公开(公告)号：US10686439B2

公开(公告)日：2020-06-16

申请号：US16192949

申请日：2018-11-16

Applicant: Hamilton Sundstrand Corporation

Inventor： Fabien Dubois ,  Karthik Debbadi

IPC: H02M1/088 ,  H03K17/284 ,  H02M1/08 ,  H01L29/78

Abstract: A method of controlling a power converter having a plurality of parallel-connected switching devices, the method comprising: measuring a threshold voltage of each of the parallel switching devices at start up of the parallel power converter in an initial self-calibration process; and determining synchronization of a time at which the threshold voltages of the respective switching devices occur.

公开(公告)号：US12255121B2

公开(公告)日：2025-03-18

申请号：US17883960

申请日：2022-08-09

Applicant: Hamilton Sundstrand Corporation

Inventor： Sebastian Pedro Rosado ,  Karthik Debbadi

IPC: H01L23/473 ,  H01L23/367

Abstract: A power switch module includes a semiconductor die and a conductive busbar. The semiconductor die is electrically conductively mounted to the busbar. The module also includes a dielectric coolant fluid and the busbar and the semiconductor die mounted thereto are immersed in the dielectric coolant fluid. The module can be include in a power converter assembly.

公开(公告)号：US11935807B2

公开(公告)日：2024-03-19

申请号：US17542645

申请日：2021-12-06

Applicant: Hamilton Sundstrand Corporation

Inventor： Karthik Debbadi ,  Sebastian Rosado ,  Jeffrey Ewanchuk

IPC: H01L23/367 ,  H01L21/48 ,  H01L23/00 ,  H01L23/498 ,  H01L25/00 ,  H01L25/065

CPC classification number: H01L23/367 ,  H01L21/4857 ,  H01L23/49822 ,  H01L24/40 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/40225 ,  H01L2224/40245 ,  H01L2924/09701

Abstract: A semiconductor device package includes a multilayer substrate including atop layer, a bottom layer and an intermediate layer between the top layer and the bottom layer. The package also includes one or more semiconductor dies embedded in the intermediate layer and conductive connector means to provide a conductive connection from the one or more dies. The conductive connector means extend through the top layer to provide connection means for one or more devices mounted on or adjacent the top layer.