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公开(公告)号：US20210305588A1
公开(公告)日：2021-09-30
申请号：US17338925
申请日：2021-06-04
申请人： Haldor Topsøe A/S
发明人： Tobias Holt Nørby , Bengt Peter Gustav Blennow , Rainer Küngas , Jeppe Rass-Hansen , Thomas Heiredal-Clausen
IPC分类号： H01M8/0228 , H01M8/021 , H01M8/0215
摘要： Improved contact between interconnect and oxygen electrode material is achieved through a contact point between an electrode or a contact layer and a coated ferritic stainless steel interconnect, where the coating on the metallic interconnect comprises Cu.
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公开(公告)号：US11753700B2
公开(公告)日：2023-09-12
申请号：US16608941
申请日：2018-04-16
申请人： HALDOR TOPSØE A/S
CPC分类号： C22B15/006 , C25B1/23
摘要： The content of oxygen in molten metallic copper is reduced during the copper refining process by adding pure carbon monoxide, produced by electrolysis of carbon dioxide in a solid oxide electrolysis cell (SOEC), thereby removing oxygen through the reduction of CuO to Cu. This way, the purity of the metallic copper is increased.
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公开(公告)号：US10907254B2
公开(公告)日：2021-02-02
申请号：US16466924
申请日：2017-11-22
申请人： Haldor Topsøe A/S
发明人： Tobias Holt Nørby , Bengt Peter Gustav Blennow , Rainer Küngas , Jeppe Rass-Hansen , Thomas Heiredal-Clausen
IPC分类号： C23C28/02 , C23C18/54 , C25D5/12 , H01M8/0208 , H01M8/0228
摘要： A method for coating an interconnect for a solid oxide cell (SOC) stack comprises providing an interconnect substrate comprising Cr and Fe, coating the interconnect substrate with a first metallic layer by electrodeposition, coating the resulting structure with a second layer of metallic cobalt by electrodeposition and coating the resulting structure with a layer of metallic copper by ion-exchange plating. This way, a metallic copper-cobalt coating is formed on the interconnect.
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公开(公告)号：US11552306B2
公开(公告)日：2023-01-10
申请号：US17338925
申请日：2021-06-04
申请人： Haldor Topsøe A/S
发明人： Tobias Holt Nørby , Bengt Peter Gustav Blennow , Rainer Küngas , Jeppe Rass-Hansen , Thomas Heiredal-Clausen
IPC分类号： H01M8/0228 , H01M8/021 , H01M8/0215 , H01M8/12
摘要： Improved contact between interconnect and oxygen electrode material is achieved through a contact point between an electrode or a contact layer and a coated ferritic stainless steel interconnect, where the coating on the metallic interconnect comprises Cu.
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公开(公告)号：US20220328858A1
公开(公告)日：2022-10-13
申请号：US17640001
申请日：2020-10-07
申请人： Haldor Topsøe A/S
发明人： Rainer Küngas , Thomas Heiredal-Clausen , Bengt Peter Gustav Blennow , Tobias Holt Nørby , Jeppe Rass-Hansen
IPC分类号： H01M8/2425 , H01M8/12 , H01M8/0228 , H01M8/04089
摘要： A SOC stack has interconnects with a maximum distance between the contact points which are designed to compensate for pressure difference between one side of the interconnect to the other side.
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公开(公告)号：US11088372B2
公开(公告)日：2021-08-10
申请号：US16466946
申请日：2017-12-01
申请人： Haldor Topsøe A/S
发明人： Tobias Holt Nørby , Bengt Peter Gustav Blennow , Rainer Küngas , Jeppe Rass-Hansen , Thomas Heiredal-Clausen
IPC分类号： H01M4/64 , H01M8/0228 , H01M8/021 , H01M8/0215 , H01M8/124
摘要： Improved contact between interconnect and oxygen electrode material in solid oxide cell (SOC) stacks is achieved through a contact point between the oxygen electrode or an oxygen-side contact layer of the SOC and a coated ferritic stainless steel interconnect in the SOC stack, where the coating on the metallic interconnect comprises Cu.
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公开(公告)号：US20190330751A1
公开(公告)日：2019-10-31
申请号：US16310254
申请日：2017-06-08
申请人： HALDOR TOPSØE A/S
发明人： Bengt Peter Gustav Blennow , Thomas Heiredal-Clausen , Tobias Holt Nørby , Rainer Küngas , Jeppe Rass-Hansen , Theis Løye Skafte
摘要： A Solid Oxide Electrolysis System has electrolytes with increased Area Specific Resistance, ASR yet is thin as compared to known electrolytes in the field, to obtain heating of the endothermic reducing process performed in the electrolysis cells directly where it is needed without any extra heating appliances or integrated heating elements, a simple efficient solution which does not increase the volume of the stack.
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