑件，焊料喷射器和与焊料喷射器相关联的气体输送系统的衬底上的装置。 衬底支撑件具有用于承载要在其上安装一个或多个电子部件的衬底的结构。 焊料喷射器具有壳体，其限定出孔口，用于沿着相对于衬底支撑件的选定轨迹产生熔融焊料液流，以将选定图案中的熔融焊料沉积到衬底上。 气体输送系统具有用于接收加压惰性气体的输入和与熔融液滴的定向流对准的输出，用于从焊料喷射器的孔排出与喷出的熔融焊料液滴对准的惰性气体流。 还描述了将选择的焊料图案沉积到衬底上的方法。

公开(公告)号：US06276589B1

公开(公告)日：2001-08-21

申请号：US08724034

申请日：1996-09-23

申请人： Hal G. Watts, Jr. ,  Melissa E. Orme-Marmarelis ,  Eric Phillip Muntz ,  Gerald C. Pham-Van-Diep ,  Robert F. Smith, Jr. ,  Robert J. Balog ,  Gary T. Freeman

发明人： Hal G. Watts, Jr. ,  Melissa E. Orme-Marmarelis ,  Eric Phillip Muntz ,  Gerald C. Pham-Van-Diep ,  Robert F. Smith, Jr. ,  Robert J. Balog ,  Gary T. Freeman

IPC分类号： B23K306

CPC分类号： H05K3/3457 ,  B22F2009/0836 ,  B23K3/0607 ,  B23K3/0623 ,  B23K2101/40 ,  H05K2203/013

摘要： An apparatus for depositing a selected pattern of solder onto a substrate comprising a substrate support, a solder ejector, and an orifice defining structure. The substrate support has structure for bearing a substrate on which one or more electronic components are to be mounted. The solder ejector has a housing that defines a cavity for containing molten solder. The orifice defining structure includes a flat disk having an orifice defined therethrough for producing a stream of molten solder and a disk support structure that supports the disk around the orifice and is replaceably coupled to the cavity-defining structure. Also disclosed is an apparatus that deposits a selected pattern of solder onto a substrate and includes a substrate support, a solder ejector that directs solder droplets to desired positions on the support, and an ejector aligner that adjusts the orientation of the solder ejector in two angular dimensions to enable adjustment of the trajectory of the stream of molten solder droplets.

摘要翻译： 一种用于将选择的焊料图案沉积到包括衬底支撑件，焊料喷射器和孔口限定结构的衬底上的装置。 衬底支撑件具有用于承载要在其上安装一个或多个电子部件的衬底的结构。 焊料喷射器具有限定用于容纳熔融焊料的空腔的壳体。 孔口限定结构包括具有限定在其中的孔口的扁平盘，用于产生熔融焊料流;以及圆盘支撑结构，其支撑围绕孔口的盘，并且可更换地联接到空腔限定结构。 还公开了一种将选择的焊料图案沉积到衬底上并且包括衬底支撑件的焊接喷射器，将焊膏引导到支撑件上的期望位置的喷射器对准器，其将焊料喷射器的取向调整为两个角度 能够调节熔融焊料液滴流的轨迹的尺寸。