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公开(公告)号：US12095368B2
公开(公告)日：2024-09-17
申请号：US17339594
申请日：2021-06-04
Applicant: Hamilton Sundstrand Corporation
Inventor： Suman Dwari , Brian St. Rock , Jeffrey Ewanchuk
IPC: H02M3/158 , H01L21/768 , H01L27/06
CPC classification number: H02M3/158 , H01L21/768 , H01L27/0688
Abstract: A power converter includes an amplifier, an inductor, a capacitor, and an interconnection block formed of an insulating material having conductive material deposited thereon by a multi-material printing process. The interconnection block supports one of the inductor and the capacitor in a manner that the one the inductor and the capacitor is disposed vertically above an other of the inductor and the capacitor.
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公开(公告)号：US11935807B2
公开(公告)日：2024-03-19
申请号：US17542645
申请日：2021-12-06
Applicant: Hamilton Sundstrand Corporation
Inventor： Karthik Debbadi , Sebastian Rosado , Jeffrey Ewanchuk
IPC: H01L23/367 , H01L21/48 , H01L23/00 , H01L23/498 , H01L25/00 , H01L25/065
CPC classification number: H01L23/367 , H01L21/4857 , H01L23/49822 , H01L24/40 , H01L25/0655 , H01L25/50 , H01L2224/40225 , H01L2224/40245 , H01L2924/09701
Abstract: A semiconductor device package includes a multilayer substrate including atop layer, a bottom layer and an intermediate layer between the top layer and the bottom layer. The package also includes one or more semiconductor dies embedded in the intermediate layer and conductive connector means to provide a conductive connection from the one or more dies. The conductive connector means extend through the top layer to provide connection means for one or more devices mounted on or adjacent the top layer.
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公开(公告)号：US12063763B2
公开(公告)日：2024-08-13
申请号：US17474802
申请日：2021-09-14
Applicant: Hamilton Sundstrand Corporation
Inventor： Jeffrey Ewanchuk , Kimberly Rae Saviers , Ram Ranjan , Ross Wilcoxon , Haley Steffen
IPC: H05K7/20 , H01L23/427 , H01L23/473
CPC classification number: H05K7/20936 , H05K7/209 , H01L23/427 , H01L23/473 , H05K7/20254 , H05K7/20336 , H05K7/20927
Abstract: A system for cooling a power component includes a first metal layer. A cooling layer having a first surface is in contact with a surface of the first metal layer. A second metal layer is included having a surface in contact with a second surface of the cooling layer opposite the first metal layer. The cooling layer is of a material different from that of the first metal layer and that of the second metal layer. A plurality of cooling features are embedded in the material of the cooling layer. The cooling channels are spaced apart from both the first metal layer and the second metal layer by the material of the cooling layer. An electrically conductive path connects the first metal plate to the second metal plate.
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公开(公告)号：US11424692B2
公开(公告)日：2022-08-23
申请号：US17132244
申请日：2020-12-23
Applicant: Hamilton Sundstrand Corporation
Inventor： Suman Dwari , Brian St. Rock , Jeffrey Ewanchuk
Abstract: System and methods for power conversion are provided. Aspects include a first switching module comprising a first set of switches, wherein the first set of switches comprise wide-bandgap devices having a first bandgap, a second switching module comprising a second set of switches, wherein the second set of switches comprise semiconductor devices having a second bandgap, and wherein the first bandgap is larger than the second bandgap, an alternating current (AC) power source connected to the first switching module and the second switching module, a first capacitor bank, a second capacitor bank, and a controller configured to operate the first switching module and the second switching module to create a first direct current (DC) voltage across the first capacitor bank and a second direct current (DC) voltage across the second capacitor bank.
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公开(公告)号：US20240243567A1
公开(公告)日：2024-07-18
申请号：US18097124
申请日：2023-01-13
Applicant: Hamilton Sundstrand Corporation
Inventor： Jeffrey Ewanchuk , Baljit Riar , Xin Wu
CPC classification number: H02H3/10 , H02H1/0007
Abstract: A method of open-loop fault control of a solid state circuit breaker includes the steps of populating a lookup table with predetermined current and temperature values and corresponding interrupt times, measuring a temperature of the solid state circuit breaker, measuring an electrical current passing through the solid state circuit breaker, estimating interrupt time from the lookup table based on the measured temperature and current values, determining to initiate a shutoff of the solid state circuit breaker based on the estimated interrupt time, and initiating a shutoff process of the solid state circuit breaker.
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Patent Agency Ranking
公开(公告)号：US20230077598A1
公开(公告)日：2023-03-16
申请号：US17474802
申请日：2021-09-14
Applicant: Hamilton Sundstrand Corporation
Inventor： Jeffrey Ewanchuk , Kimberly Rae Saviers , Ram Ranjan , Ross Wilcoxon , Haley Steffen
IPC: H05K7/20
Abstract: A system for cooling a power component includes a first metal layer. A cooling layer having a first surface is in contact with a surface of the first metal layer. A second metal layer is included having a surface in contact with a second surface of the cooling layer opposite the first metal layer. The cooling layer is of a material different from that of the first metal layer and that of the second metal layer. A plurality of cooling features are embedded in the material of the cooling layer. The cooling channels are spaced apart from both the first metal layer and the second metal layer by the material of the cooling layer. An electrically conductive path connects the first metal plate to the second metal plate.
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公开(公告)号：US20230378724A1
公开(公告)日：2023-11-23
申请号：US17750934
申请日：2022-05-23
Applicant: Hamilton Sundstrand Corporation
Inventor： Chi Zhang , Jeffrey Ewanchuk
Abstract: A power converter includes a field graded substrate, a plurality of power device dies attached to the field graded substrate, a polymer layer on the field graded substrate, one or more conductors over the polymer layer, and a plurality of power conditioning components mounted on the field graded substrate to form a power converter circuit. The field graded substrate includes a first conductor layer, a graded layer that blends conductor and insulator material, and a second conductor layer, the graded layer having an insulator core.
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公开(公告)号：US20220393590A1
公开(公告)日：2022-12-08
申请号：US17339594
申请日：2021-06-04
Applicant: Hamilton Sundstrand Corporation
Inventor： Suman Dwari , Brian St. Rock , Jeffrey Ewanchuk
IPC: H02M3/158 , H01L27/06 , H01L21/768
Abstract: A power converter includes an amplifier, an inductor, a capacitor, and an interconnection block formed of an insulating material having conductive material deposited thereon by a multi-material printing process. The interconnection block supports one of the inductor and the capacitor in a manner that the one the inductor and the capacitor is disposed vertically above an other of the inductor and the capacitor.
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公开(公告)号：US12176687B2
公开(公告)日：2024-12-24
申请号：US17750934
申请日：2022-05-23
Applicant: Hamilton Sundstrand Corporation
Inventor： Chi Zhang , Jeffrey Ewanchuk
Abstract: A power converter includes a field graded substrate, a plurality of power device dies attached to the field graded substrate, a polymer layer on the field graded substrate, one or more conductors over the polymer layer, and a plurality of power conditioning components mounted on the field graded substrate to form a power converter circuit. The field graded substrate includes a first conductor layer, a graded layer that blends conductor and insulator material, and a second conductor layer, the graded layer having an insulator core.
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公开(公告)号：US20220200473A1
公开(公告)日：2022-06-23
申请号：US17132244
申请日：2020-12-23
Applicant: Hamilton Sundstrand Corporation
Inventor： Suman Dwari , Brian St. Rock , Jeffrey Ewanchuk
IPC: H02M7/217
Abstract: System and methods for power conversion are provided. Aspects include a first switching module comprising a first set of switches, wherein the first set of switches comprise wide-bandgap devices having a first bandgap, a second switching module comprising a second set of switches, wherein the second set of switches comprise semiconductor devices having a second bandgap, and wherein the first bandgap is larger than the second bandgap, an alternating current (AC) power source connected to the first switching module and the second switching module, a first capacitor bank, a second capacitor bank, and a controller configured to operate the first switching module and the second switching module to create a first direct current (DC) voltage across the first capacitor bank and a second direct current (DC) voltage across the second capacitor bank.
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